JPH0289880U - - Google Patents

Info

Publication number

JPH0289880U

JPH0289880U JP16976588U JP16976588U JPH0289880U JP H0289880 U JPH0289880 U JP H0289880U JP 16976588 U JP16976588 U JP 16976588U JP 16976588 U JP16976588 U JP 16976588U JP H0289880 U JPH0289880 U JP H0289880U

Authority

JP

Japan

Prior art keywords

layer

base material

circuit pattern

insulating layer

copper foil

Prior art date

1988-12-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
• 229910052802 copper Inorganic materials 0.000 claims description 3
• 239000010949 copper Substances 0.000 claims description 3
• 239000011889 copper foil Substances 0.000 claims description 3
• 239000000463 material Substances 0.000 claims description 3
• 238000010586 diagram Methods 0.000 description 4
• 238000007689 inspection Methods 0.000 description 2
• 238000000034 method Methods 0.000 description 2