JPH0268172A - Preparation of embossed molded product - Google Patents

Preparation of embossed molded product

Info

Publication number
JPH0268172A
JPH0268172A JP21755388A JP21755388A JPH0268172A JP H0268172 A JPH0268172 A JP H0268172A JP 21755388 A JP21755388 A JP 21755388A JP 21755388 A JP21755388 A JP 21755388A JP H0268172 A JPH0268172 A JP H0268172A
Authority
JP
Japan
Prior art keywords
molded product
top layer
preparation
kinds
arbitrary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21755388A
Other languages
Japanese (ja)
Inventor
Kentaro Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP21755388A priority Critical patent/JPH0268172A/en
Publication of JPH0268172A publication Critical patent/JPH0268172A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To form an embossing pattern having an arbitrary size by forming a top layer wherein two kinds of resins different in surface tension are provided at separate places to the surface of a molded product and painting said top layer to form overcoat layers partially.
CONSTITUTION: A top layer 2 wherein at least two kinds of resins having different surface tensions or solubility parameters are provided at separate places is formed to the surface of a molded product 8 using a transfer material 6. Subsequently, the top layer 2 is painted to form overcoat layers 5 partially. As a result, embossing patterns having arbitrary sizes, shapes and thicknesses can be strongly formed to the surface of the molded product at arbitrary positions in low cost.
COPYRIGHT: (C)1990,JPO&Japio
JP21755388A 1988-08-31 1988-08-31 Preparation of embossed molded product Pending JPH0268172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21755388A JPH0268172A (en) 1988-08-31 1988-08-31 Preparation of embossed molded product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21755388A JPH0268172A (en) 1988-08-31 1988-08-31 Preparation of embossed molded product

Publications (1)

Publication Number Publication Date
JPH0268172A true JPH0268172A (en) 1990-03-07

Family

ID=16706064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21755388A Pending JPH0268172A (en) 1988-08-31 1988-08-31 Preparation of embossed molded product

Country Status (1)

Country Link
JP (1) JPH0268172A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144388A (en) * 1990-03-07 1992-09-01 Kabushiki Kaisha Toshiba Semiconductor device having a plurality of fets formed in an element area
KR20190070224A (en) * 2017-12-12 2019-06-20 정민호 Transcription film capable of exposing pattern by friction peeling and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58188687A (en) * 1982-04-30 1983-11-04 Toppan Printing Co Ltd Preparation of decorative board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58188687A (en) * 1982-04-30 1983-11-04 Toppan Printing Co Ltd Preparation of decorative board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144388A (en) * 1990-03-07 1992-09-01 Kabushiki Kaisha Toshiba Semiconductor device having a plurality of fets formed in an element area
KR20190070224A (en) * 2017-12-12 2019-06-20 정민호 Transcription film capable of exposing pattern by friction peeling and manufacturing method thereof

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