JPH0226235U - - Google Patents

Info

Publication number

JPH0226235U

JPH0226235U JP10423088U JP10423088U JPH0226235U JP H0226235 U JPH0226235 U JP H0226235U JP 10423088 U JP10423088 U JP 10423088U JP 10423088 U JP10423088 U JP 10423088U JP H0226235 U JPH0226235 U JP H0226235U

Authority

JP

Japan

Prior art keywords

copper

semiconductor package

base

gallium arsenide

deposited

Prior art date

1988-08-05

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 239000004065 semiconductor Substances 0.000 claims description 7
• JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 2
• 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
• 229910052802 copper Inorganic materials 0.000 claims 2
• 239000010949 copper Substances 0.000 claims 2
• 229910000881 Cu alloy Inorganic materials 0.000 claims 1
• 229910001080 W alloy Inorganic materials 0.000 claims 1
• SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
• 239000000919 ceramic Substances 0.000 description 1