JPH0282541A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPH0282541A
JPH0282541A JP63234218A JP23421888A JPH0282541A JP H0282541 A JPH0282541 A JP H0282541A JP 63234218 A JP63234218 A JP 63234218A JP 23421888 A JP23421888 A JP 23421888A JP H0282541 A JPH0282541 A JP H0282541A
Authority
JP
Japan
Prior art keywords
wire
pellet
bonded
lead
inner section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63234218A
Other languages
Japanese (ja)
Inventor
Kazuo Hatori
Isao Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63234218A priority Critical patent/JPH0282541A/en
Publication of JPH0282541A publication Critical patent/JPH0282541A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554External layer
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    • H01L2224/487Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Abstract

PURPOSE: To enable bonding of wire material with good bondability to an inner section of a lead consisting of copper material even at a low temperature which can avoid fusion of a solder coating by using an aluminum material as a material to form a wire.
CONSTITUTION: A silicon semiconductor pellet 12, a plurality of leads 9 arranged around the pellet, a wire 13 whose both ends are bonded to each bonding and 12a of the pellet and an inner section 9a of each lead 9 for bridging, and a package 14 for resin sealing are provided. A group of leads 9 are formed by using a copper material and a wire 13 is formed by using an aluminum material. One end of the wire is bonded to an electrode of the pellet through ball bonding. The other end is bonded to a base material surface which consists of copper material in an inner section of each lead.
COPYRIGHT: (C)1990,JPO&Japio
JP63234218A 1988-09-19 1988-09-19 Semiconductor device and manufacture thereof Pending JPH0282541A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63234218A JPH0282541A (en) 1988-09-19 1988-09-19 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63234218A JPH0282541A (en) 1988-09-19 1988-09-19 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH0282541A true JPH0282541A (en) 1990-03-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP63234218A Pending JPH0282541A (en) 1988-09-19 1988-09-19 Semiconductor device and manufacture thereof

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Country Link
JP (1) JPH0282541A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834832A (en) * 1994-06-09 1998-11-10 Samsung Electronics Co., Ltd. Packing structure of semiconductor packages
WO2015181888A1 (en) * 2014-05-27 2015-12-03 三菱電機株式会社 Semiconductor device and production method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834832A (en) * 1994-06-09 1998-11-10 Samsung Electronics Co., Ltd. Packing structure of semiconductor packages
WO2015181888A1 (en) * 2014-05-27 2015-12-03 三菱電機株式会社 Semiconductor device and production method therefor

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