JPH0231797Y2 - - Google Patents

Info

Publication number
JPH0231797Y2
JPH0231797Y2 JP1983108943U JP10894383U JPH0231797Y2 JP H0231797 Y2 JPH0231797 Y2 JP H0231797Y2 JP 1983108943 U JP1983108943 U JP 1983108943U JP 10894383 U JP10894383 U JP 10894383U JP H0231797 Y2 JPH0231797 Y2 JP H0231797Y2
Authority
JP
Japan
Prior art keywords
hole
component
lead
solder
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983108943U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6018578U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10894383U priority Critical patent/JPS6018578U/ja
Publication of JPS6018578U publication Critical patent/JPS6018578U/ja
Application granted granted Critical
Publication of JPH0231797Y2 publication Critical patent/JPH0231797Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP10894383U 1983-07-15 1983-07-15 湿式多層セラミツク基板 Granted JPS6018578U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10894383U JPS6018578U (ja) 1983-07-15 1983-07-15 湿式多層セラミツク基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10894383U JPS6018578U (ja) 1983-07-15 1983-07-15 湿式多層セラミツク基板

Publications (2)

Publication Number Publication Date
JPS6018578U JPS6018578U (ja) 1985-02-07
JPH0231797Y2 true JPH0231797Y2 (enEXAMPLES) 1990-08-28

Family

ID=30253973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10894383U Granted JPS6018578U (ja) 1983-07-15 1983-07-15 湿式多層セラミツク基板

Country Status (1)

Country Link
JP (1) JPS6018578U (enEXAMPLES)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61216394A (ja) * 1986-03-26 1986-09-26 イビデン株式会社 Ｉｃカード用多層プリント配線基板
JP2766146B2 (ja) * 1992-10-29 1998-06-18 京セラ株式会社 コンデンサ内蔵多層回路基板
JP2016082074A (ja) * 2014-10-17 2016-05-16 ダイキン工業株式会社 電装装置およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144745B2 (enEXAMPLES) * 1971-11-08 1976-11-30
JPS5032473A (enEXAMPLES) * 1973-07-30 1975-03-29
JPS57143891A (en) * 1981-03-02 1982-09-06 Hitachi Ltd Multilayer circuit board

Also Published As

Publication number Publication date
JPS6018578U (ja) 1985-02-07

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