JPH0262774U - - Google Patents

Info

Publication number

JPH0262774U

JPH0262774U JP14229388U JP14229388U JPH0262774U JP H0262774 U JPH0262774 U JP H0262774U JP 14229388 U JP14229388 U JP 14229388U JP 14229388 U JP14229388 U JP 14229388U JP H0262774 U JPH0262774 U JP H0262774U

Authority

JP

Japan

Prior art keywords

conductor layer

board

wiring board

electronic components

solder mask

Prior art date

1988-10-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 5
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 238000005476 soldering Methods 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 238000000034 method Methods 0.000 description 1

Cited By (2)