JPH0224556U - - Google Patents
Info
- Publication number
- JPH0224556U JPH0224556U JP10122688U JP10122688U JPH0224556U JP H0224556 U JPH0224556 U JP H0224556U JP 10122688 U JP10122688 U JP 10122688U JP 10122688 U JP10122688 U JP 10122688U JP H0224556 U JPH0224556 U JP H0224556U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- recognition
- melting point
- low melting
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10122688U JPH0713232Y2 (ja) | 1988-07-30 | 1988-07-30 | サーディップ型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10122688U JPH0713232Y2 (ja) | 1988-07-30 | 1988-07-30 | サーディップ型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0224556U true JPH0224556U (forum.php) | 1990-02-19 |
| JPH0713232Y2 JPH0713232Y2 (ja) | 1995-03-29 |
Family
ID=31330028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10122688U Expired - Lifetime JPH0713232Y2 (ja) | 1988-07-30 | 1988-07-30 | サーディップ型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713232Y2 (forum.php) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0256446U (forum.php) * | 1988-10-14 | 1990-04-24 | ||
| JPH04111755U (ja) * | 1991-03-15 | 1992-09-29 | ソニー株式会社 | サーデイツプタイプ固体撮像素子のインナーリード形状 |
-
1988
- 1988-07-30 JP JP10122688U patent/JPH0713232Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0256446U (forum.php) * | 1988-10-14 | 1990-04-24 | ||
| JPH04111755U (ja) * | 1991-03-15 | 1992-09-29 | ソニー株式会社 | サーデイツプタイプ固体撮像素子のインナーリード形状 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0713232Y2 (ja) | 1995-03-29 |
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