JPH02246257A - Lead frame for zip - Google Patents

Lead frame for zip

Info

Publication number
JPH02246257A
JPH02246257A JP6636389A JP6636389A JPH02246257A JP H02246257 A JPH02246257 A JP H02246257A JP 6636389 A JP6636389 A JP 6636389A JP 6636389 A JP6636389 A JP 6636389A JP H02246257 A JPH02246257 A JP H02246257A
Authority
JP
Japan
Prior art keywords
leads
lead frame
divided
zip
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6636389A
Other languages
Japanese (ja)
Other versions
JP2862557B2 (en
Inventor
Hiroaki Sueyoshi
Original Assignee
Miyazaki Oki Electric Co Ltd
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyazaki Oki Electric Co Ltd, Oki Electric Ind Co Ltd filed Critical Miyazaki Oki Electric Co Ltd
Priority to JP1066363A priority Critical patent/JP2862557B2/en
Publication of JPH02246257A publication Critical patent/JPH02246257A/en
Application granted granted Critical
Publication of JP2862557B2 publication Critical patent/JP2862557B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To reduce the size of a package by dividing inner leads, and connecting the inner leads divided at the time of bonding.
CONSTITUTION: A semiconductor chip 12 is mounted on an insulating film 11. Inner leads 14 are wired beneath the chip. The inner leads 4 are divided. The divided inner leads 14 are connected with wires 15 and 16. Outer leads 14a are guided out to one side. Since a lead frame is used in this way, it is not necessary to arrange the inner leads on a die pad part, and the size of the package can be made small.
COPYRIGHT: (C)1990,JPO&Japio
JP1066363A 1989-03-20 1989-03-20 Semiconductor device Expired - Lifetime JP2862557B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1066363A JP2862557B2 (en) 1989-03-20 1989-03-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1066363A JP2862557B2 (en) 1989-03-20 1989-03-20 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP22745898A Division JP3078526B2 (en) 1998-08-12 1998-08-12 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPH02246257A true JPH02246257A (en) 1990-10-02
JP2862557B2 JP2862557B2 (en) 1999-03-03

Family

ID=13313693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1066363A Expired - Lifetime JP2862557B2 (en) 1989-03-20 1989-03-20 Semiconductor device

Country Status (1)

Country Link
JP (1) JP2862557B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0400324A2 (en) * 1989-05-30 1990-12-05 International Business Machines Corporation Semiconductor package
US5198883A (en) * 1988-08-06 1993-03-30 Kabushiki Kaisha Toshiba Semiconductor device having an improved lead arrangement and method for manufacturing the same
JP2009117819A (en) * 2007-10-16 2009-05-28 Toshiba Corp Semiconductor device and lead frame used for the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612360U (en) * 1979-07-04 1981-02-02
JPS62293748A (en) * 1986-06-13 1987-12-21 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit device
JPS6379631A (en) * 1987-08-07 1988-04-09 Olympus Optical Co Endoscope imaging apparatus
JPS63244657A (en) * 1987-03-30 1988-10-12 Toshiba Corp Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612360U (en) * 1979-07-04 1981-02-02
JPS62293748A (en) * 1986-06-13 1987-12-21 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit device
JPS63244657A (en) * 1987-03-30 1988-10-12 Toshiba Corp Semiconductor device
JPS6379631A (en) * 1987-08-07 1988-04-09 Olympus Optical Co Endoscope imaging apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198883A (en) * 1988-08-06 1993-03-30 Kabushiki Kaisha Toshiba Semiconductor device having an improved lead arrangement and method for manufacturing the same
EP0400324A2 (en) * 1989-05-30 1990-12-05 International Business Machines Corporation Semiconductor package
EP0400324A3 (en) * 1989-05-30 1992-04-15 International Business Machines Corporation Semiconductor package
JP2009117819A (en) * 2007-10-16 2009-05-28 Toshiba Corp Semiconductor device and lead frame used for the same

Also Published As

Publication number Publication date
JP2862557B2 (en) 1999-03-03

Similar Documents

Publication Publication Date Title
JPH0245969A (en) Lead frame and semiconductor device consisting of lead frame therefor and manufacture thereof
JPH02278740A (en) Packaging of semiconductor device
JPH02246257A (en) Lead frame for zip
JPH03116860A (en) Semiconductor device
JPH0357236A (en) Manufacture of resin-sealed semiconductor device
JPH04142073A (en) Semiconductor device
JPH04144269A (en) Hybrid integrated circuit device
JPH04316356A (en) Resin-sealed type semiconductor device
JPH03167836A (en) Semiconductor device
JPH0237729A (en) Manufacture of semiconductor device
JPH0382066A (en) Semiconductor device
JPH02198163A (en) Semiconductor device and manufacture thereof
JPS5348463A (en) Semiconductor integrated circuit support
JPS5571051A (en) Semiconductor device
JPH04317363A (en) Resin sealed semiconductor device without die pad and its manufacturing method
JPH03167872A (en) Lead frame semiconductor device
JPH04343459A (en) Manufacture of semiconductor device
JPS6345842A (en) Plastic package
JPH01209751A (en) Lead frame
JPH02208959A (en) Semiconductor device
JPH04147661A (en) Lead frame for semiconductor integrated circuit device
JPH04286134A (en) Sealing method for semiconductor device
JPS62293748A (en) Semiconductor integrated circuit device
JPH02197151A (en) Resin-sealed semiconductor device and manufacture thereof
JPH04207062A (en) Semiconductor device and lead frame therefor