JPH0244332U - - Google Patents
Info
- Publication number
- JPH0244332U JPH0244332U JP12275388U JP12275388U JPH0244332U JP H0244332 U JPH0244332 U JP H0244332U JP 12275388 U JP12275388 U JP 12275388U JP 12275388 U JP12275388 U JP 12275388U JP H0244332 U JPH0244332 U JP H0244332U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor
- wafer sheet
- sheet
- push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 4
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275388U JPH062270Y2 (ja) | 1988-09-21 | 1988-09-21 | 半導体ペレット剥離装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275388U JPH062270Y2 (ja) | 1988-09-21 | 1988-09-21 | 半導体ペレット剥離装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244332U true JPH0244332U (cs) | 1990-03-27 |
| JPH062270Y2 JPH062270Y2 (ja) | 1994-01-19 |
Family
ID=31370978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12275388U Expired - Lifetime JPH062270Y2 (ja) | 1988-09-21 | 1988-09-21 | 半導体ペレット剥離装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062270Y2 (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010171426A (ja) * | 2009-01-22 | 2010-08-05 | Esec Ag | 金型排出装置 |
-
1988
- 1988-09-21 JP JP12275388U patent/JPH062270Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010171426A (ja) * | 2009-01-22 | 2010-08-05 | Esec Ag | 金型排出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH062270Y2 (ja) | 1994-01-19 |
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