JPH0245670U - - Google Patents

Info

Publication number

JPH0245670U

JPH0245670U JP12455988U JP12455988U JPH0245670U JP H0245670 U JPH0245670 U JP H0245670U JP 12455988 U JP12455988 U JP 12455988U JP 12455988 U JP12455988 U JP 12455988U JP H0245670 U JPH0245670 U JP H0245670U

Authority

JP

Japan

Prior art keywords

metal wiring

thick film

circuit board

insulating coating

film metal

Prior art date

1988-09-22

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002184 metal Substances 0.000 claims description 5
• 239000011248 coating agent Substances 0.000 claims description 3
• 238000000576 coating method Methods 0.000 claims description 3
• 229910000679 solder Inorganic materials 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 239000000919 ceramic Substances 0.000 description 1
• LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1