JPH0244554Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a semiconductor chip feeding mechanism capable of feeding semiconductor chips of different widths.

Prior Art This type of conventional semiconductor chip feeding mechanism has a fourth
It is configured as shown in the figure. In FIG. 4, one ends of leaf springs 2 and 3 are fixed to the base 1 with screws 4 and 5, respectively, and the other ends of these leaf springs 2 and 3 are fixed to the lower part of the vibration table 6 with screws 7 and 8, respectively. has been done. Further, a vibration device 9 is mounted on the base 1 between the leaf springs 2 and 3. This vibrating device 9 is provided with an iron core 9a, and a winding 9 is provided on this iron core 9a.
b is wound, and the vibrating part 9c faces the iron core 9a.
The vibrating section 9c is fixed to the lower part of the vibrating table 6. As shown in FIG. 5, a feed table 15 is fixed to the top of the vibration table 6 from the outside, in which guide plates 10, 11 and a center fixing plate 14 are integrated. The vicinity of 15a is parallel to the base 1, and the supply port 1 at the other end
5b is inclined upward, and the cover 18 is mounted on the guide plates 10, 11 of the feed table 15 with screws 16, 17.
It is fixed in place. Further, a controller 19 is attached to the end of the base 1, and this controller 19
supplies, for example, an alternating current voltage to the winding 9b of the vibration device 9. Further, a support stand 20 is fixed on the controller 19, a semiconductor chip case is attached to the upper end 20a of this support stand 20, and one end of this semiconductor chip case 21 is attached to the supply port 15b of the feed stand 15. , a fixing spring 22 fixed with a screw 6b to the top surface of a square-shaped bracket 6a fixed to the side of the vibration table 6 across the feed table 15;
The semiconductor chip case is fixed by the screws.

In the conventional semiconductor chip feeding mechanism configured as described above, when an AC voltage is applied from the controller 19 to the vibrating device 9, the vibrating portion 9c of the vibrating device 9 vibrates, causing the feeding table 15 to vibrate to the left and right in the figure. do. Here, since the plate springs 2 and 3 between the base 1 and the vibration table 6 are inclined, when the vibration table 6 moves to the right in the figure by vibrating the vibrating part to the left and right in the figure. When the vibration table 6 moves upward, the vibration table 6 moves upward, and when the vibration table 6 moves to the left, the vibration table 6 moves downward. moves, and the semiconductor chip sent to the take-out port 15a of the feed table 15 is suction-held by a chip mounter and mounted on a printed board or the like.

Problems to be Solved by the Invention However, in this conventional semiconductor chip feeding mechanism, since the guide plates 10 and 11 of the feed table 15 and the center fixing plate 14 are integrated, the semiconductor chips with the width of the guide plates 10 and 11 are All I could send was chips.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention has a vibration table attached to a base via a spring, and the vibration generated by the vibrating part of the vibration device attached to the base. In a semiconductor chip feeding mechanism in which the vibration table is vibrated to sequentially feed the semiconductor chips sent from the case onto the rails of an inclined feed table on the vibration table, one or more semiconductor chips are provided between the rails of the feed table. The spacer is inserted and fixed, and the distance between the rails is made variable.

Effects According to the present invention, the guide plate, rail, and center fixing plate of the feed stand are configured so that they can be separated, and through holes are provided at the same position in each,
A screw is passed through this through hole so that the guide plate, rail, and center fixing plate of the feed base can be attached together, and a notch is provided at the same position as the through hole of the spacer to be inserted between the center fixing plate and the rail. Provided so that the spacer can be easily attached and detached.

Embodiment FIG. 1 is a side view of a semiconductor chip feeding mechanism according to an embodiment of the present invention, in which 1 is a base, 2 and 3 are leaf springs,
4 and 5 are screws, 6 is a vibration table, 7 and 8 are screws, 9 is a vibration device, 9a is an iron core, 9b is a winding, 9c is a vibration part, 10 and 11 are guide plates, 14 is a center fixing plate, 15 is the feed stand, 15a is the take-out port, 15b
is the supply port, 16 and 17 are screws, 18 is the cover, 1
9 is a controller, 20 is a support base, 21 is a semiconductor chip case, and 22 is a fixing spring.Since these structures are almost the same as the semiconductor chip feeding mechanism of the conventional example, the explanation will be omitted, but this embodiment Now, as shown in FIG.
0, 11, rails 12, 13, and the side surfaces of the center fixing plate 14, respectively, are provided with three through holes,
Furthermore, screws 23, 24, 25 are inserted into those through holes.
They are screwed together using nuts 23a, 24a, and 25a. As shown in FIG. 3, a notch 26 is provided between the center fixing plate 14 and the rails 12, 13, which has approximately the same shape as the center fixing plate 14 and corresponds to the through hole.
Insert the spacer 26 provided with a, 26b, and 26c. This spacer 26 is inserted by screws 23 and 2.
Loosen the nuts 23a, 24a, 25a of 4 and 25, insert the spacer 26 between the center fixing plate 14 and the rails 12 and 13, and then tighten the screws 2
3, 24, 25 nuts 23a, 24a, 25a
Tighten and secure.

In the semiconductor chip feeding mechanism of this embodiment configured as described above, screws 23, 24, 25 and nuts 2
By loosening 3a, 24a, and 25a, the spacer 26 can be easily attached and detached, so the rail 12,
13 can be easily varied, and semiconductor chips of different widths can be easily sent.

In the above embodiment, the rail and the guide plate are described as being separated, but they may be integrated. Also,
By preparing spacers with various widths, it is possible to cope with semiconductor chips having various widths.

Effects of the invention As is clear from the above explanation, the present invention is configured so that the guide plate, rail, and center fixing plate of the feed stand can be separated, and that through-holes are provided in the same position for each of the guide plates, rails, and center fixing plates. The guide plate, rail, and center fixing plate of the feed base can be attached together by passing screws through the spacer, and a notch is provided at the same position as the through hole of the spacer to be inserted between the center fixing plate and the rail. Since it is configured so that it can be easily attached and detached, it can be handled in any way by preparing spacers of different widths, even with a wide variety of semiconductor chips of different widths.
It also has the advantage of having a simple structure and vibration resistance.

[Brief explanation of the drawing]

FIG. 1 is a side view of a semiconductor chip feeding mechanism according to an embodiment of the present invention, FIG. 2 is a plan view and a partial sectional view of the feeding table of FIG. 1, and FIG. 3 is a side view of the spacer of FIG. 2. FIG. 4 is a side view of a conventional semiconductor chip feeding mechanism, and FIG. 5 is a plan view and a partial sectional view of the feeding base of FIG. 4. 1... Base, 2, 3... Leaf spring, 4, 5... Screw, 6... Vibration table, 7, 8... Screw, 9... Vibration device, 9a... Iron core, 9b... Winding wire , 9c... Vibration section, 10, 11... Guide plate, 12, 13...
Rail, 14...center fixing plate, 15...feeding stand, 15a...take-out port, 15b...supply port,
16, 17...Screw, 18...Cover, 19...
Controller, 20...Support stand, 21...Semiconductor chip case, 22...Fixing spring, 23,2
4, 25...Screw, 23a, 24a, 25a...
Nut, 26... Spacer, 26a, 26b, 2
6c... Notch.

Claims (1)

[Scope of utility model registration request] A vibrating table is attached to the base via a spring, and the vibrating table is vibrated by the vibration generated by the vibrating part of the vibrating device attached to the base, and the vibration is transmitted from the case onto the rail of the inclined feed table on the vibrating table. A semiconductor chip feeding mechanism configured to sequentially feed semiconductor chips sent to the feed stage, characterized in that one or more spacers are inserted and fixed between the rails of the feeding base, and the spacing between the rails is made variable. Semiconductor chip feeding mechanism.