JPH0292924U - - Google Patents
Info
- Publication number
- JPH0292924U JPH0292924U JP225089U JP225089U JPH0292924U JP H0292924 U JPH0292924 U JP H0292924U JP 225089 U JP225089 U JP 225089U JP 225089 U JP225089 U JP 225089U JP H0292924 U JPH0292924 U JP H0292924U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- wafer
- boat
- fitting groove
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009792 diffusion process Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP225089U JPH0292924U (en:Method) | 1989-01-11 | 1989-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP225089U JPH0292924U (en:Method) | 1989-01-11 | 1989-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292924U true JPH0292924U (en:Method) | 1990-07-24 |
Family
ID=31202856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP225089U Pending JPH0292924U (en:Method) | 1989-01-11 | 1989-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292924U (en:Method) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6127626A (ja) * | 1984-07-18 | 1986-02-07 | Deisuko Saiyaa Japan:Kk | 半導体ウエハの熱処理方法及びこれに使用するウエハ支持具 |
-
1989
- 1989-01-11 JP JP225089U patent/JPH0292924U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6127626A (ja) * | 1984-07-18 | 1986-02-07 | Deisuko Saiyaa Japan:Kk | 半導体ウエハの熱処理方法及びこれに使用するウエハ支持具 |