JPH0292924U - - Google Patents

Info

Publication number
JPH0292924U
JPH0292924U JP225089U JP225089U JPH0292924U JP H0292924 U JPH0292924 U JP H0292924U JP 225089 U JP225089 U JP 225089U JP 225089 U JP225089 U JP 225089U JP H0292924 U JPH0292924 U JP H0292924U
Authority
JP
Japan
Prior art keywords
casing
wafer
boat
fitting groove
supports
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP225089U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP225089U priority Critical patent/JPH0292924U/ja
Publication of JPH0292924U publication Critical patent/JPH0292924U/ja
Pending legal-status Critical Current

Links

JP225089U 1989-01-11 1989-01-11 Pending JPH0292924U (US06420036-20020716-C00037.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP225089U JPH0292924U (US06420036-20020716-C00037.png) 1989-01-11 1989-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP225089U JPH0292924U (US06420036-20020716-C00037.png) 1989-01-11 1989-01-11

Publications (1)

Publication Number Publication Date
JPH0292924U true JPH0292924U (US06420036-20020716-C00037.png) 1990-07-24

Family

ID=31202856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP225089U Pending JPH0292924U (US06420036-20020716-C00037.png) 1989-01-11 1989-01-11

Country Status (1)

Country Link
JP (1) JPH0292924U (US06420036-20020716-C00037.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6127626A (ja) * 1984-07-18 1986-02-07 Deisuko Saiyaa Japan:Kk 半導体ウエハの熱処理方法及びこれに使用するウエハ支持具

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6127626A (ja) * 1984-07-18 1986-02-07 Deisuko Saiyaa Japan:Kk 半導体ウエハの熱処理方法及びこれに使用するウエハ支持具

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