JPH0241173B2 - - Google Patents

Info

Publication number
JPH0241173B2
JPH0241173B2 JP56122993A JP12299381A JPH0241173B2 JP H0241173 B2 JPH0241173 B2 JP H0241173B2 JP 56122993 A JP56122993 A JP 56122993A JP 12299381 A JP12299381 A JP 12299381A JP H0241173 B2 JPH0241173 B2 JP H0241173B2
Authority
JP
Japan
Prior art keywords
inspection
thin film
film thickness
film forming
foreign matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56122993A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5825243A (ja
Inventor
Masakuni Akiba
Hiroto Nagatomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12299381A priority Critical patent/JPS5825243A/ja
Publication of JPS5825243A publication Critical patent/JPS5825243A/ja
Publication of JPH0241173B2 publication Critical patent/JPH0241173B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP12299381A 1981-08-07 1981-08-07 半導体ウェーハ処理方法 Granted JPS5825243A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12299381A JPS5825243A (ja) 1981-08-07 1981-08-07 半導体ウェーハ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12299381A JPS5825243A (ja) 1981-08-07 1981-08-07 半導体ウェーハ処理方法

Publications (2)

Publication Number Publication Date
JPS5825243A JPS5825243A (ja) 1983-02-15
JPH0241173B2 true JPH0241173B2 (enrdf_load_stackoverflow) 1990-09-14

Family

ID=14849622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12299381A Granted JPS5825243A (ja) 1981-08-07 1981-08-07 半導体ウェーハ処理方法

Country Status (1)

Country Link
JP (1) JPS5825243A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3656337B2 (ja) * 1996-09-06 2005-06-08 東京エレクトロン株式会社 膜厚測定装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3751647A (en) * 1971-09-22 1973-08-07 Ibm Semiconductor and integrated circuit device yield modeling
JPS5317471A (en) * 1976-07-30 1978-02-17 Zenji Ishikawa Chair with reclining mechanism
JPS5843226Y2 (ja) * 1977-12-02 1983-09-30 日本電気株式会社 素子検査装置
JPS5839758B2 (ja) * 1978-09-18 1983-09-01 新日本製鐵株式会社 カンチレバ−式橋型クレ−ン

Also Published As

Publication number Publication date
JPS5825243A (ja) 1983-02-15

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