JPH0268446U - - Google Patents

Info

Publication number

JPH0268446U

JPH0268446U JP14864588U JP14864588U JPH0268446U JP H0268446 U JPH0268446 U JP H0268446U JP 14864588 U JP14864588 U JP 14864588U JP 14864588 U JP14864588 U JP 14864588U JP H0268446 U JPH0268446 U JP H0268446U

Authority

JP

Japan

Prior art keywords

package

mounted semiconductor

mount

packaging

making

Prior art date

1988-11-14

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 3
• 238000004806 packaging method and process Methods 0.000 claims 1
• 239000000919 ceramic Substances 0.000 description 2
• 238000005476 soldering Methods 0.000 description 1

Cited By (1)