JPH0289847U - - Google Patents

Info

Publication number

JPH0289847U

JPH0289847U JP17052688U JP17052688U JPH0289847U JP H0289847 U JPH0289847 U JP H0289847U JP 17052688 U JP17052688 U JP 17052688U JP 17052688 U JP17052688 U JP 17052688U JP H0289847 U JPH0289847 U JP H0289847U

Authority

JP

Japan

Prior art keywords

lead

land

base

electronic component

semiconductor device

Prior art date

1988-12-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 6
• 239000011347 resin Substances 0.000 claims description 4
• 229920005989 resin Polymers 0.000 claims description 4
• 239000000463 material Substances 0.000 claims description 3
• 239000008188 pellet Substances 0.000 claims 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1