JPH02310041A - Single-sided copper clad laminated sheet - Google Patents

Single-sided copper clad laminated sheet

Info

Publication number
JPH02310041A
JPH02310041A JP13249589A JP13249589A JPH02310041A JP H02310041 A JPH02310041 A JP H02310041A JP 13249589 A JP13249589 A JP 13249589A JP 13249589 A JP13249589 A JP 13249589A JP H02310041 A JPH02310041 A JP H02310041A
Authority
JP
Japan
Prior art keywords
resin
base material
impregnated
layer
material layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13249589A
Inventor
Naoki Nakano
Toyotaro Shinko
Yoshiyuki Takeda
Shunya Yokozawa
Original Assignee
Hitachi Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chem Co Ltd filed Critical Hitachi Chem Co Ltd
Priority to JP13249589A priority Critical patent/JPH02310041A/en
Publication of JPH02310041A publication Critical patent/JPH02310041A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To make a disposable aluminum intermediate plate usable and to make maintenance cost inexpensive by successively laminating a copper foil layer to be set to the outermost layer, an intermediate base material layer impregnated with a resin low in a softening degree at high temp. and a base material layer impregnated with a usual resin and molding all of them under heating and pressure.
CONSTITUTION: A copper foil layer 1, an intermediate base material layer 2 impregnated with a resin low in a softening degree at high temp. and a base material layer 3 impregnated with a usual resin are successively laminated. As the resin used in the base material layer 2, a thermoplastic resin such as a polyimide resin is used but a resin having an especially high softening point is selected. The base material layer 3 impregnated with a usual resin is formed using the same inorg. fiber material as the base material layer 2. Both surfaces of a four-layer plate 8 wherein the single-sided copper clad laminated sheets 4 thus formed are superposed on both surfaces of an inner layer circuit board 5 through the usual resin impregnated base material layers 3 are sandwiched between disposable aluminum plates 7 to be piled up and molded under heating and pressure to obtain a multilayer printed wiring board. Since the resin softening degree at the time of pressing is low, no unevenness is generat ed even when the soft aluminum plate is used and the circuit of the inner layer circuit board 5 is not transferred to the multilayer printed wiring board.
COPYRIGHT: (C)1990,JPO&Japio
JP13249589A 1989-05-25 1989-05-25 Single-sided copper clad laminated sheet Pending JPH02310041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13249589A JPH02310041A (en) 1989-05-25 1989-05-25 Single-sided copper clad laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13249589A JPH02310041A (en) 1989-05-25 1989-05-25 Single-sided copper clad laminated sheet

Publications (1)

Publication Number Publication Date
JPH02310041A true JPH02310041A (en) 1990-12-25

Family

ID=15082712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13249589A Pending JPH02310041A (en) 1989-05-25 1989-05-25 Single-sided copper clad laminated sheet

Country Status (1)

Country Link
JP (1) JPH02310041A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6130000A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper and steel components for use in manufacturing printed circuit boards
US6235404B1 (en) 1998-04-10 2001-05-22 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards

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