JPH02296601A - Packing method of electric parts and apparatus therefor - Google Patents

Abstract

PURPOSE:To extremely easily pack the electrical parts and also easily take out them by arranging a container case, making the case openings coincide at the end of transfer path and packing the electric parts successively in series on a line of containing path stretching to the case. CONSTITUTION:A loading path 22 is formed to be a single spiral form from a case opening 23 to the inside of the case. Electric parts are loaded from a parts feeder to a transfer path 1 and charged into the inside of the case from the case opening 23. On the transfer path 1, a pushing mechanism 3 is provided near the end thereof in order to forcibly feed the parts and composed of a couple of upper and lower rollers 30a, 30b arranged between the paths. The electrical parts can be smoothly fed into the inside of the containing path 22 by means by blown compressed air.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method and apparatus for packaging electronic components used as means for supplying electronic components to a mounting head.

2. Description of the Related Art Conventionally, there are taping, magazine packing, and bulk packaging methods for packaging electronic components of this type.

Problems to be Solved by the Invention Among these, in the case of taping or magazine packing, the electronic components are housed in alignment, so the electronic components can be smoothly delivered to the mounting head. However, in these cases, the electronic components must be individually arranged on the tape surface using a unique loading means or packed inside the magazine case, making packaging the electronic components time-consuming. .

On the other hand, in the case of the bulk method, multiple electronic components are simply stored individually inside a storage case (Japanese Patent Application Laid-Open No. 62-280129), so although it does not take much time to enclose them, the packaging It is difficult to smoothly take out the electronic component from the case, and it is also difficult to specify the direction in which the electronic component should be taken out, including the front and back sides.

An object of the present invention is to provide a method and apparatus for packaging electronic components that can be packed in a storage case extremely easily and taken out easily.

Means for Solving the Problems In the method for packaging electronic components according to the present invention, a storage case is arranged with the case opening aligned with the end of a conveyance path through which electronic components are arranged in series and sent out. A predetermined number of electronic components are sequentially packed in a continuous line of storage channels from the case opening into the case while being lined up in series. The electronic components can be arranged in series and sent out on the conveyance path that follows the characteristic inspection process, and the spiral-shaped housing provided inside the case allows pressurized air to be delivered from the side of the storage case through the air inlet hole. The compressed air can be blown into the storage channel and the electronic components packed in the storage channel can be pushed inside. The packaging device to which this method is applied is equipped with a pushing mechanism that forcibly feeds electronic components near the end of a conveyance path that arranges and sends out electronic components in series, and is equipped with a holding stand for a storage case at the end of the conveyance path. On the plate surface of this holding stand, a storage case having a continuous storage path from the case opening to the inside of the case can be placed in a replaceable manner, with the end position of the conveyance path and the case opening aligned, and the device has a pusher. A pair of upper and lower rollers may be provided as the feeding mechanism, and a detector may be provided near the case opening of the storage case to measure the number of electronic components fed. In addition, an air inflow hole is provided on the side of the storage case that communicates with the storage path inside the case, and an air supply mechanism is installed on the holding base of the storage case to blow compressed air into the storage path using a coupling that surrounds the air inflow hole. can do.

Function: In this electronic component packaging method, electronic components are simply arranged and stuffed into the storage path of the storage case, so it is not only extremely easy to package electronic components, but also the electronic components packed into the storage path can be reversed. Since they can be taken out one after another from the case opening of the storage case, they can be smoothly delivered to the mounting head. If this packaging is carried out after the characteristic inspection process of electronic components, it is possible to pack the electronic components into the storage path of the packaging case by specifying the direction including the front and back of the electronic components, and the storage path can be shaped like a spiral. By blowing compressed air into the storage channel, electronic components can be reliably stuffed to the inside.

This packaging device for electronic components uses a packaging case in which electronic components are lined up and packed in a continuous storage path from the case opening into the case, so a pushing mechanism is used to forcibly feed the electronic components arranged in the transport path. Equipped with a holding stand on which the packaging case is placed, electronic components can be easily packaged, and equipped with a pair of upper and lower rollers as a pushing mechanism to smoothly package electronic components without damaging them. You can send it to The number of pieces to be fed can be controlled to a predetermined number by installing a detector near the case opening of the storage case.In addition, an air inflow hole that communicates with the storage channel inside the case is provided on the side of the storage case, and the air inflow hole By equipping the holding stand of the storage case with an air supply mechanism that blows compressed air into the storage path using a coupling that surrounds This will ensure that everything is packed inside.

Embodiments will now be described with reference to the accompanying drawings.

This electronic component packaging means can be applied to pack a desired number of chip-type electronic components such as capacitors and resistors into a storage case. Electronic components E along path 1
, E, .

In the warehouse, the storage case 2 can be a flat plate as shown in FIG. 2.3. The case body consists of a support plate 20 that holds a plurality of electronic components in an array, and a lid plate 21 that shields the component holding surface of the support plate 20.The support plate 20 accommodates a plurality of electronic components in an array. A storage channel 22 is provided for obtaining the storage. This accommodation path 22 is the case opening 2
3 and can be formed as a concave groove having a depth slightly larger than the thickness of the electronic component E, as shown in FIG. Moreover, the accommodation path 22 can be formed in a spiral shape by connecting each station 22a...22n from near the center of the plate. In order to allow the electronic components to move smoothly along this accommodation path 22, the support plate 20 is preferably formed using a plate material such as Duracon, and the inner surface of the accommodation path 22 is coated with fluorine or the like to prevent static electricity. It is good to form a film.

The electronic components to be packed into the storage case 2 can be fed from the parts feeder to the conveyance path 1 in series,
If the storage case 2 is placed at the end of the conveyance path 1 with the case opening 23 aligned, the storage path 22 will be continuous from the case opening 23 into the case, so electronic components can be arranged in series. It can be packed up to. Moreover, this conveyance path 1 is arranged as a continuation of the characteristic inspection process of electronic components located at the final process of the parts production line, and the electronic components that have completed the characteristic inspection process are arranged in series and sent out. can. In this case, the characteristics of the electronic component are inspected by positioning the electrodes of the electronic component and the front and back of the component in a predetermined direction.
The electronic components can be oriented in a constant direction even when transferred to a computer, and the electronic components can be assembled and packaged in a series of steps.

This conveyance path 1 has a pushing mechanism 3 for forcibly feeding electronic components.
is provided near the terminal end, and a holding stand 4 for the storage case 2 is provided at the terminal end. As shown in FIG. 1, the pushing mechanism 3 can be composed of a pair of upper and lower rollers 30a and 30b disposed between the strips of the conveyance path 1, and the electronic components are sandwiched between the upper and lower rolls and placed in a storage case. 2 case opening 23
It is possible to force feed smoothly towards the destination. Of the rollers 30a and 30b, the upper roller 30a is preferably coated with a rubber coating or the like on its surface as a presser roller to reliably prevent damage to electronic components or slippage.

Further, as shown in Fig. 5.6, the hook for press-feeding electronic components can be constructed by installing arms 31.31a, 31b above the conveyance path 1 or by providing a pair of upper and lower arms. By moving the electronic parts 31b eight times in the vertical and horizontal directions, the electronic components can be forcibly fed toward the case opening 23 of the storage case 2. When this forced feeding is performed, each electronic component can be smoothly packed into the storage path 22 of the storage case 2 at high speed while remaining aligned in series. The holding table 4 can be equipped with support frames 40a and 40b for positioning and holding the storage case 2 from the left and right sides, so that the storage case 2 can be placed vertically or horizontally. The storage case 2 can be placed in a replaceable manner by aligning the terminal position of the storage case 2 with the case opening 23. When the storage case 2 is placed on this holding table 4, the case opening 23 coincides with the end position of the conveyance path 1, so electronic components arranged in series along the conveyance path 1 are transferred from the case opening 23 of the storage case 2 to the case opening 23. By feeding them into the storage channel 22, they can be lined up and stuffed, and if the pushing mechanism 3 is applied at this time, it is possible to stuff them at a rate of about 1000 pieces per minute at zero speed. The number of packed pieces can be measured by installing a detector 5 such as a photo sensor located near the end of the conveyance path 1 and near the case opening 23, as shown in FIG. In response, the storage case in which parts have been filled can be exchanged with a new storage case.

In addition, when the storage path 22 of the storage case 2 is formed in a spiral shape, as shown in FIG.
・Air inflow holes 24a...24n communicating with 22n are provided on the side of the case, and the air inflow holes 24a...24n are provided on the side of the case.
By blowing pressurized air into the accommodation path 22 from n, electronic components can be smoothly fed into the accommodation path 22. As shown in FIG. 7, this pressurized air is supplied to the coupling 61 via an air tube 60 from an air supply mechanism 6 installed on the holding table 4, and is also supplied to each air inlet hole 2.
4a...24n can be fed into the multiple circumferences 22a...22n of the accommodation path 22 through a coupling 61 that is airtightly placed against the side surface of the case so as to surround the 4a...24n.

Please note that when sending out electronic components from this storage case,
As shown in the figure, air inflow holes 25a...25n similar to the air inflow holes 24a...24n are provided on the side of the case, and from the air inflow holes 25a...25n, as shown in FIG. By sending pressurized air into the accommodation path 22 through a coupling 71 connected to the housing 7 by an air tube 70, electronic components can be separated and taken out one by one from the case opening 23. This case opening 23
can be equipped with a shutter 26 that opens and closes in synchronization with the supply of compressed air, and if the shutter 26 is opened and closed by a push-up pin 73 that moves up and down with a solenoid valve 72, the electronic components can be reliably separated. It can be sent out with

Effects of the Invention As described above, according to the method and device for packaging electronic components according to the present invention, not only can electronic components be aligned and packed smoothly in the storage path of a storage case with an extremely simple mechanism, but also the mounting head This makes it possible to specify the orientation of parts and take them out sequentially when sending them out.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing a method for packaging electronic components according to the present invention, Figs. 2 to 4 are explanatory diagrams of a storage case for packaging electronic components by the same method, and Figs. 5 and 6 are explanatory diagrams showing a method for packaging electronic components according to the present invention. Fig. 7 is an explanatory diagram showing an air pumping mechanism that can be installed in the packaging device, and Fig. 8 is an explanatory diagram showing an air pumping mechanism that sends out electronic components from a storage case. It is a diagram. 1: Conveyance path, 2: Storage case, 22: Accommodation path, 23: Case opening, 24a...24n: Air inflow hole, 3 (3
0a, 30b, 31.31a, 31b): Pushing mechanism,
4: Holding stand, 5: Detector, 6: Air supply mechanism, 61:
Coupling. Patent applicant: TDT-K Co., Ltd.

Claims (7)

[Claims] (1) Conveyance path where electronic components are arranged in series and sent out (
Arrange the storage case (2) with the case opening (23) aligned with the end of the storage case (2), and then open the case opening (23) of the storage case (2).
3) A method for packaging electronic components, characterized in that a predetermined number of electronic components are sequentially packed in a continuous line of storage channels (22) in a case while being arranged in series. (2) The electronic components are arranged in series and sent out on the conveyance path (1) following the electronic component characteristic inspection step located at the final step of the component production line. Packaging method. (3) Air inflow hole (24) from the side of storage case (2)
Pressurized air is blown into the spiral accommodation path (22) provided in the case through a...24n), and the electronic components packed in the accommodation path (22) are pushed inside by the pressurized air. The packaging method according to claim 1 or 2, characterized in that the packaging method is configured such that the packaging method is sent. (4) Conveyance path where electronic components are arranged in series and sent out (
1) A push-feeding mechanism (
3), and a storage case (2) is provided at the end of the conveyance path (1).
) is equipped with a holding stand (4), and by aligning the end position of the conveyance path (1) and the case opening (23) on the plate surface of this holding stand (4), it is possible to continuously enter the case from the case opening (23) into the case. A packaging device for electronic parts, characterized in that a storage case (2) having a single storage path (22) is placed in a replaceable manner. (5) A pair of upper and lower rollers (
5. The packaging device according to claim 4, further comprising: 30a, 30b). (6) The packaging device according to claim 4, further comprising a detector (5) located near the case opening (23) of the storage case (2) to measure the number of electronic components fed. (7) The storage path (
Air inflow holes (24a...24n) communicating with 22)
is provided, and a coupling (61) surrounding the air inflow holes (24a...24n) is used to transfer the pressurized air to the accommodation channel (2).
2) The air supply mechanism (6) that blows into the air supply mechanism (6) is stored in the case (2).
5. The packaging device according to claim 4, wherein the packaging device is equipped on a holding stand (4).