JPH02294302A - Photosensitive resin composition and photosensitive element using the same - Google Patents
Photosensitive resin composition and photosensitive element using the sameInfo
- Publication number
- JPH02294302A JPH02294302A JP11448889A JP11448889A JPH02294302A JP H02294302 A JPH02294302 A JP H02294302A JP 11448889 A JP11448889 A JP 11448889A JP 11448889 A JP11448889 A JP 11448889A JP H02294302 A JPH02294302 A JP H02294302A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- vinyl compound
- photosensitive
- photopolymerization initiator
- urethane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 239000003999 initiator Substances 0.000 abstract 4
- -1 urethane vinyl compound Chemical class 0.000 abstract 4
- 125000002947 alkylene group Chemical group 0.000 abstract 2
- 125000003178 carboxy group Chemical group 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[H]OC(*)=O 0.000 abstract 2
- 150000002391 heterocyclic compounds Chemical class 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 125000004433 nitrogen atoms Chemical group data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 N* 0.000 abstract 1
- 230000001681 protective Effects 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
- 125000004434 sulfur atoms Chemical group 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
Abstract
PURPOSE: To obtain the subject composition, containing a COOH group-containing polymer for imparting film properties, urethane vinyl compound, vinyl compound, plural specific photopolymerization initiators and specific heterocyclic compound, having high stability, adhesion, sensitivity and resolution and useful as printed circuit boards, etc.
CONSTITUTION: The objective photosensitive resin composition obtained by blending (A) a carboxyl group-containing polymer for imparting film properties with (B) a urethane vinyl compound having urethane bond in the molecule, (C) a vinyl compound, (D) a photopolymerization initiator expressed by formula I [R1 is 2-20C alkylene or the formula -(R2O)nR2- (R2 is 2-4C alkylene; n is 1-10)], (E) a photopolymerization initiator expressed by formula II (R1 to R4 are 1-2C alkyl) and (F) a photopolymerization initiator expressed by formula III and a heterocyclic compound having nitrogen atoms and sulfur atoms in the total number of ≥5 in one molecule so as to provide 0.05-10 pts.wt. total amount of the components (D), (E) and (F) based on 100 pts.wt. total amount of the components (A), (B) and (C). Furthermore, the resultant composition can be applied onto a supporting film and dried and a protective film, as necessary, can be then laminated to afford a photosensitive element.
COPYRIGHT: (C)1990,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11448889A JPH02294302A (en) | 1989-05-08 | 1989-05-08 | Photosensitive resin composition and photosensitive element using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11448889A JPH02294302A (en) | 1989-05-08 | 1989-05-08 | Photosensitive resin composition and photosensitive element using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02294302A true JPH02294302A (en) | 1990-12-05 |
Family
ID=14639009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11448889A Pending JPH02294302A (en) | 1989-05-08 | 1989-05-08 | Photosensitive resin composition and photosensitive element using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02294302A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553317A (en) * | 1991-08-23 | 1993-03-05 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element formed by using this composition |
| JP2008287227A (en) * | 2007-04-17 | 2008-11-27 | Asahi Kasei Electronics Co Ltd | Photosensitive resin composition and laminate |
| WO2011013664A1 (en) * | 2009-07-29 | 2011-02-03 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern |
-
1989
- 1989-05-08 JP JP11448889A patent/JPH02294302A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553317A (en) * | 1991-08-23 | 1993-03-05 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element formed by using this composition |
| JP2008287227A (en) * | 2007-04-17 | 2008-11-27 | Asahi Kasei Electronics Co Ltd | Photosensitive resin composition and laminate |
| WO2011013664A1 (en) * | 2009-07-29 | 2011-02-03 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern |
| CN102472969A (en) * | 2009-07-29 | 2012-05-23 | 旭化成电子材料株式会社 | Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern |
| JP5260745B2 (en) * | 2009-07-29 | 2013-08-14 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition, photosensitive resin laminate, and resist pattern forming method |
| CN104111585A (en) * | 2009-07-29 | 2014-10-22 | 旭化成电子材料株式会社 | Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern |
| KR101505716B1 (en) * | 2009-07-29 | 2015-03-24 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern |
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