JPH02281742A - Semiconductor device and arraying method therefor - Google Patents

Semiconductor device and arraying method therefor

Info

Publication number
JPH02281742A
JPH02281742A JP10157189A JP10157189A JPH02281742A JP H02281742 A JPH02281742 A JP H02281742A JP 10157189 A JP10157189 A JP 10157189A JP 10157189 A JP10157189 A JP 10157189A JP H02281742 A JPH02281742 A JP H02281742A
Authority
JP
Japan
Prior art keywords
solder layer
powder
ferromagnetic material
solder
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10157189A
Inventor
Yasuo Hasegawa
Tsuyoshi Nakamura
Original Assignee
Origin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Origin Electric Co Ltd filed Critical Origin Electric Co Ltd
Priority to JP10157189A priority Critical patent/JPH02281742A/en
Publication of JPH02281742A publication Critical patent/JPH02281742A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83191Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder paste, particles or preforms; Transferring prefabricated solder patterns
    • H05K3/3484Paste or slurry or powder

Abstract

PURPOSE: To enable adjustment of the height and the thermal expansion coefficient of a solder layer and the arrangement of semiconductor chips in one direction by mixing powder of a ferromagnetic material beforehand in the solder layer on the main surface of each semiconductor chip.
CONSTITUTION: In regard to a semiconductor device provided with a solder layer, one or a plurality of kinds of powders of a ferromagnetic material are mixed in an ordinary solder paste, that is, the solder paste being a Pb-Sn alloy, and they are mixed to be uniform. Printing is made on a semiconductor wafer and baking is made at an ordinary temperature. Then the ferromagnetic powder 3 is contained in the solder layer 2 as it is, without being melted. When the powder 3 of a ferromagnetic material having a small thermal expansion coefficient is mixed in, therefore, the thermal expansion coefficient of the solder 2 is lowered, while the solder layer 2 can be formed to be thick relatively when the particle size of the powder 3 of the ferromagnetic material is made large. When a jig 6 having a number of recessed parts 5 and a magnet 7 brought temporarily into contact with the back of the bottoms of said parts are used, moreover, the direction of a semiconductor chip 1 can be judged and semiconductor chips can be lined up.
COPYRIGHT: (C)1990,JPO&Japio
JP10157189A 1989-04-24 1989-04-24 Semiconductor device and arraying method therefor Pending JPH02281742A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10157189A JPH02281742A (en) 1989-04-24 1989-04-24 Semiconductor device and arraying method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10157189A JPH02281742A (en) 1989-04-24 1989-04-24 Semiconductor device and arraying method therefor

Publications (1)

Publication Number Publication Date
JPH02281742A true JPH02281742A (en) 1990-11-19

Family

ID=14304092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10157189A Pending JPH02281742A (en) 1989-04-24 1989-04-24 Semiconductor device and arraying method therefor

Country Status (1)

Country Link
JP (1) JPH02281742A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317191A (en) * 1991-08-19 1994-05-31 Mitsubishi Denki Kabushiki Kaisha Low-melting-point junction material having high-melting-point particles uniformly dispersed therein
US5346775A (en) * 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
US5428249A (en) * 1992-07-15 1995-06-27 Canon Kabushiki Kaisha Photovoltaic device with improved collector electrode
JP2007189501A (en) * 2006-01-13 2007-07-26 Matsushita Electric Ind Co Ltd Electronic component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55100407A (en) * 1979-01-24 1980-07-31 Satoru Mori Wooden box assembling metal fittings for packing
JPS5834376A (en) * 1981-08-26 1983-02-28 Yokogawa Hokushin Electric Corp Distribution focusing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55100407A (en) * 1979-01-24 1980-07-31 Satoru Mori Wooden box assembling metal fittings for packing
JPS5834376A (en) * 1981-08-26 1983-02-28 Yokogawa Hokushin Electric Corp Distribution focusing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317191A (en) * 1991-08-19 1994-05-31 Mitsubishi Denki Kabushiki Kaisha Low-melting-point junction material having high-melting-point particles uniformly dispersed therein
US5428249A (en) * 1992-07-15 1995-06-27 Canon Kabushiki Kaisha Photovoltaic device with improved collector electrode
US6214636B1 (en) 1992-07-15 2001-04-10 Canon Kabushiki Kaisha Photovoltaic device with improved collector electrode
US5346775A (en) * 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
JP2007189501A (en) * 2006-01-13 2007-07-26 Matsushita Electric Ind Co Ltd Electronic component

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