JPH0231146U - - Google Patents

Info

Publication number
JPH0231146U
JPH0231146U JP10920088U JP10920088U JPH0231146U JP H0231146 U JPH0231146 U JP H0231146U JP 10920088 U JP10920088 U JP 10920088U JP 10920088 U JP10920088 U JP 10920088U JP H0231146 U JPH0231146 U JP H0231146U
Authority
JP
Japan
Prior art keywords
synthetic resin
package
substrate
coating material
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10920088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10920088U priority Critical patent/JPH0231146U/ja
Publication of JPH0231146U publication Critical patent/JPH0231146U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP10920088U 1988-08-20 1988-08-20 Pending JPH0231146U (US20020095090A1-20020718-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10920088U JPH0231146U (US20020095090A1-20020718-M00002.png) 1988-08-20 1988-08-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10920088U JPH0231146U (US20020095090A1-20020718-M00002.png) 1988-08-20 1988-08-20

Publications (1)

Publication Number Publication Date
JPH0231146U true JPH0231146U (US20020095090A1-20020718-M00002.png) 1990-02-27

Family

ID=31345226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10920088U Pending JPH0231146U (US20020095090A1-20020718-M00002.png) 1988-08-20 1988-08-20

Country Status (1)

Country Link
JP (1) JPH0231146U (US20020095090A1-20020718-M00002.png)

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