JPH0256458U - - Google Patents
Info
- Publication number
- JPH0256458U JPH0256458U JP1988135716U JP13571688U JPH0256458U JP H0256458 U JPH0256458 U JP H0256458U JP 1988135716 U JP1988135716 U JP 1988135716U JP 13571688 U JP13571688 U JP 13571688U JP H0256458 U JPH0256458 U JP H0256458U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- utility
- scope
- constant voltage
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135716U JPH0256458U (US06277897-20010821-C00009.png) | 1988-10-17 | 1988-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135716U JPH0256458U (US06277897-20010821-C00009.png) | 1988-10-17 | 1988-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256458U true JPH0256458U (US06277897-20010821-C00009.png) | 1990-04-24 |
Family
ID=31395592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988135716U Pending JPH0256458U (US06277897-20010821-C00009.png) | 1988-10-17 | 1988-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256458U (US06277897-20010821-C00009.png) |
-
1988
- 1988-10-17 JP JP1988135716U patent/JPH0256458U/ja active Pending
