JPH02280330A - Jet type liquid processor - Google Patents

Jet type liquid processor

Info

Publication number
JPH02280330A
JPH02280330A JP10221589A JP10221589A JPH02280330A JP H02280330 A JPH02280330 A JP H02280330A JP 10221589 A JP10221589 A JP 10221589A JP 10221589 A JP10221589 A JP 10221589A JP H02280330 A JPH02280330 A JP H02280330A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
wafer
etchant
jet
make
discharge port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10221589A
Other versions
JPH0712035B2 (en )
Inventor
Masao Sumiyoshi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To make flow of processing liquid complicate and to make distribution in a wafer at an etching speed uniform by alternately forming a processing liquid jet port and a discharge port in a jet cup by an eccentrically deviated multiple pipe.
CONSTITUTION: Etchant 5 fed via jet ports 2a, 2b provided in a jet cup 1 and a discharge port 6 is partly externally discharged through a gap D of the cup 1 and a semiconductor wafer 4, also fed to the port 6, and discharged through a side discharge port 7. The flow of the part in contact with the wafer 4 of the etchant 5 is fed in a complicated direction upon rotation of the wafer 4. Accordingly, fresh etchant is always brought into contact with the wafer 4, both reaction control speed type and diffusion control speed etchant can be used to make the distribution in the wafer such as etching speed, etc., uniform.
COPYRIGHT: (C)1990,JPO&Japio
JP10221589A 1989-04-20 1989-04-20 Nozzle-type liquid processing apparatus Expired - Lifetime JPH0712035B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10221589A JPH0712035B2 (en) 1989-04-20 1989-04-20 Nozzle-type liquid processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10221589A JPH0712035B2 (en) 1989-04-20 1989-04-20 Nozzle-type liquid processing apparatus

Publications (2)

Publication Number Publication Date
JPH02280330A true true JPH02280330A (en) 1990-11-16
JPH0712035B2 JPH0712035B2 (en) 1995-02-08

Family

ID=14321441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10221589A Expired - Lifetime JPH0712035B2 (en) 1989-04-20 1989-04-20 Nozzle-type liquid processing apparatus

Country Status (1)

Country Link
JP (1) JPH0712035B2 (en)

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05302200A (en) * 1992-01-09 1993-11-16 Internatl Business Mach Corp <Ibm> Electrochemical micromachining method
US5873380A (en) * 1994-03-03 1999-02-23 Mitsubishi Denki Kabushiki Kaisha Wafer cleaning apparatus
US5934566A (en) * 1995-05-26 1999-08-10 Mitsubishi Denki Kabushiki Kaisha Washing apparatus and washing method
EP1168419A1 (en) * 2000-06-19 2002-01-02 Interuniversitair Micro-Elektronica Centrum Method and apparatus for localized liquid treatment of the surface of a substrate
US6398975B1 (en) 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7000622B2 (en) 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
US7003899B1 (en) 2004-09-30 2006-02-28 Lam Research Corporation System and method for modulating flow through multiple ports in a proximity head
US7045018B2 (en) 2002-09-30 2006-05-16 Lam Research Corporation Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
US7069937B2 (en) 2002-09-30 2006-07-04 Lam Research Corporation Vertical proximity processor
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7153400B2 (en) 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US7170190B1 (en) 2003-12-16 2007-01-30 Lam Research Corporation Apparatus for oscillating a head and methods for implementing the same
US7198055B2 (en) 2002-09-30 2007-04-03 Lam Research Corporation Meniscus, vacuum, IPA vapor, drying manifold
US7234477B2 (en) 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
US7252097B2 (en) 2002-09-30 2007-08-07 Lam Research Corporation System and method for integrating in-situ metrology within a wafer process
US7254900B2 (en) 2004-09-30 2007-08-14 Lam Research Corporation Wafer edge wheel with drying function
US7293571B2 (en) 2002-09-30 2007-11-13 Lam Research Corporation Substrate proximity processing housing and insert for generating a fluid meniscus
US7353560B2 (en) 2003-12-18 2008-04-08 Lam Research Corporation Proximity brush unit apparatus and method
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US7389783B2 (en) 2002-09-30 2008-06-24 Lam Research Corporation Proximity meniscus manifold
JP2008311441A (en) * 2007-06-14 2008-12-25 Tosoh Corp Processing head and processing method using it
US7513262B2 (en) 2002-09-30 2009-04-07 Lam Research Corporation Substrate meniscus interface and methods for operation
US7568490B2 (en) 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
US7584761B1 (en) 2000-06-30 2009-09-08 Lam Research Corporation Wafer edge surface treatment with liquid meniscus
US7614411B2 (en) 2002-09-30 2009-11-10 Lam Research Corporation Controls of ambient environment during wafer drying using proximity head
US7632376B1 (en) 2002-09-30 2009-12-15 Lam Research Corporation Method and apparatus for atomic layer deposition (ALD) in a proximity system
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US7867565B2 (en) 2003-06-30 2011-01-11 Imec Method for coating substrates
US7928366B2 (en) 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
US7975708B2 (en) 2007-03-30 2011-07-12 Lam Research Corporation Proximity head with angled vacuum conduit system, apparatus and method
US7997288B2 (en) 2002-09-30 2011-08-16 Lam Research Corporation Single phase proximity head having a controlled meniscus for treating a substrate
US8062471B2 (en) 2004-03-31 2011-11-22 Lam Research Corporation Proximity head heating method and apparatus
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US8146902B2 (en) 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
US8236382B2 (en) 2002-09-30 2012-08-07 Lam Research Corporation Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
US8580045B2 (en) 2009-05-29 2013-11-12 Lam Research Corporation Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer

Cited By (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05302200A (en) * 1992-01-09 1993-11-16 Internatl Business Mach Corp <Ibm> Electrochemical micromachining method
US5873380A (en) * 1994-03-03 1999-02-23 Mitsubishi Denki Kabushiki Kaisha Wafer cleaning apparatus
US5934566A (en) * 1995-05-26 1999-08-10 Mitsubishi Denki Kabushiki Kaisha Washing apparatus and washing method
US6048409A (en) * 1995-05-26 2000-04-11 Mitsubishi Denki Kabushiki Kaisha Washing apparatus and washing method
US6851435B2 (en) 1997-09-24 2005-02-08 Interuniversitair Microelektronica Centrum (Imec, Vzw) Method and apparatus for localized liquid treatment of the surface of a substrate
US6398975B1 (en) 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
EP1168419A1 (en) * 2000-06-19 2002-01-02 Interuniversitair Micro-Elektronica Centrum Method and apparatus for localized liquid treatment of the surface of a substrate
US7234477B2 (en) 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
US7584761B1 (en) 2000-06-30 2009-09-08 Lam Research Corporation Wafer edge surface treatment with liquid meniscus
US7513262B2 (en) 2002-09-30 2009-04-07 Lam Research Corporation Substrate meniscus interface and methods for operation
US8236382B2 (en) 2002-09-30 2012-08-07 Lam Research Corporation Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
US7045018B2 (en) 2002-09-30 2006-05-16 Lam Research Corporation Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
US7069937B2 (en) 2002-09-30 2006-07-04 Lam Research Corporation Vertical proximity processor
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7127831B2 (en) 2002-09-30 2006-10-31 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7997288B2 (en) 2002-09-30 2011-08-16 Lam Research Corporation Single phase proximity head having a controlled meniscus for treating a substrate
US7153400B2 (en) 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US7632376B1 (en) 2002-09-30 2009-12-15 Lam Research Corporation Method and apparatus for atomic layer deposition (ALD) in a proximity system
US7198055B2 (en) 2002-09-30 2007-04-03 Lam Research Corporation Meniscus, vacuum, IPA vapor, drying manifold
US7000622B2 (en) 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7252097B2 (en) 2002-09-30 2007-08-07 Lam Research Corporation System and method for integrating in-situ metrology within a wafer process
US7614411B2 (en) 2002-09-30 2009-11-10 Lam Research Corporation Controls of ambient environment during wafer drying using proximity head
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7293571B2 (en) 2002-09-30 2007-11-13 Lam Research Corporation Substrate proximity processing housing and insert for generating a fluid meniscus
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US7389783B2 (en) 2002-09-30 2008-06-24 Lam Research Corporation Proximity meniscus manifold
US7264007B2 (en) 2002-09-30 2007-09-04 Lam Research Corporation Method and apparatus for cleaning a substrate using megasonic power
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US7867565B2 (en) 2003-06-30 2011-01-11 Imec Method for coating substrates
US7170190B1 (en) 2003-12-16 2007-01-30 Lam Research Corporation Apparatus for oscillating a head and methods for implementing the same
US7353560B2 (en) 2003-12-18 2008-04-08 Lam Research Corporation Proximity brush unit apparatus and method
US7568490B2 (en) 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
US8062471B2 (en) 2004-03-31 2011-11-22 Lam Research Corporation Proximity head heating method and apparatus
US7254900B2 (en) 2004-09-30 2007-08-14 Lam Research Corporation Wafer edge wheel with drying function
US7003899B1 (en) 2004-09-30 2006-02-28 Lam Research Corporation System and method for modulating flow through multiple ports in a proximity head
US7143527B2 (en) 2004-09-30 2006-12-05 Lam Research Corporation System and method for modulating flow through multiple ports in a proximity head
US7928366B2 (en) 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
US8146902B2 (en) 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
US7975708B2 (en) 2007-03-30 2011-07-12 Lam Research Corporation Proximity head with angled vacuum conduit system, apparatus and method
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
JP2008311441A (en) * 2007-06-14 2008-12-25 Tosoh Corp Processing head and processing method using it
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US8580045B2 (en) 2009-05-29 2013-11-12 Lam Research Corporation Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer

Also Published As

Publication number Publication date Type
JPH0712035B2 (en) 1995-02-08 grant

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