JPH0241454U - - Google Patents
Info
- Publication number
- JPH0241454U JPH0241454U JP12056188U JP12056188U JPH0241454U JP H0241454 U JPH0241454 U JP H0241454U JP 12056188 U JP12056188 U JP 12056188U JP 12056188 U JP12056188 U JP 12056188U JP H0241454 U JPH0241454 U JP H0241454U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- tips
- leads
- main body
- outer shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例を示す縦断面図、
第１図ｂは外部リード部付近を示す詳細図、第２
図は本考案を適用し半田付けを実施した状態を示
す縦断面図、第３図ａ，ｂ，ｃは従来例を示す縦
断面図、第４図ａ，ｂ，ｃは従来例を適用し半田
付けを実施した状態を示す縦断面図である。
１…半導体装置本体、２…外部リード部、３…
半田付けリード部、４…引き出しリード部、５…
隙間、６…角度、７…プリント基板（ＰＷＢ）、
８…半田ぬれ部（半田フイレツト）、９…マウン
トパツド。
FIG. 1a is a longitudinal sectional view showing an embodiment of the present invention;
Figure 1b is a detailed view showing the vicinity of the external lead part, Figure 2
The figure is a longitudinal cross-sectional view showing the state in which the present invention is applied and soldering is carried out, Fig. 3 a, b, and c are longitudinal cross-sectional views showing the conventional example, and Fig. 4 a, b, and c are longitudinal cross-sectional views showing the conventional example. FIG. 3 is a longitudinal cross-sectional view showing a state in which soldering has been performed. DESCRIPTION OF SYMBOLS 1...Semiconductor device main body, 2...External lead part, 3...
Soldering lead part, 4... Pull-out lead part, 5...
Gap, 6...Angle, 7...Printed circuit board (PWB),
8...Solder wet part (solder fillet), 9...Mount pad.
Claims (1)
端を半導体装置本体側に向け、該リードの先端が
取り付け面に対し一定、かつ正方向の角度を有し
、さらに該リードの先端と半導体装置本体の外郭
とに洗浄性を考慮に入れた一定の隙間を設けた外
部リード形状としたことを特徴とする表面実装用
半導体装置。 The tips of the external leads provided on the surface mount semiconductor device are directed toward the semiconductor device main body, and the tips of the leads are at a constant and positive angle with respect to the mounting surface, and the tips of the leads and the semiconductor device main body are 1. A semiconductor device for surface mounting, characterized in that an external lead shape is provided with a certain gap between the outer shell and the outer shell in consideration of cleanability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988120561U JPH0737321Y2 (en) | 1988-09-14 | 1988-09-14 | Semiconductor device for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988120561U JPH0737321Y2 (en) | 1988-09-14 | 1988-09-14 | Semiconductor device for surface mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0241454U true JPH0241454U (en) | 1990-03-22 |
| JPH0737321Y2 JPH0737321Y2 (en) | 1995-08-23 |
Family
ID=31366782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988120561U Expired - Lifetime JPH0737321Y2 (en) | 1988-09-14 | 1988-09-14 | Semiconductor device for surface mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737321Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023097810A (en) * | 2021-12-28 | 2023-07-10 | 太陽誘電株式会社 | Coil components, circuit boards and electronics |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61214546A (en) * | 1985-03-20 | 1986-09-24 | Hitachi Tobu Semiconductor Ltd | Lead-cutting molding device |
| JPS62171148A (en) * | 1986-01-23 | 1987-07-28 | Oki Electric Ind Co Ltd | Manufacture of chip carrier type ic |
-
1988
- 1988-09-14 JP JP1988120561U patent/JPH0737321Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61214546A (en) * | 1985-03-20 | 1986-09-24 | Hitachi Tobu Semiconductor Ltd | Lead-cutting molding device |
| JPS62171148A (en) * | 1986-01-23 | 1987-07-28 | Oki Electric Ind Co Ltd | Manufacture of chip carrier type ic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023097810A (en) * | 2021-12-28 | 2023-07-10 | 太陽誘電株式会社 | Coil components, circuit boards and electronics |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0737321Y2 (en) | 1995-08-23 |