JPH02273409A - Transparent conductive laminate - Google Patents

Transparent conductive laminate

Info

Publication number
JPH02273409A
JPH02273409A JP1093392A JP9339289A JPH02273409A JP H02273409 A JPH02273409 A JP H02273409A JP 1093392 A JP1093392 A JP 1093392A JP 9339289 A JP9339289 A JP 9339289A JP H02273409 A JPH02273409 A JP H02273409A
Authority
JP
Japan
Prior art keywords
transparent
film
transparent conductive
thin film
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1093392A
Other languages
Japanese (ja)
Other versions
JP2714124B2 (en
Inventor
Shozo Kawazoe
昭造 河添
Masaaki Kawaguchi
川口 正明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP9339289A priority Critical patent/JP2714124B2/en
Publication of JPH02273409A publication Critical patent/JPH02273409A/en
Application granted granted Critical
Publication of JP2714124B2 publication Critical patent/JP2714124B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To improve a scratch-proofing property, a printing characteristic and visualization by a method wherein a substance having the specific thickness as a film base material to form a transparent conductive thin film on one side surface thereof and a transparent body having a water-repellent and stain- preventive treatment layer on the outer surface is pasted up on the other side surface through a transparent adhesive layer. CONSTITUTION:A substance having the specific thickness is used as a film base material 1 to form a transparent conductive thin film 2 on one side surface thereof while a transparent base body 4 having a water-repellent and stain preventive treatment layer on the outer surface is pasted up on the other side surface through a transparent adhesive layer 3. Various kinds of plastic films having transparency are used as a film base body. The thickness of these film base materials shall be 2 to 120mum. A vacuum evaporation method, a sputtering method and an ion plating method is used as a formation method of the transparent conductive thin film. The thickness of the conductive thin film shall be above 50Angstrom . The adhesive layer of acryl, silicon and rubber is used as the adhesive layer 3, while an elastic modulus thereof shall be 1X10<5> to 1X10<7>dyn/cm<2> and the thickness shall be above 1mum.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はフィルム基材の一方の面に透明な導電性薄膜
を設けるとともに、他方の面に透明基体を貼り合わせて
なる透明導電性積層体に関する。
[Detailed Description of the Invention] [Industrial Application Field] This invention provides a transparent conductive laminate in which a transparent conductive thin film is provided on one side of a film base material, and a transparent substrate is bonded to the other side. Regarding.

〔従来の技術〕[Conventional technology]

一般に、可視光線領域で透明であり、かつ導電性を有す
る薄膜は、液晶デイスプレィ、エレクI・ロルミネツセ
ンスディスプレイなどの新しいデイスプレィ方式やタッ
チパネルなどにおける透明電極のほか、透明物品の帯電
防止や電磁波遮断などのために用いられている。
In general, thin films that are transparent in the visible light range and have conductivity are used not only as transparent electrodes in new display systems such as liquid crystal displays and electric I-Lormine sense displays, but also in touch panels, as well as for antistatic and electromagnetic wave applications in transparent articles. It is used for purposes such as blocking.

従来、このような透明導電性薄膜として、ガラス上に酸
化インジウJ、薄膜を形成した、いわゆる導電性ガラス
がよく知られているが、基材がガラスであるために、可
撓性、加工性に劣り、用途によっては好ましくない場合
がある。
Conventionally, so-called conductive glass, in which a thin film of indium oxide J is formed on glass, is well known as such a transparent conductive thin film, but since the base material is glass, it has poor flexibility and processability. , and may be undesirable depending on the application.

このため、近年では、可撓性、加工性に加えて、耐衝撃
性にずくれ、軽量であるなどの利点から、ボリエヂレン
テレフタレートフイルムをばしめとする各種のプラスチ
ックフィルムを基材とした透明導電性薄膜が賞月されて
いる。
For this reason, in recent years, various plastic films made of polyethylene terephthalate film have been used as base materials due to their advantages such as flexibility, processability, impact resistance, and light weight. Transparent conductive thin films have received awards.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかるに、このようなフィルム基材を用いた従来の透明
導電性薄膜は、薄膜表面の耐擦傷性に劣り、使用中に傷
がついて電気抵抗が増大したり、断線を生じるといった
問題があった。
However, conventional transparent conductive thin films using such film base materials have problems such as poor scratch resistance on the surface of the thin film, and scratches during use that increase electrical resistance or cause wire breakage.

また、特にタッチパネル用の導電性薄膜では、スペーサ
を介して対向させた一対の薄膜同志がその一方の基材側
からの押圧打点で強く接触するものであるため、これに
抗しうる良好な耐久特性つまり打点特性を有しているこ
とが望まれるが、上記従来の透明導電性薄膜ではかかる
特性に劣り、そのぷんタッチパネルとしての寿命が短く
なるという問題があった。
In addition, especially in conductive thin films for touch panels, a pair of thin films facing each other with a spacer in between makes strong contact at the point of pressure applied from one of the base materials, so it is important to have good durability to withstand this. Although it is desired that the transparent conductive thin film has such a characteristic, that is, a dotting point characteristic, the conventional transparent conductive thin film mentioned above has a problem that it is inferior to such a characteristic and its life as a touch panel is shortened.

さらに、従来のこの種の透明導電性薄膜は、導電性薄膜
を形成した面とは反対側のフィルム基材面が裸の状態に
あるために、使用中にその表面に指紋や汚れさらには傷
を生じやすく、また著しくまぶしさを惑しることもあり
、これらのことが原因で薄膜製品全体としての視認性に
劣るという難点があった。
Furthermore, with conventional transparent conductive thin films of this type, the surface of the film base opposite to the surface on which the conductive thin film is formed is bare, so during use, the surface may be exposed to fingerprints, dirt, or scratches. The problem is that the visibility of the thin film product as a whole is poor due to these factors.

この発明は、上記従来の問題点に鑑み、ポリエチレンテ
レフタレートフィルムなどのフィルム基材を用いた透明
導電性薄膜の耐擦傷性、打点特性および視認性を改良す
ることを目的としている。
In view of the above-mentioned conventional problems, the present invention aims to improve the scratch resistance, dot characteristics, and visibility of a transparent conductive thin film using a film base material such as a polyethylene terephthalate film.

〔課題を解決するための手段〕[Means to solve the problem]

この発明者らは、上記の目的を達成するために鋭意検討
した結果、フィルム基材として特定膜厚のものを用いて
その一方の面に透明な導電性薄膜を形成する一方、他方
の面に透明な粘着剤層を介して特定処理が施された別の
透明基体を貼り合わせることにより、薄膜表面の耐擦傷
性および打点特性の改良とともに、主に上記の透明基体
に施された特定の処理層に基づいて視認性の大幅な改善
をも図れるものであることを知り、この発明を完成する
に至った。
As a result of intensive studies to achieve the above object, the inventors used a film base material with a specific thickness to form a transparent conductive thin film on one surface, while forming a transparent conductive thin film on the other surface. By bonding another transparent substrate that has been treated with a specific treatment via a transparent adhesive layer, the scratch resistance and dot characteristics of the thin film surface can be improved, as well as the specific treatment that has been applied to the above transparent substrate. It was discovered that visibility could be significantly improved based on the layers, and this invention was completed.

すなわち、この発明は、厚さが2〜120μmの透明な
フィルム基材の一方の面に膜厚が50Å以上の透明な導
電性薄膜を形成し、他方の面に透明な粘着剤層を介して
外表面に撥水および汚れ防止処理層を有する透明基体を
貼り合わせてなる透明導電性積層体に係るものである。
That is, this invention forms a transparent conductive thin film with a thickness of 50 Å or more on one side of a transparent film base material with a thickness of 2 to 120 μm, and a transparent conductive thin film with a thickness of 50 Å or more on the other side with a transparent adhesive layer interposed therebetween. This invention relates to a transparent conductive laminate formed by bonding together a transparent substrate having a water-repellent and stain-preventing treated layer on its outer surface.

〔発明の構成・作用〕[Structure and operation of the invention]

この発明において使用するフィルム基材としては、透明
性を有する各種のプラスチックフィルムを使用でき、具
体的にはポリエチレンテレフタレト、ポリイミド、ポリ
エーテルサルフオン、ポリエーテルエーテルケトン、ポ
リカーポネ〜I・、ボリプIコビレン、ポリアミド、ポ
リアクリル、セルロースプロピオネートなどが挙げられ
る。
As the film base material used in this invention, various transparent plastic films can be used, and specifically, polyethylene terephthalate, polyimide, polyether sulfone, polyether ether ketone, polycarbonate, polycarbonate, polycarbonate, etc. Examples include I-cobylene, polyamide, polyacrylic, cellulose propionate, and the like.

これらフィルム基材の厚みは、2〜120μmの範囲に
あることが必要で、特に好適には6〜100μmの範囲
にあるのがよい。2μm未満では基材としての機械的強
度が不足し、この基材をロル状にして導電性薄膜や粘着
剤層を連続的に形成する操作が難しくなる。一方、12
0μmを超えると、後述する粘着剤層のクツション効果
に基づく導電性薄膜の耐擦傷性や打点特性の向上を図れ
なくなる。
The thickness of these film base materials needs to be in the range of 2 to 120 μm, particularly preferably in the range of 6 to 100 μm. If the thickness is less than 2 μm, the mechanical strength of the base material is insufficient, and it becomes difficult to form the base material into a roll shape and continuously form a conductive thin film or adhesive layer thereon. On the other hand, 12
If it exceeds 0 μm, it becomes impossible to improve the scratch resistance and dot characteristics of the conductive thin film based on the cushioning effect of the adhesive layer, which will be described later.

このフィルム基材はその表面に予めスパッタリング、コ
ロナ放電、火炎、紫外線照射、電子線照射、化成、酸化
などのエツチング処理や下塗り処理を施して、この上に
設けられる導電性薄膜の上記基材に対する密着性を向上
させるようにしてもよい。また、導電性薄膜を設ける前
に、必要に応じて溶剤洗浄や超音波洗浄などにより除塵
、清浄化してもよい。
The surface of this film base material is subjected to etching treatment or undercoating treatment such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation, etc., so that the conductive thin film provided on the base material The adhesion may be improved. Further, before providing the conductive thin film, dust removal and cleaning may be performed by solvent cleaning, ultrasonic cleaning, etc. as necessary.

この発明においては、このようなフィルム基材の一方の
面に透明な導電性薄膜を形成する。導電性薄膜の形成方
法としては、真空蒸着法、スパッタリング法、イオンブ
レーティング法などの従来公知の技術をいずれも採用で
きる。また、用いる薄膜材料も特に制限されるものでは
なく、たとえば酸化スズを含有する酸化インジウム、ア
ンチモンを含有する酸化スズなどの金属酸化物のほか、
金、1艮、白金、パラジウム、銅、アルミニウム、ニッ
ケル、クロム、チタン、コバルト、スズまたはこれらの
合金などが好ましく用いられる。
In this invention, a transparent conductive thin film is formed on one side of such a film base material. As a method for forming the conductive thin film, any conventionally known technique such as a vacuum evaporation method, a sputtering method, an ion blating method, etc. can be employed. Furthermore, the thin film material to be used is not particularly limited; for example, in addition to metal oxides such as indium oxide containing tin oxide and tin oxide containing antimony,
Gold, platinum, palladium, copper, aluminum, nickel, chromium, titanium, cobalt, tin, or alloys thereof are preferably used.

この導電性薄膜の厚さとしては、50Å以上とすること
が必要で、これより薄いと表面抵抗が103Ω/口以下
となる良好な導電性を有する連続被膜となりにくい。一
方、あまり厚くしすぎると透明性の低下などをきたすた
め、特に好適な厚さとしては、100〜2. OOO人
程度とするのがよい。
The thickness of this conductive thin film needs to be 50 Å or more; if it is thinner than this, it is difficult to form a continuous film with good conductivity and a surface resistance of 10 3 Ω/mouth or less. On the other hand, if the thickness is too large, the transparency may deteriorate, so a particularly suitable thickness is 100 to 2. It is best to set the number to about OOO people.

なお、この発明においては、上記の如き透明な導電性薄
膜の表面に、MgFz、SiO2、Aβ203、’1”
io、Ti0z、Zr0zなどの誘電体薄膜層を形成し
て、可視光線透過率の向上を図ったり、酸化などによる
導電性薄膜の性能劣化を防くようにしてもよい。
In this invention, MgFz, SiO2, Aβ203, '1'' is applied to the surface of the transparent conductive thin film as described above.
A dielectric thin film layer of io, TiOz, ZrOz, etc. may be formed to improve the visible light transmittance or to prevent performance deterioration of the conductive thin film due to oxidation or the like.

このような透明な導電性薄膜が形成されたフィルム基材
の他方の面には、透明な粘着剤層を介して外表面に撥水
およびlちれ防止処理層を有する透明基体が貼り合わさ
れる。この貼り合わせば、透明基体の内表面、つまり透
明基体における撥水および汚れ防止処理層を設けた面と
は反対側の面に上記の粘着剤層を設けておき、これに」
1記のフィルム基材を貼り合わせるようにしてもよいし
、逆にフィルム基材の方に上記の粘着剤層を設りておき
、これに外表面に撥水およびlηれ防止処理層を有する
透明基体を貼り合わせるようにしてもよい。
On the other side of the film substrate on which such a transparent conductive thin film is formed, a transparent substrate having a water-repellent and anti-chip treatment layer on the outer surface is bonded via a transparent adhesive layer. . When this is pasted together, the above-mentioned adhesive layer is provided on the inner surface of the transparent substrate, that is, the surface opposite to the surface on which the water-repellent and anti-stain treatment layer is provided, and then
The film base materials described in 1 may be laminated together, or conversely, the above-mentioned adhesive layer may be provided on the film base material, and this has a water-repellent and anti-scratch treated layer on the outer surface. Transparent substrates may also be bonded together.

後者の方法は、粘着剤層の形成をフィルム基材をロール
状にして連続的に行うことができるから、生産性の面で
より有利である。
The latter method is more advantageous in terms of productivity because the adhesive layer can be formed continuously by rolling the film base material.

粘着剤層としては、透明性を有するものであれば特に制
限なく使用でき、たとえばアクリル系粘着剤、シリコー
ン系粘着剤、ゴム系粘着剤などが用いられる。この粘着
剤層は、透明基体の接着後そのクツション効果によりフ
ィルム基材の一方の面に設けられた導電性薄膜の耐擦傷
性および打点特性を向上させる機能を有するものであり
、主としてこの機能をより良く発揮させる観点から、そ
の弾性係数をI X 1.05〜I X 107dyn
 /Cntの範囲、厚さを]、 p m以上、通常5〜
100μmの範囲に設定するのが望ましい。
As the adhesive layer, any material can be used without particular limitation as long as it has transparency; for example, acrylic adhesives, silicone adhesives, rubber adhesives, etc. are used. This adhesive layer has the function of improving the scratch resistance and dot characteristics of the conductive thin film provided on one side of the film base material by its cushioning effect after adhesion of the transparent substrate, and is mainly used for this function. From the viewpoint of achieving better performance, the elastic modulus should be set at I x 1.05 to I x 107 dyn.
/Cnt range, thickness], p m or more, usually 5 ~
It is desirable to set it within a range of 100 μm.

」1記の弾性係数がI X 1.05dyn /cnt
未満となると、粘着剤層は非弾性となるため、加圧によ
り容易に変形してフィルム基材ひいては導電性薄膜に凹
凸を生じさせ、また加工切断面からの粘着剤のはみ出し
などが生じやすくなり、そのうえ耐擦傷性および打点特
性の向上効果が低減する。一方、弾性係数がI X 1
07dyn /ct&を超えると、粘着剤層が硬くなり
、そのクツション効果を期待できなくなるため、面]擦
傷性および打点特性を向上できない。
” The elastic modulus of No. 1 is I x 1.05dyn/cnt
If it is less than that, the adhesive layer becomes inelastic and is easily deformed by pressure, causing unevenness in the film base material and eventually the conductive thin film, and the adhesive tends to protrude from the processed cut surface. Moreover, the effect of improving scratch resistance and dot characteristics is reduced. On the other hand, the elastic modulus is I
If it exceeds 07 dyn/ct&, the adhesive layer becomes hard and its cushioning effect cannot be expected, so that surface scratch resistance and dot properties cannot be improved.

また、粘着剤層の厚さが1μm未満となると、そのクツ
ション効果をやはり期待できないため、耐擦傷性および
打点特性の向上を望めなくなる。
Further, if the thickness of the adhesive layer is less than 1 μm, the cushioning effect cannot be expected, and therefore, it is impossible to expect improvement in scratch resistance and dot characteristics.

なお、厚くしすぎると、透明性を損なったり、粘着剤層
の形成や透明基体の貼り合わせ作業性さらにコストの面
で好結果を得にくい。
Note that if the thickness is too thick, transparency may be impaired, and good results may be difficult to obtain in terms of workability in forming the adhesive layer, laminating transparent substrates, and cost.

このような粘着剤層を介して貼り合わされる透明基体は
、フィルム基材に対して良好な機械的強度を付与し、特
にカールなどの発生防止に寄与するものであり、これを
貼り合わせたのちにおいても可撓性であることが要求さ
れる場合は、通常6〜300μm程度のプラスチックフ
ィルムが、可撓性が特に要求されない場合は、通常0.
05〜10顛程度のガラス板やフィルム状ないし板状の
プラスチックが、それぞれ用いられる。プラスチックの
材質としては、前記したフィルム基材と同様のものが挙
げられる。
The transparent substrates bonded together through such an adhesive layer provide good mechanical strength to the film base material, and particularly contribute to the prevention of curling. When flexibility is required, the plastic film is usually about 6 to 300 μm, and when flexibility is not particularly required, the plastic film is usually about 0.5 μm.
A glass plate or a film-like or plate-like plastic having a size of about 0.5 to 10 mm is used. Examples of the plastic material include the same materials as the film base material described above.

この発明において、上記の透明基体の外表面に設けられ
る撥水および汚れ防止処理層は、基体表面への撥水性の
付与により指紋その他の汚れの発生を防止することを目
的としたものであり、またこの層の形成により表面傷の
発生防止やまぶしさの低減にも好結果を得るものである
In this invention, the water-repellent and anti-stain treatment layer provided on the outer surface of the transparent substrate is intended to prevent fingerprints and other stains from forming by imparting water repellency to the surface of the substrate, The formation of this layer also provides good results in preventing surface scratches and reducing glare.

このような↑Ω水および汚れ防止処理層を形成するため
の材料としては、たとえ(ボ水酸基またはビニル基を含
有するジメチルポリシロキザンとメチルハイドロジエン
ポリシロキサンとの組み合わせなどからなるシリコーン
含有化合物、ポリテトラフルオロエチレン(四フフ化樹
脂)、ホリクロロトリフルオロエチレンく三フフ化樹脂
)などのフン素糸樹脂のほか、硫化モリブデン(M o
 S z )などが挙げられ、これらを単独でまたは化
合物として用いることができる。
Examples of materials for forming such a ↑Ω water and stain prevention treatment layer include silicone-containing compounds such as a combination of dimethylpolysiloxane and methylhydrodienepolysiloxane containing a hydroxyl group or a vinyl group; In addition to fluorine fiber resins such as polytetrafluoroethylene (tetrafluoroethylene) and polychlorotrifluoroethylene (trifluoroethylene), molybdenum sulfide (Mo
S z ), etc., and these can be used alone or as a compound.

また、上記処理層の密着性および硬度向上を目的として
、上述の材料をさらにメラニン系樹脂、ウレタン系樹脂
、アルキド系樹脂、アクリル系樹脂、シリコン系樹脂な
どの硬化型樹脂に分散結着させ、これを基体表面に硬化
膜層として設けてもよい。さらに、このような硬化膜層
中には粒径2〜30μm程度のシリカ粒子を分散させる
ことにより、防眩効果や耐擦傷性の向上を図るようにし
てもよい。
In addition, in order to improve the adhesion and hardness of the treated layer, the above-mentioned materials are further dispersed and bonded to a curable resin such as melanin-based resin, urethane-based resin, alkyd-based resin, acrylic-based resin, silicone-based resin, etc. This may be provided as a cured film layer on the surface of the substrate. Furthermore, the anti-glare effect and scratch resistance may be improved by dispersing silica particles having a particle size of about 2 to 30 μm in such a cured film layer.

この撥水および汚れ防止処理層の形成法は、特に限定さ
れず、用いる材料に応じて、塗工法、スプレー法、真空
蒸着法、スパッタリング法、イオンブレーティング法、
焼付法などのいずれの方法で形成してもよい。
The method of forming this water-repellent and anti-stain layer is not particularly limited, and depending on the material used, coating method, spray method, vacuum evaporation method, sputtering method, ion blating method, etc.
It may be formed by any method such as a baking method.

このような処理層の厚みとしては、通常50人〜100
μm、特に100人〜50μm程度であるのがよい。薄
ずぎると連続膜となりにくいため撥水効果に劣り、逆に
厚くなりすぎると使用中にクラックが生じるおそれがあ
る。
The thickness of such a treatment layer is usually 50 to 100 mm.
The thickness is preferably about 100 to 50 μm. If it is too thin, it will be difficult to form a continuous film, resulting in poor water repellency; if it is too thick, cracks may occur during use.

なお、このような撥水および汚れ防止処理層の形成に先
立って、被着面、ずなわち透明基体の表面に対し、前処
理としてコロナ放電処理、紫外線照射処理、プラズマ処
理、スパッタエツチング処理、プライマ処理、易接着処
理を施してもよく、これにより透明基体と撥水および汚
れ防止処理層との密着性を高めることができる。
In addition, prior to forming such a water-repellent and anti-stain treatment layer, the surface to be adhered to, that is, the surface of the transparent substrate, is subjected to pretreatments such as corona discharge treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, Primer treatment and adhesion-promoting treatment may be performed, thereby increasing the adhesion between the transparent substrate and the water-repellent and stain-prevention treatment layer.

第1図および第2回は、この発明の透明導電性積層体の
二つの例を示したものであり、両図中、2は透明なフィ
ルム基材1の一面に設けられた透明な導電性薄膜、4は
上記基材1の他面側に透明な粘着剤層3を介して貼り合
わされた透明基体であって、その露出表面に前記の18
水および汚れ防止処理層5が形成されでいる。
Figures 1 and 2 show two examples of the transparent conductive laminate of the present invention, and in both figures, 2 is a transparent conductive layer provided on one side of the transparent film base 1. The thin film 4 is a transparent substrate bonded to the other side of the base material 1 via a transparent adhesive layer 3, and the exposed surface is coated with the above 18.
A water and stain prevention treatment layer 5 has been formed.

透明基体4は、第1図に示す単層構造のほか、第2図に
示すように、2枚の透明な基体フィルム40.4.1を
透明な粘着剤層30により貼り合わせた複合構造として
、積層体全体の機械的強度などをより向」ニさせてもよ
い。上記の基体フィルム40.41および粘着剤層30
ば、それぞれ透明基体4および粘着剤層3につき説明し
たのと同様の材料からなるものが用いられる。
In addition to the single-layer structure shown in FIG. 1, the transparent substrate 4 can have a composite structure in which two transparent substrate films 40.4.1 are bonded together with a transparent adhesive layer 30, as shown in FIG. , the mechanical strength of the entire laminate may be further improved. The above base film 40, 41 and adhesive layer 30
For example, materials made of the same materials as those described for the transparent substrate 4 and the adhesive layer 3 are used.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明においては、フィルム基材とし
て特定厚みのものを用いて、その一方の面に透明な導電
性薄膜を形成する一方、他方の面に透明な粘着剤層を介
して外表面に撥水および汚れ防止処理層を有する透明基
体を貼り合わせる構成としたことにより、上記粘着剤層
のクツション効果に基づいて耐擦傷性および打点特性に
すくれるうえに、上記撥水および汚れ防止処理層によっ
て指紋その他の汚れが少なくなり、また傷やまぶしさの
低減効果も期待できるために、視認性の改良された透明
導電性積層体を提供できるという格別の効果が奏し得ら
れるものである。
As described above, in this invention, a film base material having a specific thickness is used, and a transparent conductive thin film is formed on one side of the film base material, while an external film is formed on the other side through a transparent adhesive layer. By laminating a transparent substrate with a water-repellent and stain-prevention treatment layer on the surface, it not only improves scratch resistance and dot properties based on the cushioning effect of the adhesive layer, but also provides the water-repellent and stain-prevention properties. The treated layer reduces fingerprints and other stains, and can also be expected to reduce scratches and glare, making it possible to provide a transparent conductive laminate with improved visibility. .

〔実施例〕〔Example〕

以下に、この発明の実施例を記載してより具体的に説明
する。
EXAMPLES Below, examples of the present invention will be described in more detail.

実施例1 厚さ力月2μmの透明なポリエチレンテレフタレート(
以下、PETという)フィルムからなるフィルム基材の
一方の面に、アルゴンガス80%と酸素ガス20%とか
らなる4、X1O−3Torrの雰囲気中で、インジウ
ム−スズ合金を用いた反応性スパッタリング法により、
厚ざ400人の酸化インジウムと酸化ススとの複合酸化
物からなる透明な導電性薄膜(以下、ITO薄膜という
)を形成した。
Example 1 Transparent polyethylene terephthalate (2 μm thick)
A reactive sputtering method using an indium-tin alloy on one side of a film base material made of a film (hereinafter referred to as PET) in an atmosphere of 4,X1O-3 Torr consisting of 80% argon gas and 20% oxygen gas. According to
A transparent conductive thin film (hereinafter referred to as an ITO thin film) made of a composite oxide of indium oxide and soot oxide with a thickness of 400 mm was formed.

つぎに、上記PETフィルムの他方の面に、弾性係数が
I X I O’ dyn /cAに調整されたアクリ
ル系の透明な粘着剤層(アクリル酸ブチルとアクリル酸
と酢酸ビニルとの重量比1. OO: 2 : 5のア
クリル系共重合体100重量部にイソシアネト系架橋剤
を1重量部配合させてなるもの)を約20μmの厚さに
形成して、導電処理フィルムとした。
Next, on the other side of the PET film, a transparent acrylic adhesive layer (with a weight ratio of butyl acrylate, acrylic acid, and vinyl acetate of 1) whose elastic modulus was adjusted to I A film prepared by blending 1 part by weight of an isocyanate crosslinking agent with 100 parts by weight of an acrylic copolymer (OO: 2:5) was formed to a thickness of about 20 μm to obtain a conductive treated film.

一方、厚さ75μmのPETフィルムからなる透明基体
の片面に、フッ素樹脂としてのポリテトラフルオロエチ
レンを真空度lXl0−’Torrの条件で真空蒸着す
ることにより、厚さ約0.1μmの1Ω水および汚れ防
止処理層を形成した。
On the other hand, polytetrafluoroethylene as a fluororesin was vacuum-deposited on one side of a transparent substrate made of PET film with a thickness of 75 μm at a vacuum degree of lXl0-'Torr, and 1Ω water and A stain prevention treatment layer was formed.

つぎに、この透明基体の上記撥水および汚れ防止処理層
とは反対側の面を前記の導電処理フィルムにその透明な
粘着剤層を介して貼り合わせることにより、第1図に示
す構造の透明導電性積層フィルムを作製した。
Next, the surface of this transparent substrate opposite to the water-repellent and stain-preventing treated layer is bonded to the conductive treated film via the transparent adhesive layer, thereby creating a transparent structure as shown in FIG. A conductive laminated film was produced.

実施例2 厚さ50μmのPETフィルムからなる透明基体の片面
に、トルエンで希釈したアクリル樹脂中にフッ素含有化
合物としての旭硝子■製の商品名ザーフロンS(、−1
01(フッ素系表面改質剤)を0.5重量%添加してな
る塗布液を、塗工法により厚み約7μmに塗布乾燥して
、1G水および汚れ防止処理層を形成した。その他は実
施例1と同様にして第1図に示す構造の透明導電性積層
フィルムを作製した。
Example 2 On one side of a transparent substrate made of a PET film with a thickness of 50 μm, Zerflon S (trade name: -1, manufactured by Asahi Glass Co., Ltd.) was applied as a fluorine-containing compound in an acrylic resin diluted with toluene.
A coating solution containing 0.5% by weight of 0.01 (fluorine-based surface modifier) was applied to a thickness of about 7 μm by a coating method and dried to form a 1G water and stain prevention treatment layer. Otherwise, a transparent conductive laminated film having the structure shown in FIG. 1 was produced in the same manner as in Example 1.

実施例3 厚さ50μmのPETフィルムからなる透明基体の片面
に、シリコーン含有化合物としての信越化学工業■製の
商品名KS−770(シリコーン離型剤)を、塗工法に
より厚み約0.3μmに塗布乾燥して、撥水および汚れ
防止処理層を形成した。
Example 3 A silicone-containing compound, trade name KS-770 (silicone mold release agent) manufactured by Shin-Etsu Chemical Co., Ltd., was applied to a thickness of about 0.3 μm by a coating method on one side of a transparent substrate made of a PET film with a thickness of 50 μm. The coating was dried to form a water-repellent and anti-stain layer.

その他は実施例1と同様にして第1図に示す構造の透明
導電性積層フィルムを作製した。
Otherwise, a transparent conductive laminated film having the structure shown in FIG. 1 was produced in the same manner as in Example 1.

実施例4 1・ルエンで希釈したアクリル樹脂中に、フッ素含有化
合物とともに、アクリル樹脂100重量部に対して7重
量部となる割合の数μm程度の粒子径を有するシリカ粒
子を添加するようにした以外は、実施例2と同様にして
第1図に示す構造の透明導電性積層フィルムを作製した
Example 4 1. Silica particles having a particle diameter of several micrometers were added together with a fluorine-containing compound to an acrylic resin diluted with luene at a ratio of 7 parts by weight to 100 parts by weight of the acrylic resin. Except for this, a transparent conductive laminated film having the structure shown in FIG. 1 was produced in the same manner as in Example 2.

比較例1 粘着剤層の形成と撥水および汚れ防止処理層を有する透
明基体の貼り合わせを行わなかった以外は、実施例1と
同様にして透明導電性フィルムを作製した。
Comparative Example 1 A transparent conductive film was produced in the same manner as in Example 1, except that the formation of the adhesive layer and the bonding of the transparent substrate having the water-repellent and anti-stain treatment layer were not performed.

比較例2 透明基体として、撥水および汚れ防止処理層を有さない
厚さ75μmのPETフィルムを用いた以外は、実施例
1と同様にして透明導電性積層フィルムを作製した。
Comparative Example 2 A transparent conductive laminated film was produced in the same manner as in Example 1, except that a 75 μm thick PET film without a water-repellent and anti-staining layer was used as the transparent substrate.

比較例3 トルエンで希釈したアクリル樹脂中にフッ素含有化合物
を添加しなかった以外は、実施例2と同様にして透明導
電性積層フィルムを作製した。
Comparative Example 3 A transparent conductive laminated film was produced in the same manner as in Example 2, except that no fluorine-containing compound was added to the acrylic resin diluted with toluene.

比較例4 トルエンで希釈したアクリル樹脂中にフッ素含有化合物
を添加しなかった以外は、実施例4と同様にして透明導
電性積層フィルムを作製した。
Comparative Example 4 A transparent conductive laminated film was produced in the same manner as in Example 4, except that no fluorine-containing compound was added to the acrylic resin diluted with toluene.

比較例5 フィルム基材として、厚さが125μmのPETフィル
ムを使用した以外は、実施例1と同様にして透明導電性
積層フィルムを作製した。
Comparative Example 5 A transparent conductive laminated film was produced in the same manner as in Example 1, except that a PET film with a thickness of 125 μm was used as the film base material.

以上の実施例1〜4および比較例2〜5で作製した各透
明導電性積層フィルムならびに比較例1で作製した透明
導電性フィルムにつき、その表面抵抗、光線透過率、耐
擦傷性、打点特性および視認性を、下記の要領で調べた
。その結果は後記の表に示されるとおりであった。
The surface resistance, light transmittance, scratch resistance, dot characteristics and Visibility was examined as follows. The results were as shown in the table below.

〈表面抵抗〉 四端子法にてフィルム抵抗を測定した。<Surface resistance> Film resistance was measured using the four-terminal method.

〈光線透過率〉 島津製作所製の分光分析装置UV−240を用いて、光
波長550nmにおける可視光線透過率を測定した。
<Light transmittance> Visible light transmittance at a light wavelength of 550 nm was measured using a spectroscopic analyzer UV-240 manufactured by Shimadzu Corporation.

く耐擦傷性〉 新来科学社製のヘイトン表面性測定機TYPEHEID
ON14を用いて、■擦傷子:ガーゼ(日本薬局方タイ
プ■)、■荷重: 100 g/cI。
Scratch resistance〉 Hayton surface property measuring device TYPEHEID manufactured by Shinraikagakusha
Using ON14, ■Abrasion: Gauze (Japanese Pharmacopoeia type■), ■Load: 100 g/cI.

■擦傷速度:3Qcm/分、■擦傷回数:100回(往
復50回)の条件で、導電性薄膜表面を擦ったのちにフ
ィルム抵抗(Rs)を測定し、初期のフィルム抵抗(R
o)に対する変化率(Rs/RO)を求めて、耐擦傷性
を評価した。
■ Scratch speed: 3Qcm/min ■ Number of scratches: 100 times (50 round trips) After rubbing the surface of the conductive thin film, the film resistance (Rs) was measured, and the initial film resistance (Rs) was measured.
Scratch resistance was evaluated by determining the rate of change (Rs/RO) with respect to o).

〈打点特性〉 2枚の透明導電性積層フィルム(または透明導電性フィ
ルム)を厚さ100メ!mのスペーサを介して導電性薄
膜同志が向かい合うように対向配置し、一方のフィルム
(の↑Ω水および汚れ防止処理層を有する透明基体また
はフィルム基材)側より、硬度40度のウレタンゴムか
らなるロッド(鍵先7R)を用いて荷重100gで10
0万回のセンター打点を行ったのち、フィルム抵抗(R
d)を測定し、初期のフィルム抵抗(Ro)に対する変
化率(Rd/RO)を求めて、打点特性を評価した。な
お、フィルム抵抗の測定は、上記対向配置した2枚の透
明導電性積層フィルム(または透明導電性フィルム)の
打点時の接触抵抗について行ったものである。
<Dot characteristics> Two transparent conductive laminated films (or transparent conductive films) with a thickness of 100 meters! The conductive thin films are arranged to face each other through a spacer of 40 mm, and from the side of one film (the transparent substrate or film base material having the ↑Ω water and stain prevention treatment layer) side, the conductive thin films are made of 40 degree hardness urethane rubber. 10 with a load of 100g using a rod (key tip 7R)
After performing 00,000 center hits, the film resistance (R
d) was measured, and the rate of change (Rd/RO) with respect to the initial film resistance (Ro) was determined to evaluate the dot characteristics. The film resistance was measured by measuring the contact resistance of the two transparent conductive laminated films (or transparent conductive films) placed opposite each other at the point of impact.

〈視認性〉 透明導電性積層フィルム(または透明導電性フィルム)
における導電性薄膜表面とは反対側の面について、その
撥水性、擦傷性および光沢度を以下の要領で調べること
により、フィルム全体の視認性を評価した。
<Visibility> Transparent conductive laminated film (or transparent conductive film)
The visibility of the entire film was evaluated by examining the water repellency, scratch resistance, and glossiness of the surface opposite to the conductive thin film surface in the following manner.

918水性 協和界面科学源のCNTACT−ANGLEMETAR
(形式CA’−DT)を用いて、水の接触角θを測定し
た。
918 CNTACT-ANGLEMETAR of aqueous consonant interface science
(Format CA'-DT) was used to measure the contact angle θ of water.

S擦傷性 スチールウール#OOOOでこする擦傷試験を行い、そ
の表面状況の変化を目視観察して、つぎの三段階の評価
を行った。
An abrasion test was conducted by rubbing with S abrasion steel wool #OOOO, and changes in the surface condition were visually observed and evaluated on the following three levels.

A・・・強くこすってもほとんど傷がつかないB・・・
強くこすると傷がつく C・・・軽くこするだけで傷がつく 9光沢度 スガ試験機社製の変角光度計UGV−5Dを用いて、6
0度光沢度を測定した。
A... Even if you rub it hard, there will be almost no damage B...
C: Scratches occur when rubbed too hard C: Scratches occur when rubbed lightly 9 Glossiness Using a variable angle photometer UGV-5D manufactured by Suga Test Instruments Co., Ltd., 6
The 0 degree gloss was measured.

」−記表の結果から明らかなように、この発明の透明導
電性積層フィルムは、高い光線透過率と、フィルム裏面
のすくれた撥水および汚れ防止性に基づいて良好な視認
性が得られると同時に、導電性薄膜表面の耐擦傷性およ
び打点特性にも非常にずくれたものであることがわかる
” - As is clear from the results shown in the table, the transparent conductive laminated film of the present invention provides good visibility based on high light transmittance and the low water repellency and stain resistance of the film backside. At the same time, it can be seen that the scratch resistance and dot characteristics of the surface of the conductive thin film are also very poor.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の透明導電性積層体の一例を示す断面
図、第2図はこの発明の透明導電性積層体の他の例を示
す断面図である。 ■・・・フィルム基材、2・・・導電性薄膜、3・・・
粘着剤層、4・・・透明基体、5・・・撥水および汚れ
防止処理層 特許出願人  日東電工株式会社 第1図 第2図 透明tJフィルム路イオ 透明づ通配・鵬腹 透明rJ粘着清IJ層 透明E体
FIG. 1 is a sectional view showing one example of the transparent conductive laminate of the present invention, and FIG. 2 is a sectional view showing another example of the transparent conductive laminate of the invention. ■... Film base material, 2... Conductive thin film, 3...
Adhesive layer, 4...Transparent substrate, 5...Water repellent and stain prevention treatment layer Patent applicant: Nitto Denko Co., Ltd. Clear IJ layer transparent E body

Claims (2)

【特許請求の範囲】[Claims] (1)厚さが2〜120μmの透明なフィルム基材の一
方の面に膜厚が50Å以上の透明な導電性薄膜を形成し
、他方の面に透明な粘着剤層を介して外表面に撥水およ
び汚れ防止処理層を有する透明基体を貼り合わせてなる
透明導電性積層体。
(1) A transparent conductive thin film with a thickness of 50 Å or more is formed on one side of a transparent film base material with a thickness of 2 to 120 μm, and a transparent conductive thin film is formed on the other side via a transparent adhesive layer. A transparent conductive laminate made by laminating transparent substrates each having a water-repellent and stain-proofing layer.
(2)透明な粘着剤層の弾性係数が1×10^5〜1×
10^7dyn/cm^2、厚みが1μm以上である請
求項(1)に記載の透明導電性積層体。
(2) The elastic modulus of the transparent adhesive layer is 1×10^5 to 1×
10^7 dyn/cm^2 and a thickness of 1 μm or more, the transparent conductive laminate according to claim 1.
JP9339289A 1989-04-13 1989-04-13 Transparent conductive laminate Expired - Lifetime JP2714124B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9339289A JP2714124B2 (en) 1989-04-13 1989-04-13 Transparent conductive laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9339289A JP2714124B2 (en) 1989-04-13 1989-04-13 Transparent conductive laminate

Publications (2)

Publication Number Publication Date
JPH02273409A true JPH02273409A (en) 1990-11-07
JP2714124B2 JP2714124B2 (en) 1998-02-16

Family

ID=14081038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9339289A Expired - Lifetime JP2714124B2 (en) 1989-04-13 1989-04-13 Transparent conductive laminate

Country Status (1)

Country Link
JP (1) JP2714124B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216842A (en) * 2000-02-03 2001-08-10 Toyobo Co Ltd Transparent conductive film, transparent conductive sheet and touch panel
JP2002245858A (en) * 2001-02-16 2002-08-30 Hs Planning:Kk Transparent conductive laminated body
WO2005106897A1 (en) * 2004-04-30 2005-11-10 Nitto Denko Corporation Transparent conductive multilayer body and touch panel
JP2007188880A (en) * 2006-12-18 2007-07-26 Toyobo Co Ltd Manufacturing method of transparent conductive film, and touch panel
KR100830385B1 (en) * 2004-04-30 2008-05-19 닛토덴코 가부시키가이샤 Transparent conductive multilayer body and touch panel

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4055378B2 (en) * 2001-07-06 2008-03-05 松下電器産業株式会社 Touch panel switch

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104764A (en) * 1982-12-03 1984-06-16 Canon Inc Liquid crystal display keyboard
JPS63208115A (en) * 1987-02-25 1988-08-29 Seiko Epson Corp Input device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104764A (en) * 1982-12-03 1984-06-16 Canon Inc Liquid crystal display keyboard
JPS63208115A (en) * 1987-02-25 1988-08-29 Seiko Epson Corp Input device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216842A (en) * 2000-02-03 2001-08-10 Toyobo Co Ltd Transparent conductive film, transparent conductive sheet and touch panel
JP2002245858A (en) * 2001-02-16 2002-08-30 Hs Planning:Kk Transparent conductive laminated body
WO2005106897A1 (en) * 2004-04-30 2005-11-10 Nitto Denko Corporation Transparent conductive multilayer body and touch panel
KR100830385B1 (en) * 2004-04-30 2008-05-19 닛토덴코 가부시키가이샤 Transparent conductive multilayer body and touch panel
US8097330B2 (en) 2004-04-30 2012-01-17 Nitto Denko Corporation Transparent conductive multilayer body and touch panel
US8481150B2 (en) 2004-04-30 2013-07-09 Nitto Denko Corporation Transparent conductive multilayer body and touch panel
JP2007188880A (en) * 2006-12-18 2007-07-26 Toyobo Co Ltd Manufacturing method of transparent conductive film, and touch panel

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