JPH0233449U - - Google Patents

Info

Publication number

JPH0233449U

JPH0233449U JP11135888U JP11135888U JPH0233449U JP H0233449 U JPH0233449 U JP H0233449U JP 11135888 U JP11135888 U JP 11135888U JP 11135888 U JP11135888 U JP 11135888U JP H0233449 U JPH0233449 U JP H0233449U

Authority

JP

Japan

Prior art keywords

semiconductor chip

package

container

element mounting

mounting section

Prior art date

1988-08-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 10
• 238000007789 sealing Methods 0.000 claims 1
• 238000000034 method Methods 0.000 description 2
• 238000010586 diagram Methods 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1