JPH02278862A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To make an integrated circuit small-sized, to realize a high-density mounting operation and to arrange that an EPROM can be inserted or detached freely by a method wherein the EPROM is connected to a conductive path on the other substrate exposed by a hollow which has been formed in a prescribed position at a peripheral end side of one substrate out of two substrates. CONSTITUTION:A hollow 4 is formed in a desired position at a peripheral end part of one substrate 2; an EPROM 6 is connected to a conductive path 5 on the other substrate 3 exposed by the hollow 4; accordingly, a mounting position of the EPROM 6 can be selected arbitrarily. As a result, the EPROM 6 and a built-in microcomputer 7 can be connected efficiently considering an electrical connection to the microcomputer 7; it is not required to guide signal lines. Thereby, data lines which are used to send and receive a data between the EPROM 6 and the microcomputer 7 can be realized at a shortest distance or by a layout which can be designed most easily; a loss of a mounting density by guiding the data lines can be reduced to a minimum. In addition, since two substrates 2, 3 are used, it is possible to obtain a high-density and small-sized hybrid integrated circuit device.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Industrial Application Field The present invention relates to a non-volatile memory sealed with resin on an integrated circuit board.
For example, the present invention relates to a hybrid integrated circuit device with a built-in EFROM, which is formed by mounting an EPROM (ultraviolet erasable programmable read only memory).

(b) Conventional technology An EP having an ultraviolet irradiation window that can erase and rewrite previously written memory information by irradiating it with ultraviolet rays.
ROM elements are favorably used in various electronic devices.

At present, most of these EPROM elements are mounted on printed wiring boards together with control or driving integrated circuits, and in order to rewrite the information once written, they are usually mounted on easily removable printed wiring boards. Implemented. For various electronic devices that require smaller size and lighter weight, a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board using a technique called chip-on-board, and after the required wiring is done, this The IC chip, including the wiring portion, is covered with synthetic resin, making it extremely compact and lightweight.

On the other hand, EFROM chips that require an ultraviolet irradiation window cannot be made smaller and lighter because this irradiation window is a bottleneck, and they are still manufactured in a deep dip package and mounted on a printed wiring board.

The mounting structure of such a conventional EPROM element will be explained with reference to FIG. 13. FIG. 13 is a perspective view with a partial cross section of a conventional EPROM element, in which a conductive wiring pattern (41) is formed on the main surface. An insulating substrate (42> through holes (
43) is incorporated into a deep dip type package.
An M element (44) is mounted. This EPROM element (44) has a header (45) and a cap (46), said header (45) having a ceramic substrate (47).
An external lead (48) or a low melting point glass material is bonded to the external lead (48). Also, this header (45) is made of an element mounting part (45) made by sintering so-called gold paste, which is glass mixed with a large amount of gold powder.
50) on the low melting point glass material or the ceramic substrate (4
7) is glued on the top, and the E
A FROM chip (51) is mounted with the ultraviolet irradiation surface facing upward, and the electrodes of this chip (51) and the external leads (48) are connected by a thin metal wire (52).The cap (46) is a storage member, the EFR
The cap (46) includes a ceramic base material (54) having a window (53) in a portion facing the ultraviolet irradiation surface of the OM chip (51), and the cap (46) is connected to the header (4) by a low melting point glass.
5) is sealed. E with the EFROM chip (51) sealed in this way.
The PROM element (44) is fixed by soldering by inserting external leads (48) into the through holes (43) of the insulating substrate (42). This through hole (43)
A conductive wiring pattern (41) is used to perform necessary wiring, and a male connector terminal portion (55) provided at the end of the insulating substrate is connected to a female connector (not shown).

Now, the mounting structure of such a conventional EFROM element is EP
Compared to the ROM chip (51), the package external shape is extremely large, and not only the surface area but also the three-dimensional height is several times the height of the chip, which is extremely disadvantageous for thinning. Furthermore, after the external lead is inserted into the through hole (43), it is necessary to fix it with solder or the like. Another major drawback that should be noted is that EF is not performed before mounting on an insulating board.
The process involves assembling the ROM element into a package once. E
Since the FROM element has a window for irradiating ultraviolet rays, its package is assembled into a ceramic-based ceramic-based package, but since this package is sealed with low-melting glass, it cannot be heated to high temperatures (400 to 500°C). )
If the thin metal wires that serve as a seal and connect the electrodes (aluminum) of the EPROM chip and the external leads are not made of the same material, alloying will occur, resulting in an increase in wiring resistance or disconnection. To avoid such a situation, thin aluminum wire is usually used, but this EPROM
The chip must have the substrate at ground potential, EP
The ground electrode of the ROM chip is connected by wire to the chip mounting portion formed of gold paste. Here, too, a secondary or multi-component alloy reaction progresses between the gold or metals such as foil in the gold paste and the aluminum, so a small piece of silicon whose head is coated with aluminum, called a ground die, is used. Separately from the EPROM chip, it is fixed to the chip mounting part made of the gold paste, and the ground die head and the EPR
Conventional mounting structures are unsatisfactory in terms of small size, light weight, and low cost, as they involve extremely complicated work of connecting the OM chip to the ground electrode.

In order to solve this problem, the EFROM shown in FIG.
There is an implementation structure.

The EFROM mounting structure shown in FIG. 14 will be explained below.

An insulating substrate (6
0) has a chip mounting area (60c) on which the EPROM chip 21 is mounted, and the wiring pattern (60b) is routed from near this area on the main surface (60a) to connect to a male connector terminal (not shown). connected to the section. An EPROM chip (61) is mounted on the area (60c), and the surface electrode of this chip (61) and the wiring pattern (60b) are connected by a thin metal wire (62). Of course metal wire! 1 (62) is the chip (6
In order to connect to the substrate of 1), this chip <6
1) is wired with the wiring pattern (60b) on which it is mounted. A UV-transparent window material (64) is fixed onto the UV-irradiated surface <61a) of the EPROM chip (61) via a UV-transparent resin (63) (for example, manufactured by Toshisha Co., Ltd., model name TX-978). has been done. This window material (64)
Quartz and transparent alumina are well-known UV transparent materials. Since the top surface (64a) of the window material (64) is the surface that introduces light to the ultraviolet irradiation surface of the EPROM chip (61), the remaining window material (64a) excluding this top surface (64a) ) portion, the thin metal wire (62), and the connection portion between the metal wire 1 (62) and the wiring pattern (60b) are made of synthetic wood Jfl (65) (for example, manufactured by Nitto Denko Corporation, model name MP-10). covered with. If the insulating substrate (
60), the EPROM chip (61), and the window material (64), if it is necessary to further reduce the total thickness dimension, the chip mounting area (60c) of the board (60) can be counterbored and this board can be used. You only need to grip it about half the thickness of (60), or if you make a counterbore hole like this, you can use synthetic resin (65).
A flow-stopping dam is formed, which effectively prevents moisture from entering.

The EFROM mounting structure shown in FIGS. 13 and 14 is described in Japanese Unexamined Patent Publication No. 1983-83393 (IO5 1/18).

(c) Problems to be Solved by the Invention In the EFROM mounting structure shown in FIG. 14, the EFROM chip is die-bonded onto the printed circuit board, so it goes without saying that the size is reduced. The miniaturization referred to here is simply the miniaturization of the EPROM itself. In other words, although it is not clear from Fig. 14, since the microcomputer and its peripheral circuit elements fixed around the EFROM are composed of discrete electronic components, the printed circuit board on which the EFROM is mounted is When looking at the entire system as an integrated circuit, there is a problem in that the size of the printed circuit board increases as before, without any reduction in size, that is, the overall system increases in size. Furthermore, in the EFROM structure shown in FIG. 14, when erasing program data in the EFROM, after erasing by irradiating the printed circuit board with ultraviolet rays, the conductive pattern of the routing line extending from the EFROM is used for writing by a probe, etc. It is necessary to rewrite by touching the terminal of the R
There is a problem in that an OM writer cannot be used and rewriting the EFROM becomes complicated.

In addition, in the EFROM mounting structure shown in FIG. 13, in terms of rewriting after erasing, it is possible to attach and detach the EFROM from the printed circuit board. It is relatively easy to do. However, in the mounting structure shown in FIG. 13 as well as in FIG. 14, the peripheral circuits of the EFROM, that is, the circuit elements such as the microcomputer and its peripheral LSIs and ICs, are composed of discrete electronic components. However, there is a major problem in that the size of the printed circuit board, that is, the size of the entire system, makes it impossible to provide an integrated circuit equipped with an EFROM that is light, thin, short, and small enough to meet the demands of users.

Furthermore, in the EFROM mounting structure shown in FIGS. 13 and 14, the entire system becomes larger as described above, and the conductive patterns that connect the EFROM and its surrounding circuit elements are exposed, which reduces reliability. There is a problem of deterioration.

Furthermore, in the EFROM mounting structure shown in FIGS. 13 and 14, the EFROM and surrounding circuit elements such as microcomputers, ICs, and LSIs are exposed, which creates unevenness on the top surface of the board, making it difficult to handle and work. There is a problem of deterioration.

Furthermore, in the EFROM mounting structure shown in FIGS. 13 and 14, all the elements of the microcomputer and its peripheral circuit elements consisting of the EFROM and discrete components are mounted on a single printed circuit board.
This poses a major problem in terms of miniaturization of the system itself.

(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes at least a resin-sealed EP on one of the two substrates.
The ROM and micro combinator are mounted, and all other circuit elements are mounted on the other board or on one board, and only the EFROM is exposed in a recess provided at a predetermined position on the periphery of the other board. It also features a structure in which the microcomputer and all other circuit elements are sealed in a sealed space formed by two substrates and a case material.

Therefore, it is possible to miniaturize the hybrid integrated circuit equipped with EFROM, and to mount circuit elements on two boards, resulting in high-density mounting.
A hybrid integrated circuit device with built-in FROM can be provided. Further, since the upper surface of the EFROM is exposed through the recess provided at the peripheral edge of one of the substrates, the EPROM can be inserted and removed freely.

(*) Effect As described above, according to the present invention, a recess is provided at a predetermined position on the peripheral edge of one of the two substrates, and the EFROM is connected to the conductive path on the other substrate exposed by the recess. Since the mounting position of the EPROM can be set arbitrarily, the EPROM and the micro combinator can be efficiently connected by considering the electrical connection with the built-in microcomputer. This eliminates the need for routing lines.

Furthermore, the most closely related microcomputer can be placed adjacent to the EFROM, and the data line for exchanging data between the EFROM and the microcomputer can be set at the shortest or minimum distance. Loss is minimized and high-density packaging is possible.

Furthermore, in the present invention, all the circuit elements other than the EFROM are mounted as chips on one of the two substrates, and are housed in a sealed space formed by the two substrates and the case material. It is possible to provide a hybrid integrated circuit device that is compact, can be mounted at high density, and is easy to handle.

(F) Embodiments Below, the hybrid integrated circuit device of the present invention will be explained in detail based on the embodiments shown in FIGS. 1 to 12.

1 and 2 fully illustrate a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having independent functions in a wide range of fields such as computers.

As shown in Figures 1 and 2, this hybrid integrated circuit device (1) includes two integrated circuit boards (2) and (3), and one of the two integrated circuit boards (2) and (3). A recess (4) provided at a predetermined position on the peripheral edge of the substrate (2), and a conductive path (5) of a desired shape formed on the two integrated circuit boards (2) and (3).
), a nonvolatile memory (6) connected to one conductive path (5>), and one substrate (on which data is supplied from the memory (6) and the nonvolatile memory (6) is mounted).
2) A microcomputer <7) connected to the conductive path (5) above, and the conductive path (5) on the two substrates (2) and (3).
peripheral circuit elements (8) connected to the
) (3) and a case material (9) which is separated from and integrated with the case material (9).

The two integrated circuit boards (2) and (3) are made of hard substrates such as ceramics, glass epoxy, or metal, and in this embodiment, metal substrates with excellent heat dissipation and mechanical strength are used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0IIIff is used. The two boards (2) <3
As shown in Fig. 4, an aluminum oxide film (9) (alumite layer) is formed on the surface of the aluminum oxide film (9) (alumite layer) by well-known anodic oxidation, and the main surface side thereof has a flexible material such as polyimide with a thickness of 10 to 70 μm. An insulating resin layer (10) is pasted.

Further, on the insulating resin layer (10), a copper foil (
11) is attached simultaneously with the insulating resin layer (10) by means of a roller or hot press. By the way, the two substrates (2) and (3) are connected to each other with a predetermined distance separated by a flexible insulating resin layer (10).

On the surface of the copper foil (11) provided on the -main surface of the two substrates (2) and (3), a conductive path of a desired shape is exposed by screen printing and masked with a resist.
A plating layer (silver, platinum) is plated on the surface of the copper foil (11). After that, the resist is removed and the copper foil (11) is etched using the precious metal plating layer as a mask to form the desired conductive path (
5) is formed. Here, the thinness of the conductive path (5) by screen printing is limited to 0.5 ml, so when an ultra-fine wiring pattern is required, the ultra-fine conductive path (5) up to about 2 μm is formed using well-known photo-etching technology. becomes possible.

A non-volatile memory (6) and a microcomputer (7) supplied with data from the memory (6) are mounted on the conductive path (5) on one of the substrates (3).
3) and peripheral circuit elements (8) are mounted on the conductive path (5) on the other substrate (2). Also both boards (2)
(3) A conductive path (
5) has a plurality of pads for fixing external lead terminals (12) and (13).

External lead terminals (12) and (13) are fixed to these pads by solder, and are led out horizontally and bent at a substantially right angle at the center thereof. In addition, the conductive path (5) that has been formed on both substrates (2) and (3) is covered with a flexible resin layer <10
), it can be patterned to cross the two substrates (2) and (3), and the connection between the two substrates (2) and (3) can be made at a predetermined position and at any desired location.

E P ROM (Er
as-abla Programmable Read
(hereinafter, the nonvolatile memory (6) will be referred to as EFROM). This EPRO
As is well known, M (6) is a device that excites the electrons (program data) stored in the floating gate formed in the pellet of EPROM (6) by irradiating it with light and returns it to the pellet in an unmemorized state. This is an element that can be written into and used.

The structure of a general EFROM (6) is a DIP (dual in line) type, as shown in FIGS. 5 and 6, and can be roughly divided into a resin mold package type and a ceramic package type. In either the resin mold type or the ceramic type, it is necessary to irradiate the pellet (14) with light to erase its memory, so the upper surface of the pellet (14) is transparent to high-energy light (ultraviolet light). Transparent member (
15) is fully arranged. In this embodiment, the DIP type EF
For ROM (6), either resin mold type or ceramic type package can be used.
Such EPROM devices are disclosed in Japanese Patent Laid-Open Nos. 53-74358 and 62-290160.

In this embodiment, the E F ROM (6) has a DIP type EP.
Although a ROM device is used, the type of EPROM (6) is basically arbitrary, and for example, a ceramic type or resin molded package such as LCC or PLCC can also be used. EPROM devices of the LCC and PLCC types each have a structure in which connection electrodes are provided on the four sides of the bottom surface. LCC and PI, CC type EF
The ROM is smaller than the DIP type EFROM, but in this example, the DIP type EPRO, which is the most popular type, is used.
Although the description will be made using the M device, if a more compact system is required, the effect will be greater if an LCC or PLCC type EPROM device is used. Also, LCC, PLCC
This type of EFROM is mounted on the board via a socket, similar to the DIP type.

On the other hand, in the present invention, one of the two substrates (2 bars 3) (
A recess (4) is provided at a predetermined position on the peripheral edge of 2). These two boards (2) and (3) are case materials <9> described later.
is fixed for a predetermined period of time. At this time, on the other board (3) exposed in the recess (4) provided on the peripheral edge of one board (2), there are a plurality of conductive conductors to which the socket (16) mounting the EFROM (6) is connected. The road (5) has been extended. This recess (4) has substantially the same external shape as the EFROM (6), and is formed to be 1,000 times larger than the EFROM (6) in order to facilitate the insertion and removal of the EFROM (6).

The microcomputer (7), which can selectively supply program data to the EFROM (6), and its peripheral circuit elements (8), such as ICs, transistors, chip resistors, and chip capacitors, are chip components that can be connected to desired conductive paths (5).
), the microcomputer (7) and the circuit element (8) are bonded to the nearby conductive path (5). Furthermore, four carbon resistors by screen printing or nickel-plated resistors by nickel plating are formed as resistance elements between the conductive paths (5).

To explain in more detail, the socket (16) where the EFROM (6) is mounted and the microcomputer (7) are located in the recess (4).
Conductive path (5) on one substrate (3) that is not provided with
and all other circuit elements (8) are attached on the conductive paths (5) at predetermined positions on the - and other substrates (2) and (3).

The case material (9) is made of thermoplastic resin as an insulating member, and as shown in FIG. It is formed. The case material (9) comes into contact with the periphery of a recess (4) provided on the peripheral edge of one substrate (2) and the surface of the other substrate (3) exposed by the recess (4). A frame (18) having a constant thickness is provided. This frame (18) is formed to be recessed along the recess (4) provided in the substrate (2). In addition, - of the case material (9)
The side edges are formed in an arc shape so that the film resin layer (10) can be easily bent when both the substrates (2) and (3) are arranged.

The case material (9) and the two substrates (2 bars 3) are fixed together using an adhesive sheet, and the case material (9) is bonded to both substrates (2) and (3) connected by the film resin layer (10). They are fixed in such a way that they are sandwiched and the mounted circuit elements are opposed to each other. At this time, the film 411 ply layer (10) that connects both substrates (2 bars 3) is brought into contact with the arcuate portion provided on the case material (9) and bent, so that the bent portion is conductive. There is no risk that the path (5) will break when bending. After the case material (9) and both substrates (2) and (3) are hydrated, the resin layer (10) of the connection part is exposed, so in this example, the connection part exposed by the lid (20) shall be completely sealed. The lid (20) is made of the same material as the case material (9), and is adhered thereto by a predetermined means such as the above-mentioned adhesive sheet.

On the other substrate (3) exposed through the recess (4) provided on the peripheral edge of one substrate (2), one end of a plurality of conductive paths (5) that are firmly connected to the electrodes of the socket (16) are arranged. formed,
A socket (16) into which the E F ROM (6) is inserted is fixed to the tip of the conductive path (5). Socket (16
) to which the conductive path (5) is fixed can be efficiently routed near the microcomputer (7) and electrically connected to the chip-shaped microcomputer (7) by a bonding wire.

Here, EFROM (6) and microcomputer (7)
I will explain the positional relationship with. Figure 7 shows the EFROM (6
) and microcomputer (7) on one board (3).
This is an enlarged view of the main part when placed on the top, and it shows the EFROM (6
) and the chip-shaped microcomputer (7) are the 7th U.
As shown in gJ, since they are connected via a large number of conductive paths (5), the EPROM (6) and the microcomputer (7) are placed adjacent to each other in order to shorten the length of the conductive paths (5). The location is located at or as close to the location as possible. Therefore, the conductive path (5) between the EFROM (6) and the microcomputer (7) can be formed over the shortest distance, and the mounting area on the board can be used effectively. As shown in FIG. 7, the EFROM (6) and a chip-shaped microcomputer (7) placed near or adjacent to it are connected to the tip of a conductive path (5) extending near the microcomputer (7). It is bonded and electrically connected to the EFROM (6) by a wire line.

By the way, the EFROM (6) will be inserted into the socket (16) and mounted on one board (3), and the E
Only the top surface of F ROM (6) should be exposed to the outside)
At this time, it is preferable that the top surface of the EFROM (6) and the top surface of the other substrate (2) are in a substantially coincident state.As a result, only the EPROM (6) is exposed and the other microcomputer ( 7) and its surrounding circuit elements (
8) is formed by two substrates (2) and (3) and a case material (9), and is placed in the sealed space (21).

As mentioned above, the microcomputer (7) that can be connected to the EFROM (6) and its peripheral circuit elements (8) are located in a sealed space formed by the two substrates (2) (3) and the case material (9). It is set to be placed in the section (21).

That is, all the elements, including the chip-shaped weight components and the resistive elements such as the printed resistor and the plated resistor, are provided within the sealed space (14).

By the way, one of the substrates (where the EFROM (6) is exposed)
A light-shielding sealing material (22) is glued onto the recess (4) of 2), completely blocking light and EFROM (6).
is completely sealed.

In this embodiment, when erasing data in the EFROM (6), there are cases where the sealing material (22) is removed and ultraviolet rays are irradiated, or the EPROM (6) is removed from the socket (16) and ultraviolet rays are irradiated. Also, in case of rewriting, E
Remove the PROM (6) from the socket and use it as a general ROM.
Write electrically using a writer, and after writing,
Just insert it into the socket (16).

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

First, what is a modem? A modem exists for data communication in which digitized data handled by a data terminal such as a personal computer is sent and received at a distance using a telephone line. The function of a modem is to modulate digitized data using the frequency that can be used on the telephone line, convert it into an analog signal, and send it onto the telephone line, and to convert the analog signal that can be modulated with the data sent from the other party. It has the ability to demodulate and return to digitized data.

The modem will be briefly explained based on the block diagram shown in FIG.

FIG. 8 is a block diagram when the modem is mounted on the integrated circuit board (2).

The modem has a DTE interface (31) that stores data sent from the bassoon in its built-in memory and outputs the data, and a DTE interface (31).
A microcomputer (7) that outputs a predetermined output signal based on the data output from the microcomputer (7), and an EFR that contains the data received from the microcomputer (7).
The output signals from the OM (6) and the microcomputer (7) are modulated and demodulated to the NCU (NETWORK C0NTR).
0L UNIT) and a microcomputer (7).
A DTMF generator 34) for generating a desired DTMF signal (tone signal) according to the output signal from the DTMF generator 34) is also configured.

The DTE interface (31) is, for example, 5TC961.
0 (Seiko Epson), etc., and as shown in Figure 9, there is a transmitting memory part (35 ), a receiving memory part (36) that stores signals supplied with output signals from the microcomputer (7) in the built-in memory and outputs them to the personal computer (38), a transmitting memory part (35), and a receiving memory part (35). It consists of a control section (37) that switches each signal input and output through a part of memory (36), and has a predetermined function for connecting a personal computer (38) and a microcomputer (7). be.

The microcomputer (7) is, for example, 5TC9620 (
As shown in FIG. 10, the command recognition section recognizes the output signal output from the DTE interface (31), and the command decoding section decodes the output signal recognized by the command recognition section.
Based on the signal decoded by the command decoding part, the command execution part compares the data with the data in a part of the memory and supplies the data to the modulation/demodulation circuit, and the result of comparing the data of the command decoding part with the data in the part of the memory is incorrect data. and a response hood generator that outputs an output signal to the DTE interface (31) when the command is supplied to the command execution unit.

The modulation/demodulation circuit (38) converts the digital signal sent from the microcomputer (7) into an analog signal and sends it to the NC
Send to U department. On the other hand, it converts the analog signal sent from the NCU section into a digital signal and sends it to the microcomputer (7), and is provided with low-speed and medium-speed circuits. First modulation/demodulation circuit (32
) is a 300 bps low speed modulation/demodulation circuit, and the second modulation/demodulation circuit (33) is a 1200 bps medium speed modulation/demodulation circuit. Respective first and second modulation/demodulation circuits (32) (33
), one of the modulation and demodulation circuits is selected by the microcomputer (7).

DTMF generator (34) is a microcomputer (7)
The data output from the command execution part of COL, RO
A predetermined DTMF signal is generated by inputting it to the input terminal of each W, and is output to the transmitting A M P (39) to supply the signal to the telephone line.

and is supplied to the microcomputer (7) based on the address of the microcomputer (7).

Next, the operation of the modem will be briefly explained.

First, to start communication with a personal computer, the control switch (40) operates based on a read signal from the microcomputer (38), and predetermined address data is read from the EPRO.
EFRO supplied to M(7) and based on its address
The program data of M (6) is supplied to the microcomputer (7), and the communication standard (BELL/CCITT standard) and communication speed (300/1
200bp8), data format matches, and various modes such as depth switch mode switching are checked.

Assuming the various modes match, enter the answering modem's phone number into your computer.

The phone number is the DT for interfacing with the computer.
E-interface (31) and forwarded to the microcomputer (7) for decoding the telephone number.

Send the decoded result to the DTMF generator (34),
A DTMF signal is transmitted from the DTMF generator (34) and transferred to the general telephone line via the transmitting AMP (39) and the line transformer.

The transferred DTMF signal sends a paging signal to the modem on the responding side, and the modem on the responding side receives the paging signal and automatically receives the call. Then, the modem on the responding side sends an answer tone for the connection procedure to the modem on the calling side.

The modem on the calling side passes through a line transformer (41) and a receiving amplifier (42), and a low-speed modulation/demodulation circuit (32) determines whether or not the answer tone is a predetermined answer tone for the modem on the calling side. To detect. If it is a predetermined answer tone, the communication state is entered.

When the communication state is established, parallel data from the PC is input to the DTE interface (31) based on predetermined key manual signals from the keyboard of the calling party's PC,
The data is transferred to the microcomputer (7).

Here, parallel data is converted to serial data. The digital signal converted into serial data can be sent to the low-speed modulation/demodulation circuit (32). Here, the digital signal is converted to an analog signal, which is transmitted to the responding modem via the transmission A M P (39) and the line transformer (41) at a frequency of 1FsK based on the corresponding communication standard.

On the other hand, the frequency-modulated analog signal sent by the key input signal from the responding PC is sent to the calling modem, line transformer (41), and receiving AM P (42).
The signal is input to the low-speed modulation/demodulation circuit 32) via the low-speed modulation/demodulation circuit 32). Here, the analog signal is converted into a digital signal and inputted to the DTE interface (31), and the serial digital signal is converted into a parallel digital signal and inputted to the calling side personal computer. As a result, the PC on the calling side and the PC on the responding side can perform full-duplex communication, realizing PC communication.

FIG. 11 is a plan view of the modem circuit shown in FIG. 8 mounted on one of the substrates (3) used in this example.
The drawing numbers of the circuit elements that can be mounted shall be the same. EPR
The connection between the OM (6) and the microcomputer (7) is shown by a pass line, and the conductive paths connecting the plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 11, a plurality of fixing pads (5a) to which external lead terminals (13) are fixed are provided on opposing peripheral edges of one substrate (3). Adherence pad (5a
) A socket (16) carrying a plurality of circuit elements (8) and an EPROM (6) is fixed to the fixed position of the conductive path (5) extending from the conductive path (5). On such a substrate (3) is an EFR.
A plurality of circuit elements (8) including a microcomputer (7>) other than OM (6) are fixed, and (31) is a DT
E interface, (32) ((33) first and second modulation/demodulation circuits, (34) DTMF generation circuit,
) is a control switch that controls EPROM (6), (7)
(8) is a microcomputer, and (8) is a chip component such as a capacitor.

As shown in FIG. 11, a socket (16) in which an EFROM (6) is mounted is fixed near or adjacent to the microcomputer (7). A socket (16) is installed near or adjacent to the microcomputer (7).
) by fixing the microcomputer (7) and E.
The path line with the PROM (6), that is, the routing line of the conductive path (5) can be routed at the shortest possible distance, and other mounting patterns can be used effectively and high-density mounting can be achieved. .

In addition, the area surrounded by the - dotted chain line is covered with an adhesive sheet and the case material (
9) indicates the area to be fixed.

Figure 12 shows the case material (
9) is a plan view of the completed product of the hybrid integrated circuit device for a modem when the other board (2) is fixed through the board, and only the top surface of the EFROM (6) is visible from the top surface of the other board (2). It becomes exposed. That is, all other elements except the EPROM (6) are made of a case material (9) and two substrates (2) and (3).
) and E.
Since only the top surface of the PROM (6) is exposed through the recess (4), the EPROM (6) can be inserted and removed as desired.

The hybrid integrated circuit device EFROM (6
), in preparation for the diversification of product specifications, it is possible to easily respond to specification changes requested by set manufacturers (users) such as destination, OEM, and in-house sales. That is, EFROM (
The circuit configuration other than 6) has been designed in advance to accommodate various specification changes, but when designing a hybrid integrated circuit based on a specific user's specifications, it may not match the specifications of other users. In the past, it was necessary to reconsider the design of the hybrid integrated circuit itself.

However, in the hybrid integrated circuit device of the present invention, the EFROM(6)
is mounted on one board (3) via the socket (9), and its surface is exposed from the recess (4) provided on the peripheral edge of the other board (2),
Since the OM(6) can be removed, multiple types of hybrid integrated circuit devices can be realized with one hybrid integrated circuit device by simply selecting and mounting an EFROM on the user side.

According to the present invention, a depression (4) is provided at a desired position on the peripheral edge of the other substrate (2), and a conductive path (5) on one substrate (3) exposed in the depression (4) is provided. ) to the socket (16
) and connect the EFROM (6) through the side board (2) (
Sealed space (21) formed by 3) and case material (9>)
Microcomputer (7) and other circuit elements (8)
), it is possible to create a device that integrates the hybrid integrated circuit and the EFROM, and the EFROM can be easily installed as needed.
It has the great feature of being able to insert and remove ROM.

(G) Effects of the Invention As detailed above, according to the present invention, firstly, a recess (4) is provided at a desired position on the peripheral edge of one substrate (2), and the recess (4) exposes the The conductive path (
Since EFROM (6) is connected to 5), EFROM
This has the advantage that the mounting position of M(6) can be arbitrarily selected.

Therefore, in consideration of the electrical connection with the built-in microcomputer (7), the EFROM (6) and the microcomputer (7) can be connected efficiently, making it unnecessary to route signal lines. More specifically, the microcomputer (7) most closely related to the adjacent position of the EFROM (6)
As a result, the data lines for exchanging data between the EFROM (6) and the microcomputer (7) can be realized with the shortest distance or the easiest layout, minimizing loss in packaging density due to data line routing. can be suppressed to a minimum. Furthermore, since it is formed from two substrates (2) and (3), it is possible to provide a high-density and compact hybrid integrated circuit device.

Second, make a depression (4) at a desired position on the peripheral edge of one substrate (2).
), it has the advantage that it can be handled as an integrated compact hybrid integrated circuit device even though it uses a commercially available molded E F ROM (6). Furthermore, by improving the mounting density of the microcomputer and its peripheral circuit elements on the two integrated circuit boards (2) and (3), the conventionally required printed circuit board can be eliminated, and a single miniaturized EFROM can be used. (
It is possible to realize a hybrid integrated circuit device in which 6) is removably built-in.

Thirdly, by using a metal substrate as the integrated circuit board (2) (3), its heat dissipation effect can be greatly improved compared to a printed circuit board, which can further contribute to an improvement in packaging density. In addition, by using copper foil (11) as the conductive path (5),
The resistance value of the conductive path (3) can be significantly reduced compared to conductive paste, and the circuit to be mounted can be expanded to the same level or more than that of a printed circuit board.

4th g: Since the dual in-line type or I, CCf1 commercially available as EFROM (6) can be used, it has the advantage that the EPROM (6) can be implemented extremely easily in a hybrid integrated circuit device. Furthermore, by making the outer shape of the recess (4) and the EFROM (6) the same, it can be perfectly embedded within the frame (18) of the case material (9), creating an extremely clean-shaped hybrid integrated circuit device with a built-in EFROM. realizable.

Fifth, the microcomputer (7) and its peripheral circuit elements (8) that can be connected to the EFROM (6) are made of case material (
9) and the two integrated circuit boards (2) and (3) in the sealed space (21) in the form of a die or chip, compared to conventional printed circuit boards molded with resin. This has the advantage that the area occupied is extremely small and the packaging density can be greatly improved.

Sixth, the case material (9) and two integrated circuit boards (2) (3)
) by substantially matching the peripheral edges of the integrated circuit boards (2) and (3), almost the entire surface of the integrated circuit boards (2) and (3) can be used as the sealed space (21), which, together with improved packaging density, makes it possible to create an extremely compact hybrid integrated circuit device. realizable.

Seventh, one integrated circuit board (3) corresponding to the recess (4)
) by providing a socket (16) on the EPRO
It has the advantage that the M (6) can be freely attached and detached, and the EFROM (6) can be exchanged, erased, and rewritten freely.

Eighthly, by aligning the top surface of one substrate (2) with the top surface of the EFROM (6), there is an advantage that a hybrid integrated circuit device having a flat top surface can be realized. Furthermore, sealing material (2
2) has the advantage that the EFROM (6) can be shielded from light and the gap between the EPROM (6) and one of the substrates (2) can be sealed.

Ninth, it has the advantage that the external leads (12) and (13) can be derived from the negative sides or opposite sides of the two integrated circuit boards (2 and 3), making it possible to realize a hybrid integrated circuit device with an extremely large number of pins. .

[Brief explanation of drawings]

Fig. 1 is a perspective view showing this embodiment, and Fig. 2 is an I-
I sectional view, FIG. 3 is an enlarged perspective view of main parts showing the vicinity of the upper EFROM used in this example, FIG. 8 is a block diagram showing the modem used in this example, and FIG. FIG. 10 is a block diagram showing the micro combinator of the modem shown in FIG. 8, and FIG. 11 is a block diagram showing the DTE interface of the modem shown in FIG. 8, when the block diagram shown in FIG. FIG. 12 is a plan view of the case material fixed onto the substrate shown in FIG. 11, and FIG.
This figure and FIG. 14 are cross-sectional views showing a conventional EFROM mounting structure. (1)...Hybrid integrated circuit device, (2>(3)...
Integrated circuit board, (5)--conducting path, (6)-E
P ROM, (7)...Microcomputer, (8
)...Circuit element, (4)...Indentation, (9)...
Case material, (16)...Socket, (22)...
・Seal material.

Claims (14)

[Claims] (1) Two integrated circuit boards arranged to face each other, a conductive path having a desired pattern formed on opposing main surfaces of the board, and a resin-molded non-volatile device connected to the conductive path. a memory; a microcomputer and its peripheral circuit elements supplied with data from the memory and connected to conductive paths on the substrate; and a case material integrated between the substrates; A recess is provided at a desired position on the peripheral edge, the nonvolatile memory is connected to the conductive path on the other substrate exposed in the recess, and the microelectromechanism is inserted into the sealed space formed by both the substrates and the case material. A hybrid integrated circuit device characterized by arranging a computer and its peripheral circuit elements. (2) The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit board. (3) The hybrid integrated circuit device according to claim 1, wherein the shapes of both the substrates are substantially the same. (4) The hybrid integrated circuit device according to claim 1, wherein copper foil is used as the conductive path. (5) The hybrid integrated circuit device according to claim 1, wherein the nonvolatile memory is molded with a dual in-line type or an LCC type resin. (6) The hybrid integrated circuit device according to claim 4, wherein the outer shape of the recess and the nonvolatile memory are substantially the same. (7) The hybrid integrated circuit device according to claim 1, wherein the microcomputer is incorporated in the form of a die on the conductive surface. (8) The hybrid integrated circuit device according to claim 1, wherein a chip resistor or a chip capacitor is used as the peripheral circuit element. (9) The hybrid integrated circuit device according to claim 1, characterized in that the case material has a frame body having a constant thickness and which is made substantially coincident with the peripheral end portions of the both substrates except for the recess. (10) The hybrid integrated circuit device according to claim 9, wherein the frame body is recessed according to the recess and disposed between the two substrates. (11) The hybrid integrated circuit device according to claim 1, further comprising a socket connected to the conductive path of the other substrate, and the nonvolatile memory is inserted into the socket. (12) The hybrid integrated circuit device according to claim 11, wherein the upper surface of the nonvolatile memory and the upper surface of the other substrate are substantially aligned. (13) The hybrid integrated circuit device according to claim 12, characterized in that a light-shielding sealing material is provided across the upper surface of the nonvolatile memory and the other substrate around the upper surface of the nonvolatile memory. (14) The hybrid integrated circuit device according to claim 1, wherein the two integrated circuit boards are connected by a flexible insulating resin layer.