JPH0257338B2 - - Google Patents

Info

Publication number
JPH0257338B2
JPH0257338B2 JP60025602A JP2560285A JPH0257338B2 JP H0257338 B2 JPH0257338 B2 JP H0257338B2 JP 60025602 A JP60025602 A JP 60025602A JP 2560285 A JP2560285 A JP 2560285A JP H0257338 B2 JPH0257338 B2 JP H0257338B2
Authority
JP
Japan
Prior art keywords
etching
wafer
floating
tank
rotating body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60025602A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61216330A (ja
Inventor
Eiichi Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60025602A priority Critical patent/JPS61216330A/ja
Publication of JPS61216330A publication Critical patent/JPS61216330A/ja
Publication of JPH0257338B2 publication Critical patent/JPH0257338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP60025602A 1985-02-13 1985-02-13 半導体装置のエツチング装置 Granted JPS61216330A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60025602A JPS61216330A (ja) 1985-02-13 1985-02-13 半導体装置のエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60025602A JPS61216330A (ja) 1985-02-13 1985-02-13 半導体装置のエツチング装置

Publications (2)

Publication Number Publication Date
JPS61216330A JPS61216330A (ja) 1986-09-26
JPH0257338B2 true JPH0257338B2 (https=) 1990-12-04

Family

ID=12170456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60025602A Granted JPS61216330A (ja) 1985-02-13 1985-02-13 半導体装置のエツチング装置

Country Status (1)

Country Link
JP (1) JPS61216330A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001027986A1 (de) * 1999-10-13 2001-04-19 Gebrüder Decker GmbH & Co. KG Verfahren und vorrichtung zur oberflächen-behandlung von gegenständen
JP5109376B2 (ja) * 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体

Also Published As

Publication number Publication date
JPS61216330A (ja) 1986-09-26

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