JPH02283094A - Manufacture of circuit board with aluminum pad - Google Patents

Manufacture of circuit board with aluminum pad

Info

Publication number
JPH02283094A
JPH02283094A JP10337689A JP10337689A JPH02283094A JP H02283094 A JPH02283094 A JP H02283094A JP 10337689 A JP10337689 A JP 10337689A JP 10337689 A JP10337689 A JP 10337689A JP H02283094 A JPH02283094 A JP H02283094A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
foil
pattern
pad
aluminum
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10337689A
Inventor
Mitsuru Akimoto
Kiyohisa Hashimoto
Mineo Kaneko
Hideo Otsuka
Original Assignee
Furukawa Electric Co Ltd:The
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To obtain a circuit board with an aluminum pad in which solder resist can be easily printed by pattern etching a mirror image of a circuit pattern at a copper foil side of a clad foil, adhering it to its face base material, and then pattern etching the aluminum foil side of the clad foil to form the pad.
CONSTITUTION: The copper foil 2 of a clad foil 3 in which an aluminum foil 1 and the foil 2 are combined is first pattern etched to form a mirror image circuit pattern 7a of the shape inverted at the front side rear at the circuit pattern. Then, the face of the pattern 7a is adhered to a base material 5 through an adhesive 4. Thereafter, when the foil 1 is pattern etched to form an aluminum pad 6, a circuit pattern 7 is exposed on the surface to obtain a circuit board 8 with the aluminum pad of the shape buried in the adhesive 4. When the board 8 is printed with a solder resist 9, since the face except the pad 6 is flat, the resist 9 can be easily printed, and there is no fear of generating a gap or a void.
COPYRIGHT: (C)1990,JPO&Japio
JP10337689A 1989-04-25 1989-04-25 Manufacture of circuit board with aluminum pad Pending JPH02283094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10337689A JPH02283094A (en) 1989-04-25 1989-04-25 Manufacture of circuit board with aluminum pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10337689A JPH02283094A (en) 1989-04-25 1989-04-25 Manufacture of circuit board with aluminum pad

Publications (1)

Publication Number Publication Date
JPH02283094A true true JPH02283094A (en) 1990-11-20

Family

ID=14352381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10337689A Pending JPH02283094A (en) 1989-04-25 1989-04-25 Manufacture of circuit board with aluminum pad

Country Status (1)

Country Link
JP (1) JPH02283094A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6518514B2 (en) 2000-08-21 2003-02-11 Matsushita Electric Industrial Co., Ltd. Circuit board and production of the same
US6532651B1 (en) 1998-05-14 2003-03-18 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
US6565954B2 (en) 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
US6703565B1 (en) 1996-09-06 2004-03-09 Matsushita Electric Industrial Co., Ltd. Printed wiring board
US7006386B2 (en) 1991-11-26 2006-02-28 Renesas Technology Corp. Storage device employing a flash memory

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7006386B2 (en) 1991-11-26 2006-02-28 Renesas Technology Corp. Storage device employing a flash memory
US7059039B2 (en) 1996-09-06 2006-06-13 Matsushita Electric Industrial Co., Ltd. Method for producing printed wiring boards
US6703565B1 (en) 1996-09-06 2004-03-09 Matsushita Electric Industrial Co., Ltd. Printed wiring board
US6565954B2 (en) 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
US6748652B2 (en) 1998-05-14 2004-06-15 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
US6532651B1 (en) 1998-05-14 2003-03-18 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
US6691409B2 (en) 2000-08-21 2004-02-17 Matsushita Electric Industrial Co., Ltd. Method of producing a circuit board
US6518514B2 (en) 2000-08-21 2003-02-11 Matsushita Electric Industrial Co., Ltd. Circuit board and production of the same

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