JPH0254239U - - Google Patents
Info
- Publication number
- JPH0254239U JPH0254239U JP1988133371U JP13337188U JPH0254239U JP H0254239 U JPH0254239 U JP H0254239U JP 1988133371 U JP1988133371 U JP 1988133371U JP 13337188 U JP13337188 U JP 13337188U JP H0254239 U JPH0254239 U JP H0254239U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- substrate
- resin
- side edge
- sealing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988133371U JPH0254239U (US06653308-20031125-C00199.png) | 1988-10-14 | 1988-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988133371U JPH0254239U (US06653308-20031125-C00199.png) | 1988-10-14 | 1988-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254239U true JPH0254239U (US06653308-20031125-C00199.png) | 1990-04-19 |
Family
ID=31391169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988133371U Pending JPH0254239U (US06653308-20031125-C00199.png) | 1988-10-14 | 1988-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254239U (US06653308-20031125-C00199.png) |
-
1988
- 1988-10-14 JP JP1988133371U patent/JPH0254239U/ja active Pending
