JPH0242433U - - Google Patents
Info
- Publication number
- JPH0242433U JPH0242433U JP1988121251U JP12125188U JPH0242433U JP H0242433 U JPH0242433 U JP H0242433U JP 1988121251 U JP1988121251 U JP 1988121251U JP 12125188 U JP12125188 U JP 12125188U JP H0242433 U JPH0242433 U JP H0242433U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- solder bump
- solder
- bump
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121251U JPH0242433U (https=) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121251U JPH0242433U (https=) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242433U true JPH0242433U (https=) | 1990-03-23 |
Family
ID=31368089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121251U Pending JPH0242433U (https=) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242433U (https=) |
-
1988
- 1988-09-16 JP JP1988121251U patent/JPH0242433U/ja active Pending