JPH0260243U - - Google Patents

Info

Publication number
JPH0260243U
JPH0260243U JP13953088U JP13953088U JPH0260243U JP H0260243 U JPH0260243 U JP H0260243U JP 13953088 U JP13953088 U JP 13953088U JP 13953088 U JP13953088 U JP 13953088U JP H0260243 U JPH0260243 U JP H0260243U
Authority
JP
Japan
Prior art keywords
reference hole
metal plate
package
center
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13953088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH069510Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13953088U priority Critical patent/JPH069510Y2/ja
Publication of JPH0260243U publication Critical patent/JPH0260243U/ja
Application granted granted Critical
Publication of JPH069510Y2 publication Critical patent/JPH069510Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
JP13953088U 1988-10-26 1988-10-26 基準孔付半導体素子用パッケージ Expired - Lifetime JPH069510Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13953088U JPH069510Y2 (ja) 1988-10-26 1988-10-26 基準孔付半導体素子用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13953088U JPH069510Y2 (ja) 1988-10-26 1988-10-26 基準孔付半導体素子用パッケージ

Publications (2)

Publication Number Publication Date
JPH0260243U true JPH0260243U (US07943777-20110517-C00090.png) 1990-05-02
JPH069510Y2 JPH069510Y2 (ja) 1994-03-09

Family

ID=31402875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13953088U Expired - Lifetime JPH069510Y2 (ja) 1988-10-26 1988-10-26 基準孔付半導体素子用パッケージ

Country Status (1)

Country Link
JP (1) JPH069510Y2 (US07943777-20110517-C00090.png)

Also Published As

Publication number Publication date
JPH069510Y2 (ja) 1994-03-09

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