JPH024892A - Adherent material to be bonded and bonding - Google Patents

Abstract

PURPOSE:To obtain an adherent material to be bonded especially suitable for bonding of very small spots by setting a bondable resin layer on an electconductive substrate by electrophoresis. CONSTITUTION:A resin such as acrylic, epoxy, polyester, polyamide, polyurethane, PE or polyacrylic acid resin is diluted with desalted water into 1-50% solution to give an electrophoresis solution. A substrate is placed on an anode based on a counter electrode in the solution in the case of an anionic system and on a cathode in the case of a cationic system and applied voltage and time are controlled by using DC electric source to form a bonding layer having desired film thickness. An excellent bonding layer having 1-30mum thickness is usually formed at 20-200V applied voltage, 0.5-3A/dm<2> current density for 10-180 seconds treatment time. After washing with water, the material to be bonded is predried at about 50-60 deg.C for about 5 minutes, another material to be bonded is stuck to a given position of the material and redried at 80-200 deg.C by a furnace for about 10-30 minutes to bond both the materials completely.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for forming an electrophoretic film used in painting, etc., and particularly to a method for forming an adhesive layer suitable for adhesion in minute areas.

The present invention also relates to an adhesive having this adhesive layer and an adhesive method using the same.

[Conventional technology 1] Conventionally, methods for forming adhesive layers include spraying, brush coating, spatula coating, spraying, dipping, spin-coding, and bar-coding methods using organic solvent-based or water-soluble adhesives. For solid adhesives such as hot melt adhesives, there are melt coating methods (applicator) and the like.

[Problem to be solved by the invention]

However, in the conventional method, the adhesive layer is thick and lacks uniformity, resulting in poor adhesion accuracy and quality problems.

In particular, when forming an adhesive layer on minute spots, there is no method suitable for adhesion on minute spots because adhesive extrusion and uneven coating occur.

[Means to solve the problem]

The present invention aims to solve the above-mentioned problems and provide a construction method and an adhesive adherend material suitable for bonding small areas.

That is, according to the present invention, an adhesive adherend is obtained by providing an adhesive layer on a conductive substrate by electrophoresis in a liquid containing an adhesive resin that can be electrodeposited, and this is applied to other adherends. Attach to the material. By doing so, a uniform and thin adhesive layer without adhesive extrusion can be obtained, and a highly accurate and high quality adhesive method can be realized.

Representative examples of electrodepositable resins preferably employed in the present invention include acrylic resins, epoxy resins, polyester resins, polyamide resins, polyurethane resins, polyethylene resins, and polyacrylic acid resins. It is based on a resin commonly used in, etc.

In the electrophoresis method, the above-mentioned resin is diluted to 1 to 50% with demineralized water as an electrophoresis solution, and the substrate is placed in this solution as the positive electrode for anionic systems and the negative electrode for cationic systems, and a DC power source is turned on. A desired adhesive M thickness is provided by adjusting the applied voltage and time.

Usually applied voltage is 20-200V, current density is 05-3A/
dm”, processing time 10-1808eC, 1-30μ
An adhesive layer of a preferred thickness of m is obtained.

The pH of the electrophoresis solution is 80-10 for anionic systems, O
, 4 to 7 for cationic systems, and a suitable bath temperature of 15 to 30°C.

Next, after washing with water, pre-dry it at about 50-60°C for about 5 minutes, then paste another adherend in place and dry it again at 80-20°C.
Complete adhesion is completed in a drying oven at 0°C for about 10 to 30 minutes.

As a result of the above, a highly reliable and high quality adhesive method is possible.

[Example] The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to these Examples.

Example 1 As an electrophoresis liquid, 60 parts of polyester resin (manufactured by Dainippon Ink Chemical Co., Ltd.) FINETEX ES-525 and 40 parts of FrNETEX525 were mixed, and then crosslinking agent/catalyst (manufactured by Dainippon Ink Chemical Co., Ltd.) PERMAST
AT CR-5/CatPA-20 was added to the resin at a ratio of 5:2.5 and stirred with a magnetic stirrer for 7
The resin was dispersed over time and diluted to 15% as a resin content using demineralized water.

The board is brass material +00x 50X O, ltmm
A sample of this size was used and subjected to conventional pretreatments such as triethane degreasing and alkali cleaner degreasing.

This substrate was used as the positive electrode, a stainless steel plate was used as the opposite bridge, and the bath temperature was 2.
Electrophoresis was performed for 1 minute at 0 to 25°C and a voltage of 50 V.
A 2 μm adhesive layer was formed on the substrate.

This was preheated in an oven at 50° C. for 5 minutes, and then this substrate and another substrate on which no adhesive layer was formed were bonded together, and the bonding was completed by heating at 150° C. for 10 minutes.

The peel strength of this example was 3 to 5 kg/Cm, and good adhesion was achieved.

Example 2 As an electrophoresis liquid, 70 parts of polyester resin (manufactured by Inu Nippon Ink Chemical Co., Ltd.) FINETEX ES-525+ was used.

FINETEX ES-675: Mix 30 parts and add the following crosslinking agent/catalyst (manufactured by Dainippon Ink Chemical Co., Ltd.) BECK
AMINE PM-N/Cat ES-2 was added to the resin at a ratio of 6=3, dispersed for 7 hours using a magnetic star, and diluted to 20% resin content using demineralized water.

As a board, brass material 100x 50x O, ltmm
The size of the sample was degreased with triethane, degreased with alkali cleaner, then alkaline electrolytically degreased, washed with water, and then plated with 5 μm of nickel.

Using this substrate as the positive electrode and a stainless steel plate as the counter electrode, the bath temperature was 2.
Electrophoresis was performed for 1 minute at 0 to 25° C. and a voltage of 120 μm to form a 10 μm adhesive layer on the substrate.

This was preheated at 50°C for 5 minutes, and then this substrate and
Attach it to another substrate that does not have an adhesive layer,
Adhesion was completed by heating at 100° C. for 20 minutes.

The peel strength of this example was 4 to 6 kg/cm, and good adhesion was achieved.

[Effects of the Invention] As explained above, according to the present invention, an adhesive adherend having a uniform and thin adhesive layer can be obtained, and a highly accurate and high quality adhesive method can be realized.

Patent applicant: Canon Co., Ltd. Representative Patent Attorney Tadashi Kukai

Claims (1)

[Scope of Claims] 1) An adhesive adherend comprising an adhesive layer made of an adhesive resin and formed by electrophoresis. 2) An adhesive method characterized by performing electrophoresis in a liquid containing an adhesive resin that can be electrodeposited onto a conductive substrate.