JPH0270400U - - Google Patents

Info

Publication number

JPH0270400U

JPH0270400U JP14954288U JP14954288U JPH0270400U JP H0270400 U JPH0270400 U JP H0270400U JP 14954288 U JP14954288 U JP 14954288U JP 14954288 U JP14954288 U JP 14954288U JP H0270400 U JPH0270400 U JP H0270400U

Authority

JP

Japan

Prior art keywords

copper plating

thin copper

plating layer

cavity

layer

Prior art date

1988-11-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 229910052802 copper Inorganic materials 0.000 claims description 4
• 239000010949 copper Substances 0.000 claims description 4
• 230000001133 acceleration Effects 0.000 claims description 3
• 239000002245 particle Substances 0.000 claims description 3
• 238000007747 plating Methods 0.000 claims description 3
• 125000006850 spacer group Chemical group 0.000 claims description 2
• 239000007921 spray Substances 0.000 description 3
• 238000010586 diagram Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1