JPH02226799A - Magnetic mold body - Google Patents
Magnetic mold bodyInfo
- Publication number
- JPH02226799A JPH02226799A JP4790589A JP4790589A JPH02226799A JP H02226799 A JPH02226799 A JP H02226799A JP 4790589 A JP4790589 A JP 4790589A JP 4790589 A JP4790589 A JP 4790589A JP H02226799 A JPH02226799 A JP H02226799A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- magnetic powder
- ferrite
- system ferrite
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000006247 magnetic powder Substances 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 19
- 210000003298 dental enamel Anatomy 0.000 abstract description 3
- 239000008188 pellet Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
- -1 polypropylene Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 5
- 230000005389 magnetism Effects 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- 229910001035 Soft ferrite Inorganic materials 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229910000702 sendust Inorganic materials 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229910003962 NiZn Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は、磁性モールド体、例えばコイル、もしくはト
ランジスタ、半導体集積回路のような半導体チップ等の
電子部品、あるいはラジオ、テレビジョン受像機、スピ
ーカ等の各種機器の被覆封止体、ケース、キャビネット
等に用いられる磁性モールド体に係わる。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to magnetic molded bodies, such as coils, or electronic components such as semiconductor chips such as transistors and semiconductor integrated circuits, or radios, television receivers, and speakers. This product relates to magnetic molded bodies used in encapsulants, cases, cabinets, etc. of various types of equipment.
本発明は、磁性モールド体に係わり、モールド樹脂に、
６０〜７５容量％の割合をもって軟磁性粉が混合され、
その軟磁性粉は、Ｎｉ系フェライト及びＭｇ系フェライ
トのうちの１種以上と、Ｍｎ系フェライト及び金属磁性
粉のうちの１種以上とがｌ＝１〜９．５ ： ０．５の
容量比をもって混合されてなり、所要の電気的信頼性を
保持しつつ静電シールド効果を得ることができる磁性モ
ールド体を提供するものである。The present invention relates to a magnetic molded body, and includes molding resin,
Soft magnetic powder is mixed at a ratio of 60 to 75% by volume,
The soft magnetic powder has a capacity ratio of l=1 to 9.5:0.5 of one or more of Ni-based ferrite and Mg-based ferrite and one or more of Mn-based ferrite and metal magnetic powder. The object of the present invention is to provide a magnetic molded body which can obtain an electrostatic shielding effect while maintaining required electrical reliability.
〔従来の技術］
コイル、もしくはトランジスタ、或いは半導体集積回路
のような半導体チップ等の電子部品、またはラジオ、テ
レビジョン受像機、スピーカ等の各種部品１機器におけ
る封止体、ケース、キャビネット等においては、電流リ
ークを防止する安全性、動作の安定性、信頼性等の上で
電気的に所要の絶縁性を保持しつつ静電シールド効果が
得られる程度の高抵抗導電性を示し、しかも例えば電磁
シールド効果、ないしは閉磁路構成等をとることが望ま
れる。[Prior Art] Electronic components such as coils, transistors, or semiconductor chips such as semiconductor integrated circuits, or sealed bodies, cases, cabinets, etc. of various components such as radios, television receivers, speakers, etc. , exhibits high resistance conductivity to the extent that an electrostatic shielding effect can be obtained while maintaining the required electrical insulation in terms of safety to prevent current leaks, operational stability, reliability, etc. It is desirable to have a shielding effect or a closed magnetic circuit configuration.
一方、上述した各種電子部品９機器等における封止体、
ケース、キャビネット等としてボッティング、射出成型
等による樹脂モール、ド体がしばしば用いられる。On the other hand, the sealed body in the various electronic component nine devices mentioned above,
Resin molds and bodies made by botting, injection molding, etc. are often used for cases, cabinets, etc.
この場合、樹脂単独では静電シールド効果も電磁シール
ド効果も得られないことから樹脂に軟磁性フェライトい
わゆるソフトフェライト粉末を添加することが考えられ
る。ところが、未だにこのソフトフェライトの添加によ
って閉磁路ないしは電磁シールド効果を保持する程度の
磁性を有し、しかも静電シールド効果をも保持し得る程
度の比抵抗を示す磁性モールド体の提供がなされていな
い。In this case, since neither the electrostatic shielding effect nor the electromagnetic shielding effect can be obtained with the resin alone, it is possible to add soft magnetic ferrite powder to the resin. However, no magnetic molded body has yet been provided which has magnetism sufficient to maintain a closed magnetic circuit or electromagnetic shielding effect due to the addition of soft ferrite, and also exhibits a specific resistance sufficient to maintain an electrostatic shielding effect. .
上述したように、磁性モールド体において、その電気的
特性の安全性、動作の安定性、信頼性等を保持して静電
シールド効果を得ることができる磁性モールド体が得ら
れていないという課題の解決をはかるものである。As mentioned above, the problem of not being able to obtain a magnetic molded body that can maintain the safety of its electrical characteristics, stability of operation, reliability, etc. and obtain an electrostatic shielding effect is being solved. It is intended to solve the problem.
［課題を解決するための手段］
本発明においては、モールド樹脂に６０〜７５容量％の
割合をもって軟磁性粉が混合され、この軟磁性粉がＮｉ
系フェライト及びＭｇ系フェライトのうちの１種以上と
、Ｍｎｎ系シライト及び金属磁性材のうちの１種以上と
が１：１〜９．５ ： ０．５の容量比をもって混合さ
れた構成をとる。[Means for Solving the Problems] In the present invention, soft magnetic powder is mixed with the mold resin at a ratio of 60 to 75% by volume, and this soft magnetic powder is mixed with Ni.
One or more of Mg-based ferrite and Mg-based ferrite and one or more of Mnn-based silite and metal magnetic materials are mixed at a capacity ratio of 1:1 to 9.5:0.5. .
上述の本発明構成によれば、磁性すなわち実効ｉ３ｍ率
μが２以上で軟磁性を呈し、しかもその比抵抗ρが１０
５〜１０７Ω・ｃｍを示す。そして、この比抵抗範囲に
おいては静電シールド効果ないしは閉磁路効果が得られ
た。すなわち、例えば番ｎ性モールドコイルにおける磁
性モールド体あるいは電子部品の封止体等に用いられて
、その端子間リークの問題、あるいは他部の配線３部品
１機器等との電気的漏洩ないしは短絡等による信頼性の
低下動作の不安定性等を招来することがなく、しかも静
電シールド効果が得られることが確められた。According to the above-described configuration of the present invention, the magnetism, that is, the effective i3m ratio μ is 2 or more, exhibits soft magnetism, and the specific resistance ρ is 10
5 to 107 Ω·cm. In this specific resistance range, an electrostatic shielding effect or a closed magnetic circuit effect was obtained. In other words, for example, when used in a magnetic molded body in a No. N molded coil or a sealed body for electronic components, there may be problems with leakage between the terminals, or electrical leakage or short circuit between three wiring parts and one device in other parts. It was confirmed that the electrostatic shielding effect could be obtained without causing a decrease in reliability or instability of operation due to the electrostatic shielding.
因みに、Ｍｎソフトフェライトあるいはパーマロイ３セ
ンダスト等の金属磁性材の初透磁率μ。Incidentally, the initial magnetic permeability μ of metallic magnetic materials such as Mn soft ferrite or permalloy 3 Sendust.
は、３０００〜ｔｏｏｏｏｃ （ガウス）にも及ぶもの
ではあるが、これを樹脂中に添加して例えば磁性モール
ド体としての特性を保持し得るようにする場合、それ自
体の比抵抗は２０〜１００Ω・ｃｍ程度であることから
充分高い比抵抗を得ることができず、また例えばＮｉ系
ソフトフェライトあるいはＭｇ系フェライト等において
はその知遇るｎ率μ。が低過ぎて、これらをそれぞれ単
独に樹脂に添加しても所要の磁性（実効透６Ｒ率）を得
ることができないものであるに比し、上述した本発明の
混合比によれば、実効透磁率を静電シールドないしは閉
磁路効果を得る程度以上例えば１７程度以上を保持しつ
つ静電シールド効果を得ることができるものである。The resistivity is as high as 3000 to 100 Ω (Gauss), but when it is added to a resin to maintain its properties as a magnetic molded body, the resistivity itself is 20 to 100 Ω. cm, it is not possible to obtain a sufficiently high resistivity, and for example, in Ni-based soft ferrites or Mg-based ferrites, the n ratio μ is about 1.5 cm. is so low that it is impossible to obtain the required magnetism (effective permeability 6R ratio) even if each of these is added to the resin alone.However, according to the mixing ratio of the present invention described above, the effective permeability is It is possible to obtain an electrostatic shielding effect while maintaining the magnetic coefficient at a level higher than the level required to obtain an electrostatic shielding or closed magnetic circuit effect, for example, about 17 or higher.
〔実施例］
本発明による磁性モールド体について、さらに詳細に説
明する。まず、磁性モールド体中にコイルが埋設された
磁性モールドコイルに適用する磁性モールド体について
の実施例を図面を参照して説明する。[Example] The magnetic molded body according to the present invention will be described in more detail. First, an example of a magnetic molded body applied to a magnetic molded coil in which a coil is embedded in a magnetic molded body will be described with reference to the drawings.
実施例ｌ Ｎ１Ｊｎ系フエライトの原材料、すなわちＦｅｚＯａ。Example l Raw material for N1Jn ferrite, namely FezOa.
ＮｉＯ，ＺｎＯ粉末と、Ｍｎ−Ｚｎ系フェライトの原材
料Ｆｅ２Ｏ。NiO, ZnO powder, and raw material Fe2O for Mn-Zn ferrite.
ＭｎＯ，ＺｎＯ粉末のフェライト原料粉を例え・ば空気
中で８００°Ｃ仮焼する。その後、酸素雰囲気中で１２
００°Ｃ１空気中で１０００″Ｃの本焼成を行う。その
後、これを数μｍ〜数１０μｍを中心粒径とする程度の
粒径に粉砕し、これを樹脂と混練し、ペレタイジングし
、このようにして磁性樹脂モールドペレットを用意する
。一方、図面に示すように絶縁被覆例えばエナメルが塗
布された導線、例えば銅線を巻回した円筒状コイル（１
）を用意し、その両端末リード（ｌａ）及び（ｌｂ）を
、例えば同一方向に導出し、その先端の絶縁層すなわち
エナメルを剥離し、この両端子ピンに半田デイツプを行
って半田処理をなし、これを成形金型のキャビティ内の
所定位置に配宣し、上述した磁性樹脂ベレットを溶融射
出して磁性モールド体（２）中にコイル（１）が埋設さ
れたすなわち、コイル（１）の内外に磁性樹脂が充填さ
れた磁性モールドコイルを作製した。この場合、Ｎｉ−
Ｚｎ系ソフトフェライト自体のバルク状態での比抵抗は
ｌＸｌ０’Ω・Ｃ１１１ＳＣ１１１Ｓ系フエライトのバ
ルク状態での比抵抗は５０Ω・ｃｍでこれらフェライト
粉の粒径は１０〜３０μｍに選定した。このようにして
それぞれ樹脂として、ポリプロピレンを用い、フェライ
ト粉の全量と樹脂との配合比を７０ ： ３０容量％と
してそれぞれＭｎ−Ｚｎ： Ｎｉ−Ｚｎの混合比を９０
：１０ （容量比）とした試料１の比抵抗は２ＱＫΩ・
ｃｔｕ。For example, ferrite raw material powder such as MnO and ZnO powder is calcined at 800°C in air. After that, 12 hours in an oxygen atmosphere.
Main firing is carried out at 1000''C in air at 00°C1.Then, this is pulverized to a particle size with a center particle size of several μm to several tens of μm, kneaded with resin, pelletized, and processed in this manner. On the other hand, as shown in the drawing, a cylindrical coil (1
), lead out both terminal leads (la) and (lb), for example, in the same direction, peel off the insulating layer or enamel at the tips, and apply solder dip to both terminal pins for soldering. This is placed in a predetermined position in the cavity of a molding die, and the above-mentioned magnetic resin pellet is melted and injected to embed the coil (1) in the magnetic mold body (2). We created a magnetic molded coil filled with magnetic resin inside and outside. In this case, Ni-
The specific resistance of the Zn-based soft ferrite itself in the bulk state is lXl0'Ω.The specific resistance of the C111SC111S-based ferrite in the bulk state is 50 Ω·cm, and the particle size of these ferrite powders was selected to be 10 to 30 μm. In this way, polypropylene was used as the resin, the mixing ratio of the total amount of ferrite powder and the resin was 70:30% by volume, and the mixing ratio of Mn-Zn:Ni-Zn was 90%.
:10 (capacitance ratio), the specific resistance of sample 1 is 2QKΩ・
ctu.
７０ ： １０とした試料２の比抵抗は５０にΩ／ｃ＋
ｎ、５０：５０とした試料３の比抵抗は２２０にΩ・ｃ
ｍとなった。The specific resistance of sample 2 with 70:10 is 50Ω/c+
The specific resistance of sample 3 with n, 50:50 is 220Ω・c
It became m.
そしてこれら試料１〜３の実効透磁率μは、１７〜２０
程度になった。The effective magnetic permeability μ of these samples 1 to 3 is 17 to 20
It has become a degree.
したがって、このようにして得た磁性モールドコイルは
、磁性を有するモールド体（２）中にコイル（１）が埋
設されたことによって、すなわちコイル（１）の内外に
渡って磁性モールド体（２）による閉磁路構成がとられ
ることになると共に外部への磁束の漏れが回避された電
磁シールド効果が得られる。また、その比抵抗は、それ
ぞれ比較的高抵抗の導電性を呈することによって端子ピ
ン間の漏洩の問題はなく、動作の安定性、信頼性がはか
られた上で静電シールド効果も得られる。Therefore, the magnetic molded coil obtained in this way is formed by embedding the coil (1) in the magnetic molded body (2), that is, the magnetic molded body (2) extends from the inside and outside of the coil (1). A closed magnetic circuit configuration is achieved, and an electromagnetic shielding effect is obtained in which leakage of magnetic flux to the outside is avoided. In addition, since the resistivity exhibits conductivity with relatively high resistance, there is no problem of leakage between terminal pins, and operation stability and reliability are achieved, as well as an electrostatic shielding effect. .
尚、上述した例においては、Ｎｉ−Ｚｎ系フェライトと
Ｍｎ−Ｚｎ系フェライトの混合によって磁性樹脂モール
ド体（２）を得るようにした場合であるが、ＮｉＺｎ系
フェライトに変えてＭｇ−Ｚｎ系フェライトを用いるこ
とができ、いずれの場合においてもそのＮｉ系もしくは
Ｍｇ系フェライトとＭｎ系フェライトとの混合比は１：
１〜４：１において、またこれら磁性粉の割合をモール
ド樹脂全体の６０〜７５容量％の範囲に選定するとき磁
性モールド体としての機能、すなわち磁気的及び機械的
特性を保持しつつ、比抵抗ρを１０’〜１０７Ω・ｃｍ
に選定することができた。さらに、またＭｎ系フェライ
トに代えて金属磁性粉例えばパーマロイ、あるいはセン
ダストを用いることができ、この場合においてそのＮｉ
系もしくはＭｇ系フェライトとこの金属磁性粉との混合
比はｌ：１〜９．５ ： ０．５ （容量比）に選定し
て、その樹脂に対する磁性粉の混合比をモールド樹脂全
体の６０〜７５容量％の範囲とするとき、同様に比抵抗
ρが１０５〜１０７Ω・ｃｍの範囲に選定し得た。In the above example, the magnetic resin molded body (2) is obtained by mixing Ni-Zn ferrite and Mn-Zn ferrite, but Mg-Zn ferrite is used instead of NiZn ferrite. In either case, the mixing ratio of Ni-based or Mg-based ferrite and Mn-based ferrite is 1:
1 to 4:1, and when the ratio of these magnetic powders is selected in the range of 60 to 75% by volume of the entire mold resin, the function as a magnetic mold body, that is, the specific resistance is maintained while maintaining the magnetic and mechanical properties. ρ from 10' to 107Ω・cm
was able to be selected. Furthermore, metal magnetic powder such as permalloy or sendust can be used instead of Mn-based ferrite, and in this case, the Ni
The mixing ratio of Mg-based or Mg-based ferrite and this metal magnetic powder is selected to be 1:1 to 9.5:0.5 (volume ratio), and the mixing ratio of the magnetic powder to the resin is 60 to 9.5:0.5 of the entire mold resin. When the range was 75% by volume, the specific resistance ρ could be similarly selected to be in the range of 10 5 to 10 7 Ω·cm.
尚、磁性体と混合するモールド樹脂は、ポリプロピレン
に限られず、例えばポリエチレン、ポリスチレン、エチ
レン酢酸ビニル共重合体、エチレンエチルアクリレート
６−ナイロン、６．６−ナイロン、６．１０−ナイロン
、１１−ナイロン、１２−ナイロンホットメルト用ポリ
アミド、ポリエチレンテレフタレートポリブチレンテレ
フタレート１ポリフエニレンサルフアイド等の熱可塑性
樹脂、ポリエチレンワックス、パラフィンワックス等の
ワックス、エポキシ樹脂、フェノール樹脂、ジアリルフ
タレート樹脂等を用い得る。The molding resin to be mixed with the magnetic material is not limited to polypropylene, and includes, for example, polyethylene, polystyrene, ethylene vinyl acetate copolymer, ethylene ethyl acrylate 6-nylon, 6.6-nylon, 6.10-nylon, 11-nylon. , 12-nylon hot-melt polyamide, polyethylene terephthalate, polybutylene terephthalate, 1-polyphenylene sulfide, and other thermoplastic resins; polyethylene wax, paraffin wax, and other waxes; epoxy resins; phenol resins; diallyl phthalate resins, and the like.
尚、上述した例においては、本発明を磁性モールドコイ
ルに通用した場合であるが、トランジスタ、半導体集積
回路等の半導体チップの封止体あるいはその他各種の電
子部品の封止体、ケース。In the above example, the present invention is applied to a magnetic molded coil, but it is also applicable to sealed bodies of semiconductor chips such as transistors and semiconductor integrated circuits, and sealed bodies and cases of various other electronic components.
電子機器のケース、キャビネット等に本発明による磁性
モールド体を適用することができる。The magnetic molded body according to the present invention can be applied to cases, cabinets, etc. of electronic devices.
（発明の効果）
上述したように本発明によれば、特定された磁性材の混
合と混合比をもって樹脂に添加した磁性モールド体によ
って軟磁性を呈し、しかも静電シールド効果をも保持す
ることができ、各種磁性モールド体として用いて信頼性
の高い安定した特性の電子部品ないしは各種電子機器等
を構成することができ、実用上その利益は大である。(Effects of the Invention) As described above, according to the present invention, the magnetic molded body added to the resin with the specified mixture and mixing ratio of magnetic materials exhibits soft magnetism and also maintains an electrostatic shielding effect. It can be used as various magnetic molds to construct electronic components or various electronic devices with highly reliable and stable characteristics, and is of great practical benefit.
図は本発明による磁性モールド体を適用する１部品の一
例の断面図である。
（１）はコイル、（２）は磁性モールド体である。The figure is a sectional view of one example of a component to which the magnetic molded body according to the present invention is applied. (1) is a coil, and (2) is a magnetic molded body.
Claims (1)
磁性粉が混合され、 上記軟磁性粉は、Ｎｉ系フェライト及びＭｇ系フェライ
トのうちの１種以上と、Ｍｎ系フェライト及び金属磁性
粉のうちの１種以上とが１：１〜９．５：０．５なる容
量比をもって混合されてなることを特徴とする磁性モー
ルド体。[Claims] Soft magnetic powder is mixed into the molding resin at a ratio of 60 to 75% by volume, and the soft magnetic powder contains one or more of Ni-based ferrite and Mg-based ferrite, Mn-based ferrite, and 1. A magnetic molded body characterized by being mixed with at least one metal magnetic powder at a volume ratio of 1:1 to 9.5:0.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1047905A JP2897241B2 (en) | 1989-02-28 | 1989-02-28 | Magnetic mold body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1047905A JP2897241B2 (en) | 1989-02-28 | 1989-02-28 | Magnetic mold body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02226799A true JPH02226799A (en) | 1990-09-10 |
| JP2897241B2 JP2897241B2 (en) | 1999-05-31 |
Family
ID=12788400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1047905A Expired - Fee Related JP2897241B2 (en) | 1989-02-28 | 1989-02-28 | Magnetic mold body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2897241B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350284A (en) * | 1993-06-10 | 1994-12-22 | Murata Mfg Co Ltd | Chip coil element |
| US6063303A (en) * | 1996-08-21 | 2000-05-16 | Tdk Corporation | Magnetic powder and magnetic molded article |
| US6661328B2 (en) | 2000-04-28 | 2003-12-09 | Matsushita Electric Industrial Co., Ltd. | Composite magnetic body, and magnetic element and method of manufacturing the same |
| CN106062903A (en) * | 2014-03-04 | 2016-10-26 | 株式会社村田制作所 | Inductor device, inductor array, multilayer substrate and method for manufacturing inductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5193146A (en) * | 1975-02-13 | 1976-08-16 | ||
| JPS5651520A (en) * | 1979-10-03 | 1981-05-09 | Sumitomo Metal Ind Ltd | Production of low-temperature-service steel casting |
| JPS58188192A (en) * | 1982-04-28 | 1983-11-02 | 住友電気工業株式会社 | Radio wave absorber composition |
| JPS58219249A (en) * | 1982-06-14 | 1983-12-20 | Showa Denko Kk | Chlorinated polyethylene composition |
| JPS5981355A (en) * | 1982-10-30 | 1984-05-11 | Showa Denko Kk | Chlorinated polyethylene composition |
-
1989
- 1989-02-28 JP JP1047905A patent/JP2897241B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5193146A (en) * | 1975-02-13 | 1976-08-16 | ||
| JPS5651520A (en) * | 1979-10-03 | 1981-05-09 | Sumitomo Metal Ind Ltd | Production of low-temperature-service steel casting |
| JPS58188192A (en) * | 1982-04-28 | 1983-11-02 | 住友電気工業株式会社 | Radio wave absorber composition |
| JPS58219249A (en) * | 1982-06-14 | 1983-12-20 | Showa Denko Kk | Chlorinated polyethylene composition |
| JPS5981355A (en) * | 1982-10-30 | 1984-05-11 | Showa Denko Kk | Chlorinated polyethylene composition |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350284A (en) * | 1993-06-10 | 1994-12-22 | Murata Mfg Co Ltd | Chip coil element |
| US6063303A (en) * | 1996-08-21 | 2000-05-16 | Tdk Corporation | Magnetic powder and magnetic molded article |
| US6661328B2 (en) | 2000-04-28 | 2003-12-09 | Matsushita Electric Industrial Co., Ltd. | Composite magnetic body, and magnetic element and method of manufacturing the same |
| US6784782B2 (en) | 2000-04-28 | 2004-08-31 | Matsushita Electric Industrial Co., Ltd. | Composite magnetic body, and magnetic element and method of manufacturing the same |
| US6888435B2 (en) | 2000-04-28 | 2005-05-03 | Matsushita Electric Industrial Co., Ltd. | Composite magnetic body, and magnetic element and method of manufacturing the same |
| US7219416B2 (en) | 2000-04-28 | 2007-05-22 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a magnetic element |
| CN106062903A (en) * | 2014-03-04 | 2016-10-26 | 株式会社村田制作所 | Inductor device, inductor array, multilayer substrate and method for manufacturing inductor device |
| JPWO2015133310A1 (en) * | 2014-03-04 | 2017-04-06 | 株式会社村田製作所 | Inductor device, inductor array and multilayer substrate, and method of manufacturing inductor device |
| CN106062903B (en) * | 2014-03-04 | 2018-08-28 | 株式会社村田制作所 | The manufacturing method of inductor arrangement, inductor array and multilager base plate and inductor arrangement |
| US10734150B2 (en) | 2014-03-04 | 2020-08-04 | Murata Manufacturing Co., Ltd. | Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2897241B2 (en) | 1999-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6919788B2 (en) | Low profile high current multiple gap inductor assembly | |
| US3798059A (en) | Thick film inductor with ferromagnetic core | |
| US20020067232A1 (en) | Inductor and manufacturing method therefor | |
| CA2645771C (en) | Inductive device including permanent magnet and associated methods | |
| US3778836A (en) | Magnetic antenna having a block or circuit components therein | |
| US3502584A (en) | Magnetic composite materials | |
| EP3125259A1 (en) | Magnetic element | |
| JPH1187126A (en) | Ferrite and inductor | |
| US6183659B1 (en) | Ferrite oxide magnetic material | |
| US11348808B2 (en) | Switch-mode converter module | |
| JPH02226799A (en) | Magnetic mold body | |
| JP2004281778A (en) | Choke coil and its producing method | |
| JPH05283238A (en) | Transformer | |
| JPH1167522A (en) | Wire wound electronic component | |
| US11569014B2 (en) | Dust core and inductor element | |
| JPH01150304A (en) | Composite magnetic molding material | |
| JPH0636937A (en) | Inductor and its manufacture | |
| TW202036614A (en) | Method for manufacturing inductor | |
| JPH07201580A (en) | Chip type inductor array | |
| CN107430919B (en) | Metallicl magnetic material and electronic component | |
| KR102624903B1 (en) | MRAM Package with Magnetic Shielding Layer and Method of Manufacturing the Same | |
| JP2696834B2 (en) | Oxide magnetic material | |
| JP2001267810A (en) | Lumped parameter type non-reciprocal circuit element | |
| JP2000216030A (en) | Molded transformer and manufacture thereof | |
| JPS59123141A (en) | Deflection yoke for electromagnetic deflection type cathode-ray tube |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |