JPH024242U - - Google Patents

Info

Publication number
JPH024242U
JPH024242U JP8322988U JP8322988U JPH024242U JP H024242 U JPH024242 U JP H024242U JP 8322988 U JP8322988 U JP 8322988U JP 8322988 U JP8322988 U JP 8322988U JP H024242 U JPH024242 U JP H024242U
Authority
JP
Japan
Prior art keywords
temperature
mold
pid control
semiconductor element
heaters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8322988U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0644099Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8322988U priority Critical patent/JPH0644099Y2/ja
Publication of JPH024242U publication Critical patent/JPH024242U/ja
Application granted granted Critical
Publication of JPH0644099Y2 publication Critical patent/JPH0644099Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)
JP8322988U 1988-06-22 1988-06-22 半導体素子用樹脂封止装置 Expired - Lifetime JPH0644099Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8322988U JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8322988U JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Publications (2)

Publication Number Publication Date
JPH024242U true JPH024242U (US07714131-20100511-C00001.png) 1990-01-11
JPH0644099Y2 JPH0644099Y2 (ja) 1994-11-14

Family

ID=31307955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8322988U Expired - Lifetime JPH0644099Y2 (ja) 1988-06-22 1988-06-22 半導体素子用樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH0644099Y2 (US07714131-20100511-C00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0482405U (US07714131-20100511-C00001.png) * 1990-11-28 1992-07-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0482405U (US07714131-20100511-C00001.png) * 1990-11-28 1992-07-17

Also Published As

Publication number Publication date
JPH0644099Y2 (ja) 1994-11-14

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