JPH0225772B2 - - Google Patents
Info
- Publication number
- JPH0225772B2 JPH0225772B2 JP60020734A JP2073485A JPH0225772B2 JP H0225772 B2 JPH0225772 B2 JP H0225772B2 JP 60020734 A JP60020734 A JP 60020734A JP 2073485 A JP2073485 A JP 2073485A JP H0225772 B2 JPH0225772 B2 JP H0225772B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- thermoplastic resin
- resin
- low melting
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 238000002844 melting Methods 0.000 claims description 27
- 230000008018 melting Effects 0.000 claims description 26
- 229920005992 thermoplastic resin Polymers 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 239000004033 plastic Substances 0.000 description 20
- 229920003023 plastic Polymers 0.000 description 20
- 239000004020 conductor Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000001125 extrusion Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229920000554 ionomer Polymers 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000001883 metal evaporation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007592 spray painting technique Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 101700004678 SLIT3 Proteins 0.000 description 1
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/30—Extrusion nozzles or dies
- B29C48/305—Extrusion nozzles or dies having a wide opening, e.g. for forming sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
- B29C48/156—Coating two or more articles simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/30—Extrusion nozzles or dies
- B29C48/304—Extrusion nozzles or dies specially adapted for bringing together components, e.g. melts within the die
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
- B29C48/08—Flat, e.g. panels flexible, e.g. films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
- Insulating Bodies (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は低融点金属層を含む熱可塑性樹脂シー
ト(以下単に樹脂シートと称する)の製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a thermoplastic resin sheet (hereinafter simply referred to as a resin sheet) containing a low melting point metal layer.
近年のデイジタル電子機器の急速な普及さらに
は、筐体のプラスチツク化に伴ない、デイジタル
電子機器の作動あるいはその他の原因によつて発
生するノイズが、他のデイジタル電子機器の信号
となり、誤動作の原因となる電磁波障害が問題と
なつている。このためデイジタル電子機器からの
ノイズの漏洩の防止およびデイジタル電子機器の
回路のノイズからの保護のための電磁波シールド
材が注目されており、その製造方法としてプラス
チツクの導電化技術が注目されている。 With the rapid spread of digital electronic devices in recent years and the shift to plastic housings, noise generated by the operation of digital electronic devices or for other reasons can become a signal to other digital electronic devices, causing malfunctions. Electromagnetic interference has become a problem. For this reason, electromagnetic shielding materials for preventing noise leakage from digital electronic devices and protecting the circuits of digital electronic devices from noise are attracting attention, and as a method for manufacturing such materials, technology for making conductive plastics is attracting attention.
本発明によつて得られる樹脂シートはその中心
層に低融点金属層を含んでいるため高度の導電性
を示し、プラスチツク材料への導電性付与技術と
して電磁波シールド材等の電子機器用材料をはじ
めとする広範囲な分野において応用が可能であ
る。 The resin sheet obtained by the present invention has a low melting point metal layer in its center layer, so it exhibits a high degree of conductivity, and can be used as a technology for imparting conductivity to plastic materials, including materials for electronic devices such as electromagnetic shielding materials. It can be applied in a wide range of fields.
現在までに、提案あるいは実施されているプラ
スチツクを基材とした電磁波シールド材の製造技
術としては、亜鉛溶射,導電性塗料,金属蒸着,
化学メツキ等の表面処理による方法と、プラスチ
ツクと金属などの導電性材料の微細繊維,粒子,
薄片などとの混合によつて複合材料とする方法が
ある。
To date, the manufacturing technologies for plastic-based electromagnetic shielding materials that have been proposed or implemented include zinc spraying, conductive paint, metal vapor deposition,
surface treatment methods such as chemical plating, and fine fibers, particles, etc. of conductive materials such as plastics and metals.
There is a method of making a composite material by mixing it with flakes or the like.
また、特殊な化学構造によつてプラスチツク自
体が導電性を発現する導電性ポリマーも開発され
つつある。 Furthermore, conductive polymers are being developed in which the plastic itself exhibits conductivity due to its special chemical structure.
しかし、現在実用化されている技術も含めてい
ずれの方法においてもいくつかの問題点が残され
ている。 However, some problems remain in all methods, including those currently in practical use.
一般に電磁波シールド材には高度の導電性が安
定して発現することが要求される。
Generally, electromagnetic shielding materials are required to stably exhibit a high degree of conductivity.
亜鉛溶射法は比較的低コストで良好なシールド
効果が得られるため、従来から最も一般的なプラ
スチツクに対する導電性付与技術であつたが、プ
ラスチツク表面と溶射層との密着性不良による溶
射層の剥離に起因する経時的な性能の低下が電子
機器の回路破壊などが問題となつているほかなに
よりも亜鉛溶射の際に、作業環境が著しく悪化す
ることから、他の手段への代替が望まれている。
導電性塗料は、従来と同様の吹付け塗装により、
プラスチツク成形体に導電性を付与できるもの
の、この吹付け塗装が円滑に行なわれ、しかもプ
ラスチツク表面に形成された塗料の薄膜が高度の
導電性を示し、経時的な性能の低下をきたさない
ようにするには、酸化されにくいニツケルが貴金
属あるいは特殊な酸化防止処理を施した銅やアル
ミ等の非常に微細なフイラーをバインダーに対し
て高い添加率で分散させた塗料が必要となるが、
このような性能を持つ金属フイラーを安価にかつ
多量に供給する技術はまだ確立されていないた
め、導電性塗料自体も汎用されるに至つていな
い。 Zinc thermal spraying has traditionally been the most common conductivity imparting technology for plastics, as it provides a good shielding effect at a relatively low cost. The deterioration of performance over time caused by zinc spraying has caused problems such as circuit damage in electronic equipment, and above all, the work environment has deteriorated significantly during zinc spraying, so it is desirable to use other methods as an alternative. ing.
The conductive paint is applied by spray painting in the same way as before.
Although electrical conductivity can be imparted to plastic molded objects, it is important to ensure that this spray painting is carried out smoothly and that the thin film of paint formed on the plastic surface exhibits a high degree of electrical conductivity so that performance does not deteriorate over time. In order to do this, a paint containing nickel, which is resistant to oxidation, is dispersed in a binder with a high additive rate of precious metals, or very fine fillers such as copper or aluminum that have undergone special oxidation prevention treatment.
Since the technology for supplying metal fillers with such performance at low cost and in large quantities has not yet been established, the conductive paint itself has not yet come into widespread use.
金属蒸着は設備が高価な上に多くの工程を必要
とするため、量産には適さず化学メツキについて
も金属蒸着と同様の状況にあり、しかも使用でき
る樹脂が限定されるといつた問題も残されてい
る。 Metal evaporation requires expensive equipment and many processes, making it unsuitable for mass production.The situation with chemical plating is similar to that of metal evaporation, and the problem remains that the resins that can be used are limited. has been done.
表面処理によるプラスチツク成形体への導電性
の付与技術はいずれも二次加工によつて、プラス
チツク表面に導電性の薄層を形成させるものであ
るが、これに対してプラスチツクに金属の微細繊
維等の導電性材料を混合して得られる複合材料
は、プラスチツク中に導電性材料が分散されてい
るので、プラスチツク表面に導電層が現われてい
る場合と比較して導電層の破壊や酸化による性能
の低下、あるいは導電層の剥離による電子機器へ
の悪影響などの心配が少ない。 All techniques for imparting conductivity to plastic molded bodies through surface treatment involve forming a conductive thin layer on the plastic surface through secondary processing. Composite materials obtained by mixing conductive materials have the conductive materials dispersed in the plastic, so compared to cases where the conductive layer appears on the surface of the plastic, there is less chance of performance degradation due to destruction or oxidation of the conductive layer. There is less worry about negative effects on electronic devices due to deterioration or peeling of the conductive layer.
しかし、複合材料とした場合導電性材料はプラ
スチツク全体に分散されていることから高度の導
電性を付与するには、表面処理による場合と比較
して、多量の導電性材料を添加する必要がある。 However, in the case of composite materials, the conductive material is dispersed throughout the plastic, so in order to impart a high degree of conductivity, it is necessary to add a large amount of conductive material compared to when surface treatment is used. .
しかし、導電性の微細繊維やフイラー等を可塑
化させたプラスチツクに添加するとその添加量の
増加にともない、プラスチツク組成物の見掛け上
の粘度が急速に上昇する。このため混練などの工
程において導電性材料のプラスチツク中への均一
な分散が困難となるだけでなく、均一な分散を達
成するために混練を強化すると導電性材料に作用
するせん断力が増加するため、導電性材料の破壊
が顕著となり、金属微細繊維などではそのアスペ
クト比が著しく低下して、予期した様な導電性付
与効果が得られない場合が多い。 However, when conductive fine fibers, fillers, etc. are added to plasticized plastic, the apparent viscosity of the plastic composition increases rapidly as the amount added increases. This not only makes it difficult to uniformly disperse the conductive material into the plastic during processes such as kneading, but also increases the shear force acting on the conductive material when kneading is strengthened to achieve uniform dispersion. , the destruction of the conductive material becomes noticeable, and the aspect ratio of fine metal fibers and the like decreases significantly, so that in many cases, the expected effect of imparting conductivity cannot be obtained.
また、導電性付与効果が大きい金属微細繊維
や、カーボン繊維等はその生産性が低いため高価
な材料となつてしまうので、導電性塗料と同様に
これらの導電性材料を添加した複合材料も汎用プ
ラスチツクと比較してかなり高価となつてしま
う。 In addition, fine metal fibers and carbon fibers, which have a large effect on imparting conductivity, have low productivity and become expensive materials, so composite materials containing these conductive materials are also used for general purpose use, similar to conductive paints. It is quite expensive compared to plastic.
またプラスチツク自体がその特殊な化学構造に
よつて導電性を示す導電性ポリマーについても電
磁波シールド材に使用できる程度の高い導電性を
示し、かつ汎用可能な価格の材料は研究途上にあ
るのが現状である。 Furthermore, regarding conductive polymers, in which plastic itself exhibits electrical conductivity due to its special chemical structure, research is currently underway to find a material that exhibits high enough electrical conductivity to be used in electromagnetic shielding materials and is affordable enough for general use. It is.
本発明はその手法の特殊性により高い導電性を
示すプラスチツク材料を安価に供給できる製造方
法を提供するものである。 The present invention provides a manufacturing method that can supply a plastic material exhibiting high conductivity at a low cost due to the special nature of the method.
本発明は押出し用ダイスのダイススリツトの手
前に溶融低融点金属または合金(以下単に低融点
金属と称する)の注入用のスリツトを設けて、使
用する低融点金属の融点以上の温度に加熱した熱
可塑性樹脂をダイス内へ注入しながら、溶融低融
点金属をスリツトから熱可塑性樹脂の流束中へ連
続的に注入して、熱可塑性樹脂の流束中で溶融低
融点金属層を形成させながら押し出した後、これ
を引き取りながら冷却して熱可塑性樹脂中に低融
点金属層を形成させることによつて得られる樹脂
シートの製造方法である。
In the present invention, a slit for injecting a molten low melting point metal or alloy (hereinafter simply referred to as low melting point metal) is provided in front of the die slit of an extrusion die, and the thermoplastic material is heated to a temperature higher than the melting point of the low melting point metal to be used. While injecting the resin into the die, molten low melting point metal was continuously injected from the slit into the thermoplastic resin flux, and extruded while forming a molten low melting point metal layer in the thermoplastic resin flux. This is a method for manufacturing a resin sheet obtained by cooling the thermoplastic resin while taking it away to form a low melting point metal layer in the thermoplastic resin.
本発明で用いられる熱可塑性樹脂は通常の押出
し成形および加熱成形に使用可能な脂であれば、
特に制約されるものではない。このような熱可塑
性樹脂として例えばポリオレフイン系,ポリスチ
レン系,ポリ塩化ビニル系,ポリアクリル酸エス
テル系,ポリメタアクリル酸エステル系,ポリア
クリロニトリル系,ポリブタジエン系,ポリアミ
ド類,ポリエステル類もしくはこれらの変性物,
共重合物,混合物などが挙げられる。これらの熱
可塑性樹脂は、その成形性や成形物の物性により
選択できる。また、熱可塑性樹脂と低融点金属と
の親和性を向上させるため、アイオノマー樹脂を
ブレンドすることができる。アイオノマー樹脂は
5重量部以上ブレンドさせると効果が大きい。ま
た必要に応じてこれらの樹脂組成物に対して酸化
防止剤,安定剤,可塑剤,滑剤等の添加助剤を添
加することができる。 The thermoplastic resin used in the present invention may be any resin that can be used for ordinary extrusion molding and thermoforming.
There are no particular restrictions. Examples of such thermoplastic resins include polyolefins, polystyrenes, polyvinyl chloride, polyacrylic esters, polymethacrylic esters, polyacrylonitrile, polybutadiene, polyamides, polyesters, or modified products thereof,
Examples include copolymers and mixtures. These thermoplastic resins can be selected depending on their moldability and the physical properties of the molded product. Furthermore, in order to improve the affinity between the thermoplastic resin and the low melting point metal, an ionomer resin can be blended. Blending the ionomer resin in an amount of 5 parts by weight or more provides a great effect. Further, additive auxiliaries such as antioxidants, stabilizers, plasticizers, and lubricants may be added to these resin compositions as necessary.
本発明に用いる低融点金属としては熱可塑性樹
脂の押出し成形や加熱成形が可能な温度以下、即
ち400℃以下の融点を有するもので、例えば錫,
鉛,亜鉛,ビスマス,カドミウム,アンチモン等
の単体あるいは合金が挙げられる。 The low melting point metal used in the present invention is one having a melting point below the temperature at which thermoplastic resin extrusion molding or heat molding is possible, that is, below 400°C, such as tin,
Examples include single substances or alloys of lead, zinc, bismuth, cadmium, antimony, etc.
本発明による樹脂シートの製造方法を第1図お
よび第2図に従つてさらに説明する。
The method for manufacturing a resin sheet according to the present invention will be further explained with reference to FIGS. 1 and 2.
低融点金属の融点以上の温度に加熱した熱可塑
性樹脂を押出し機によつてダイス1内へ注入す
る。このとき第1図のように多層押出し成形のよ
うに複数個の注入口から、熱可塑性樹脂を複数個
の流束2として注入するか、あるいは第2図のよ
うに押出し用ダイス内において熱可塑性樹脂の流
束2を一旦複数個に分割した後に、第1図および
第2図のいずれの場合もこれら熱可塑性樹脂の複
数個の流束を低融点金属注入用のスリツト3のダ
イススリツト4側で再び合流させるようにすれば
よい。この熱可塑性樹脂の流束が合流する箇所で
耐熱構造のポンプにより溶融低融点金属注入用ス
リツト3から、溶融低融点金属5を、熱可塑性樹
脂6中へ連続的に注入する。 A thermoplastic resin heated to a temperature equal to or higher than the melting point of the low melting point metal is injected into the die 1 using an extruder. At this time, the thermoplastic resin is injected in multiple fluxes 2 from multiple injection ports as in multilayer extrusion molding, as shown in Figure 1, or the thermoplastic resin is injected in an extrusion die as shown in Figure 2. After the resin flux 2 is once divided into a plurality of parts, in both the cases of FIGS. All you have to do is make them merge again. At the point where the fluxes of the thermoplastic resin merge, the molten low melting point metal 5 is continuously injected into the thermoplastic resin 6 through the molten low melting point metal injection slit 3 using a heat-resistant pump.
可塑化された熱可塑性樹脂の高い粘性のため、
熱可塑性樹脂6中へ注入された溶融低融点金属5
は、熱可塑性樹脂中に支持され、ダイス内面に接
触することなく、溶融低融点金属層を形成する。
この加熱された熱可塑性樹脂組成物を引き取りな
がら、冷却することによつて溶融低融点金属は、
冷却固化され、熱可塑性樹脂の連続体中に、低融
点金属層を含む樹脂シート7が得られる。 Due to the high viscosity of plasticized thermoplastics,
Molten low melting point metal 5 injected into thermoplastic resin 6
is supported in a thermoplastic resin and forms a molten low melting point metal layer without contacting the inner surface of the die.
By taking this heated thermoplastic resin composition and cooling it, the molten low melting point metal is
By cooling and solidifying, a resin sheet 7 containing a low melting point metal layer in a thermoplastic resin continuum is obtained.
下記組成
ABS樹脂(JSR ABS38) 95重量部
アイオノマー樹脂(ハイミラン1652) 5重量部
ステアリン酸鉛 0.1重量部
を有する樹脂組成物を40mmφの押出し機により樹
脂温度200℃に加熱し可塑化した後、200℃に保持
した押出し用ダイス(ダイススリツト0.4cm×20
cm×3cm)内へ注入しながら、ダイス内に装着し
たステンレス製円管に0.1cm×18cmのスリツトを
設けた溶融金属注入装置から200℃に加熱した鉛
―錫合金(融点185℃)をポンプによりダイス内
の樹脂流束中へ連続的に注入して樹脂とともに押
出した後、2本ロールによつて樹脂シートを冷却
しながら、10m/minで引き取り、鉛―錫合金層
を含む樹脂シートを作成した。
A resin composition having the following composition ABS resin (JSR ABS38) 95 parts by weight Ionomer resin (Himilan 1652) 5 parts by weight Lead stearate 0.1 part by weight was heated to a resin temperature of 200°C using a 40 mmφ extruder to plasticize it, and then Extrusion die kept at ℃ (Dice slit 0.4cm x 20
cm x 3 cm) while pumping a lead-tin alloy (melting point: 185°C) heated to 200°C from a molten metal injection device with a 0.1cm x 18cm slit in a stainless steel circular tube installed inside a die. After continuously injecting into the resin flux in the die and extruding it together with the resin, the resin sheet is taken off at 10 m/min while being cooled by two rolls to form a resin sheet containing a lead-tin alloy layer. Created.
引取り後の樹脂シートは巾約22cm,厚さ3mmの
連続シートで、その中心層に厚さ0.7mmの鉛―錫
合金のほぼ連続した層が含まれていた。 The resin sheet after collection was a continuous sheet approximately 22 cm wide and 3 mm thick, and its center layer contained a nearly continuous layer of lead-tin alloy with a thickness of 0.7 mm.
この連続シートの任意の箇所から10cm×10cmの
板状試料を切り取り、この試料の比抵抗を測定し
た結果、10-1Ω−cm以下であつた。 A plate-shaped sample of 10 cm x 10 cm was cut from an arbitrary location on this continuous sheet, and the specific resistance of this sample was measured and was found to be 10 -1 Ω-cm or less.
本発明による樹脂シートの製造は、従来樹脂組
成物に導電性を付与するのに必要であつた金属微
細繊維等の特殊な導電性材料を用いることなく、
通常の熱可塑性樹脂と低融点金属を直接成形加工
に供することが可能である。従つて、本発明は金
属の微細繊維や粒子あるいはカーボン繊維等の導
電性材料の製造およびこれら導電性材料と熱可塑
性樹脂との混練などの工程が省けるので従来法と
比較して、生産効率が高く経済的にも実用的な導
電性樹脂材料を提供できる技術といえる。
The resin sheet according to the present invention can be manufactured without using special conductive materials such as metal fine fibers, which were conventionally necessary to impart conductivity to resin compositions.
It is possible to directly mold ordinary thermoplastic resins and low-melting metals. Therefore, the present invention can eliminate the steps of manufacturing conductive materials such as metal fine fibers and particles or carbon fibers, and kneading these conductive materials with thermoplastic resin, resulting in higher production efficiency compared to conventional methods. It can be said that this technology can provide a high-quality and economically practical conductive resin material.
第1図は本発明で用いる樹脂シート押出し成形
用ダイスの一例を示し、多層押出し成形用ダイス
に溶融金属注入用スリツトを設けた構造の断面模
式図である。第2図は本発明の実施例に使用した
押出し成形用ダイスを示し、押出し成形用ダイス
内にパイプにスリツトを設けた溶融金属注入装置
を装着した構造の断面模式図である。
1……ダイス、2……熱可塑性樹脂の流束、3
……低融点合金注入用のスリツト、4……ダイス
スリツト、5……低融点金属、6……熱可塑性樹
脂、7……低融点金属層を含む樹脂シート。
FIG. 1 shows an example of a resin sheet extrusion molding die used in the present invention, and is a schematic cross-sectional view of a structure in which a multilayer extrusion molding die is provided with a slit for injecting molten metal. FIG. 2 shows an extrusion molding die used in an embodiment of the present invention, and is a schematic cross-sectional view of a structure in which a molten metal injection device having a slit in a pipe is installed in the extrusion molding die. 1... Dice, 2... Flux of thermoplastic resin, 3
...Slit for injection of low melting point alloy, 4...Dice slit, 5...Low melting point metal, 6...Thermoplastic resin, 7...Resin sheet containing a low melting point metal layer.
Claims (1)
たは合金の融点以上の温度に加熱した熱可塑性樹
脂の流束中に、ダイス内に設けられた溶融金属ま
たは合金の注入用スリツトより連続的に注入しな
がら該熱可塑性樹脂を押出し成形することを特徴
とする金属層を含む熱可塑性樹脂シートの製造方
法。1. Continuously injecting a molten low melting point metal or alloy into a flux of thermoplastic resin heated to a temperature higher than the melting point of the metal or alloy through a molten metal or alloy injection slit provided in a die. A method for producing a thermoplastic resin sheet including a metal layer, characterized in that the thermoplastic resin is extruded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60020734A JPS61209121A (en) | 1985-02-05 | 1985-02-05 | Manufacture of thermoplastic resin sheet containing metallic layer therein |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60020734A JPS61209121A (en) | 1985-02-05 | 1985-02-05 | Manufacture of thermoplastic resin sheet containing metallic layer therein |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61209121A JPS61209121A (en) | 1986-09-17 |
JPH0225772B2 true JPH0225772B2 (en) | 1990-06-05 |
Family
ID=12035416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60020734A Granted JPS61209121A (en) | 1985-02-05 | 1985-02-05 | Manufacture of thermoplastic resin sheet containing metallic layer therein |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61209121A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0577663U (en) * | 1992-03-23 | 1993-10-22 | エヌオーケー株式会社 | Sealing device |
JPH06185540A (en) * | 1992-07-22 | 1994-07-05 | Carl Freudenberg:Fa | Guide sleeve with integrally formed sealing device used for clutch release bearing for gear |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61293827A (en) * | 1985-06-03 | 1986-12-24 | Sanyo Kokusaku Pulp Co Ltd | Manufacture of electrically conductive plastic molded body |
-
1985
- 1985-02-05 JP JP60020734A patent/JPS61209121A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0577663U (en) * | 1992-03-23 | 1993-10-22 | エヌオーケー株式会社 | Sealing device |
JPH06185540A (en) * | 1992-07-22 | 1994-07-05 | Carl Freudenberg:Fa | Guide sleeve with integrally formed sealing device used for clutch release bearing for gear |
Also Published As
Publication number | Publication date |
---|---|
JPS61209121A (en) | 1986-09-17 |
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