JPH02294302A - Photosensitive resin composition and photosensitive element using the same - Google Patents

Photosensitive resin composition and photosensitive element using the same

Info

Publication number
JPH02294302A
JPH02294302A JP11448889A JP11448889A JPH02294302A JP H02294302 A JPH02294302 A JP H02294302A JP 11448889 A JP11448889 A JP 11448889A JP 11448889 A JP11448889 A JP 11448889A JP H02294302 A JPH02294302 A JP H02294302A
Authority
JP
Japan
Prior art keywords
formula
vinyl compound
photosensitive
photopolymerization initiator
urethane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11448889A
Other languages
Japanese (ja)
Inventor
Hideo Nakasaki
Taku Kawaguchi
Kazutaka Masaoka
Hajime Kakumaru
Original Assignee
Hitachi Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chem Co Ltd filed Critical Hitachi Chem Co Ltd
Priority to JP11448889A priority Critical patent/JPH02294302A/en
Publication of JPH02294302A publication Critical patent/JPH02294302A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Abstract

PURPOSE: To obtain the subject composition, containing a COOH group-containing polymer for imparting film properties, urethane vinyl compound, vinyl compound, plural specific photopolymerization initiators and specific heterocyclic compound, having high stability, adhesion, sensitivity and resolution and useful as printed circuit boards, etc.
CONSTITUTION: The objective photosensitive resin composition obtained by blending (A) a carboxyl group-containing polymer for imparting film properties with (B) a urethane vinyl compound having urethane bond in the molecule, (C) a vinyl compound, (D) a photopolymerization initiator expressed by formula I [R1 is 2-20C alkylene or the formula -(R2O)nR2- (R2 is 2-4C alkylene; n is 1-10)], (E) a photopolymerization initiator expressed by formula II (R1 to R4 are 1-2C alkyl) and (F) a photopolymerization initiator expressed by formula III and a heterocyclic compound having nitrogen atoms and sulfur atoms in the total number of ≥5 in one molecule so as to provide 0.05-10 pts.wt. total amount of the components (D), (E) and (F) based on 100 pts.wt. total amount of the components (A), (B) and (C). Furthermore, the resultant composition can be applied onto a supporting film and dried and a protective film, as necessary, can be then laminated to afford a photosensitive element.
COPYRIGHT: (C)1990,JPO&Japio
JP11448889A 1989-05-08 1989-05-08 Photosensitive resin composition and photosensitive element using the same Pending JPH02294302A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11448889A JPH02294302A (en) 1989-05-08 1989-05-08 Photosensitive resin composition and photosensitive element using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11448889A JPH02294302A (en) 1989-05-08 1989-05-08 Photosensitive resin composition and photosensitive element using the same

Publications (1)

Publication Number Publication Date
JPH02294302A true JPH02294302A (en) 1990-12-05

Family

ID=14639009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11448889A Pending JPH02294302A (en) 1989-05-08 1989-05-08 Photosensitive resin composition and photosensitive element using the same

Country Status (1)

Country Link
JP (1) JPH02294302A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553317A (en) * 1991-08-23 1993-03-05 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element formed by using this composition
JP2008287227A (en) * 2007-04-17 2008-11-27 Asahi Kasei Electronics Co Ltd Photosensitive resin composition and laminate
WO2011013664A1 (en) * 2009-07-29 2011-02-03 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553317A (en) * 1991-08-23 1993-03-05 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element formed by using this composition
JP2008287227A (en) * 2007-04-17 2008-11-27 Asahi Kasei Electronics Co Ltd Photosensitive resin composition and laminate
WO2011013664A1 (en) * 2009-07-29 2011-02-03 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
CN102472969A (en) * 2009-07-29 2012-05-23 旭化成电子材料株式会社 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
JP5260745B2 (en) * 2009-07-29 2013-08-14 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, and resist pattern forming method
CN104111585A (en) * 2009-07-29 2014-10-22 旭化成电子材料株式会社 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
KR101505716B1 (en) * 2009-07-29 2015-03-24 아사히 가세이 이-매터리얼즈 가부시키가이샤 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern

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