JPH02218920A - Operation monitoring apparatus for plant equipment - Google Patents

Abstract

PURPOSE:To evaluate the damages of plant equipment by picking up the status- quantity data from sensors, compressing the data, and recording the compressed state-quantity data as operation history data. CONSTITUTION:Data from a pressure sensor 2 - a temperature sensor 7 are amplified in an amplifiers 8-13 and undergo A/D conversion 14-19. The wave form analysis of the data and the data compression are performed in a microcomputer 20. Then, the compressed data are transferred into a higher computer 27. The operating states are analyzed in said computer 27 based on the changing states of the pressures and the temperatures, and the histories of the operating states are formed as a data base. The data are stored. Stress analysis is performed based on the changing states of the pressure and the temperatures. The stress histories are formed and stored as a data base. Corrosion and damages are analyzed based on the operating state histories and the stress histories, and a corrosion/damage data base is formed. The accumulated damages are evaluated for the fatigue damages and the corrosion damages, respectively. The data of the recorded temperatures, pressures and the like are transferred into a host computer 50.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an operation monitoring device for evaluating damage such as corrosion and fatigue formed on structural members of plant equipment, and particularly relates to an operation monitoring device for evaluating damage such as corrosion and fatigue formed on structural members of plant equipment, and in particular, The present invention relates to an operation monitoring device suitable for collecting signals from various sensors installed in equipment to detect pressure, temperature, strain, etc., recording operation history data, and evaluating damage.

[Conventional technology]

In conventional atomic couplants, equipment such as piping is provided with various sensors for detecting pressure, temperature, flow rate, etc., and the state quantities thereof are measured.

Further, depending on the measurement location, the sensor is connected to a dot recorder and the measurement data is recorded on chart paper.

[Problem to be solved by the invention]

By the way, the design life of the current nuclear coupler allows up to 40 years of heat cycles, and as the number of years of operation increases, it becomes difficult to know how many design heat cycles have been consumed or how much fatigue damage has been consumed. It would be reasonable to assess whether the damage is serious, issue a warning if the damage is significant, and if the damage is small enough, increase the number of years of operation, so-called life extension.

However, in the past, measurement data measured by various sensors was only used for operation control and monitoring, but not for operation history management or damage evaluation. Measurement data recorded on paper is also not saved in a processed form, making it impossible to manage the operating history of nuclear coupler equipment and evaluate damage based on actual operating results.

The purpose of the present invention is to manage the operation history of plant equipment,
An object of the present invention is to provide an operation monitoring device for plant equipment capable of evaluating equipment damage.

- [Means for Solving the Problems] In order to achieve the above object, the present invention provides plant equipment for evaluating damage such as fatigue and corrosion caused by pressure, temperature, strain, etc. applied to plant equipment. In the operation monitoring device, a sensor detects pressure, temperature, and the state of the strained cap Wsn, and data on the state quantity from the sensor is collected,
A microcomputer that compresses the data, and a host computer that is connected to the microcomputer via an interface and records the compressed state quantity data transferred from the microcomputer as driving history data. Provides a driving monitoring device with characteristics.

In this operation monitoring device, the host computer preferably further performs stress analysis of the plant equipment using the recorded operation history data based on a stress analysis database stored in advance, and Analyze damage to plant equipment based on changes, record and evaluate cumulative damage.

Preferably, this operation monitoring device further includes a host computer that is connected to the host computer via an interface and that performs detailed stress analysis using the operation history data transferred from the host computer. Damage to plant equipment is analyzed again based on the stress changes resulting from the detailed stress analysis, and the cumulative damage is recorded in place of the cumulative damage recorded in the host computer for evaluation.

Preferably, the host computer further analyzes the operating state of the plant equipment based on changes in the recorded operating history data, and records the operating state as operating state history data. , the host computer analyzes damage to plant equipment using the recorded operating state history data, and records and evaluates cumulative damage.

[Effect]

In the operation monitoring device of the present invention configured in this way, by collecting state quantity data from the sensor and compressing it, the saved data can be significantly compressed, and the state quantity data thus compressed can be compressed. By recording this data as operation history data, it becomes possible to manage the operation history of the plant equipment, and the operation history data can be used to evaluate damage to the plant equipment.

In addition, data collection and compression processing can be performed by a microcomputer, and data recording and other processing can be performed by a host computer. For compression processing, it is possible to provide a data processing device with a dedicated small microcomputer for each sensor, and since the processing device is about the size of two or three boards, the system The overall size becomes smaller, and it becomes possible, for example, to house a large number of microcomputers and their processing devices in one console rack and install this in a corner of the control room or measurement room of the atomic couplant.

Furthermore, since the entire system is small, the system can be built horizontally at low cost.

In addition, the host computer performs stress analysis on plant equipment using the recorded operation history data, analyzes damage to plant equipment from the analyzed stress changes, and records and evaluates cumulative damage. Damage to plant equipment can be evaluated directly online from the operation history data. Further, since the stress analysis here is performed based on a stress analysis database stored in advance, it is simple but can be performed at relatively high speed.

In addition, by providing a host computer that performs detailed stress analysis using the operation history data transferred to the host computer, it is possible to prevent damage if the damage evaluation on the host computer determines that the damage has become large, or if the earthquake load is higher than expected. In addition to simple stress analysis on the host computer, high-precision stress analysis can be performed in addition to the simple stress analysis performed on the host computer, and detailed damage evaluation can be performed based on the results.
Damage can be evaluated with high accuracy.

In this case as well, the detailed stress analysis is performed by the host computer, and by dividing the roles of the functions executed by the host computer and the host computer, regular damage evaluation of the 3F1 is performed by the PC-class host computer, and maintenance is maintained. In addition to significantly reducing the time required to use a large host computer that requires enormous management costs, the host computer performs high-precision stress analysis and accurate damage assessment when necessary, and functions as an economical operation monitoring device. can be increased.

Furthermore, the host computer analyzes the operating status of plant equipment based on changes in the recorded operating history data, and records the operating status as operating status historical data.
Not only the driving history but also the driving status history can be saved, so
It is possible to perform more detailed operation history management, and by analyzing damage to plant equipment using this recorded operating state history data and recording and evaluating the cumulative damage, it is possible to perform damage evaluation based on the above stress analysis results. In addition, secondary damage evaluation can be performed in accordance with the conventional concept of 5, and by using this as a guideline for operation monitoring, the function as an operation monitoring device can be further improved.

(Ifuyukai O) 〔Example〕 An embodiment of the present invention will be described below with reference to FIG.

In high-temperature and pressure equipment such as atomic coupler piping, the sources of stress include internal pressure, temperature distribution, and vibrations caused by earthquakes.
This is influenced by the environment, such as water quality. Therefore, when evaluating the stress of equipment, pressure sensors, temperature sensors, strain gauges, acceleration sensors, environmental sensors such as dissolved oxygen concentration, etc. must be installed around the area to be evaluated. A pressure sensor 2 and a temperature sensor 3 are installed around the nozzle 1.
, a strain gauge 4, an acceleration sensor 5, a flow rate sensor 6, an environment sensor 7, and the like are arranged in large numbers. Amplifiers 8 to 13 for amplifying sensor signals are connected to each sensor. The analog signals amplified by amplifiers 8 to 13 are A/
The signals are converted into digital signals by D converters 14 to 19. Next, the signal converted into a digital signal is stored in the microcomputer 20. However, for the sake of complication, FIG. 1 does not show the microcomputers connected to each of the sensors 2 to 6.

The microcomputer 2o is equipped with a waveform analyzer 21 that analyzes the waveform of a digital signal and performs data compression processing, and two buffer memories 22 and 23 that temporarily record the processed digital signal. There is. Additionally, in some cases, two storage memories 2 may be installed as shown in phantom lines.
4.25 is included.

Here, the functions of the waveform analyzer 21 will be outlined. Assuming that the captured data is temperature, for example, data is collected every time interval TS=1 second. Measurement starts from the operation start time to, and the temperature at time ti is T.
Let i and the temperature at t i+1 be T i+1, and set the temperature difference ΔT=lTi+1−Til between them as the data compression processing reference value in advance.If i<Tc, it is determined that the temperature change is small, and the temperature difference at time t i+1 is The temperature T i+1 shall be discarded. Next, the temperature at the measured time t i+2 is T1+2, lTi
If +2-Til>Tc, it is determined that the temperature change is large, and the temperature Ti+2 at time ti+2 is re-recorded as the temperature Ti+1 at time tt+i. In other words, the rate of temperature change is small in the steady operating state. Therefore, most of the data is discarded, and the number of data recorded as data is significantly compressed. on the other hand,
In transient operating conditions, almost all of the measured data is left as data. If such operations are repeated over the entire operating time, most of the data recorded will be in transient operating states, such as during startup or stoppage, since steady state occupies most of the operating time under normal operating conditions. This is time data.

However, if steady operation continues for a long time, no data will be left for a long time, so it is necessary to leave data every certain period of time Td. Also,
On the other hand, in the case of a relatively slow transient response such as starting and stopping even in a transient operation state, the rate of change is almost constant, so after performing data compression processing, the data is reviewed and the constant rate Te By leaving only data that exceeds a certain value and performing compression processing on the portions that fall within a certain culture rate Te, considerable data compression can be achieved. In the end, it seems that all measured data will be retained only in cases where the rate of change is extremely fast, such as in the case of earthquake loads, where the frequency is several tens of Hz.

The waveform analyzer 21 analyzes the data waveform of the digital signal as described above and performs data compression processing.

The 2m buffer memory 22, 23 has the function of temporarily recording the processed digital signal, and the waveform analyzer 21
The data determined to be retained is sequentially transferred to the buffer memory 22 and recorded in chronological order. Here, if the capacity of this buffer memory 22 is 16 bytes, 12 bits are adopted as the A/D converters 14 to 19, and 2 bytes are allocated to each of input data and time, resulting in 4 bytes per data. In terms of bytes, a total of 4096 data can be recorded per sensor. Assuming an earthquake load and setting the frequency to f = 20 Hz, 10 points of data are required per cycle in order to avoid missing the peak value in stress analysis.
The data acquisition time interval TS is approximately 5 ms. Therefore 2
Data for 0 seconds can be recorded. If the buffer memory 22 has a capacity of 32 Kbytes, it can record approximately 40 seconds of data.4In the case of a normal earthquake,
Since the duration is 10-odd seconds, 16 bytes of memory is sufficient.

When the data recorded in the buffer memory 22 becomes full, it is sent to the host computer 27 via the interface 26.
will be forwarded to. By the way, it is unknown when earthquakes that require continuous data recording will occur. On the other hand, if an earthquake occurs when the buffer memory 22 is almost full, the memory becomes full while data is being continuously recorded, making it impossible to record data.

Therefore, it is preferable to provide two buffer memories as in this embodiment. When the buffer memory 22 becomes full, data is recorded in the buffer memory 23, and during that time the data in the buffer memory 22 is transferred to the computer 27. 1. Next, when the buffer memory 23 becomes full, data is recorded again in the buffer memory 22, during which time the data in the buffer memory 23 is transferred to the computer 27. In this way, data can be recorded continuously without dead time.

Furthermore, the data recorded in the buffer memory 22 is not transferred to the host computer 27 until it becomes full, but for example, when 2048 data, which is half of the recordable 4096 data, has accumulated. In this case, if it is determined that the data is in a steady state at the previous stage, it is transferred directly to the computer 27.
If it is determined that the steady state is not present due to an earthquake, the data will not be transferred, but the data will continue to be recorded, and the data will be transferred after a certain period of time has passed and the steady state is reached. However, even in this case, if the earthquake continues for 10 seconds or more, the buffer memory 22 becomes full and cannot record data, so it is preferable to provide two buffer memories.

This makes it possible to record data continuously without any dead time even during fairly long earthquakes.

Furthermore, when the host computer 27 is performing the processing described below, the data in the buffer memories 22 and 23 cannot be read.
In 2.23, it is preferable to transfer data when half of the recordable data amount has been accumulated.In other words, if the computer 27 is in a state where data can be read before half of the data is accumulated. If it is determined that the data is not in a readable state, it is transferred to the computer 27 as is, and if it is determined that the data is not in a readable state, it is not transferred and continues to record the data, and after a certain period of time has passed, the data is in a readable state. It shall be transferred after that time.

Note that when the computer 27 is not in a state where data can be read, instead of adjusting the transfer timing of the buffer memories 22 and 23 as described above, the two A strange memory 24.25 may be provided to handle this. In other words, in this case, the data is once transferred from the buffer memory to the two storage memories 24.25, and the computer 27 is in a state where it can read the data. from the storage memory 24, 25 to the computer 27.

The computer 27 records changes in pressure, temperature, etc. of the equipment transferred from the microcomputer 20 as operation wfI history data, but processes the data recorded in chronological order into steady operation data and transient operation data. An operating data analyzer 31 is provided to classify the operating data, and since the stress state has been analyzed in the design thermal cycle for the steady operating state, there is no need to perform detailed stress analysis again, so the steady operating data is stored in the steady operating history database. The data is recorded in the recording circuit 41, and the data in the transient operating state that may require detailed stress analysis is recorded in the transient operating history database recording circuit 42.

The computer 27 is also provided with an operating state analyzer 28 that determines the operating state of the equipment from changes in data such as pressure and temperature of the equipment. This allows data such as pressure and temperature to be
It has a function to recognize and identify operation patterns such as pressure test, start-up, rated output operation, stop, etc. by comparing the data in the design thermal cycle stored in advance in the operation state database storage circuit 33. , the results are converted into a database and stored in the operating state history database storage circuit 34.
Furthermore, the computer 27 is provided with a damage degree analyzer 32 based on driving conditions, which analyzes the analyzed driving patterns and stores in advance a fatigue damage analysis database storage circuit 35 based on the driving conditions. Fatigue damage is calculated by integrating the fatigue cumulative coefficient calculated in the design for each driving pattern.

The calculation results are outputted to the CRT of the computer 27 at any time. Although not shown, the calculation results may be stored in a fatigue damage database storage circuit based on operating conditions.

The fatigue damage analysis described above is a simple fatigue damage analysis based on conventional concepts. The computer 27 can be provided with a function to perform another simple fatigue damage analysis. That is, the results of stress analysis performed using the finite element method by simulating changes in pressure, temperature, etc. of the equipment and under conditions that are somewhat different from the design thermal cycle conditions are made into a database and stored in the stress analysis database recording circuit 43. At this time, stress values are compiled into a database in the form of approximations such as n-dimensional approximation and exponential approximation using pressure, temperature, etc. as variables and parameters. The computer 27 reads out the stress calculation formula for the corresponding location from the stress analysis database recording circuit 43 and transfers it to the stress waveform analyzer 29, and the stress waveform analyzer 29 reads the pressure and pressure stored in the transient operation history database storage circuit. The temperature and the like are converted into stress using the stress calculation formula, and the stress waveform is recorded in the stress history database recording cycle R44. Further, the stress waveform is analyzed by, for example, the rainflow method to determine the stress peak. The damage analyzer 30 reads out S-N curves under various conditions stored in the fatigue strength database storage circuit 45 from the analyzed stress changes, and calculates the fatigue damage φ for each stress waveform.
f is analyzed, and the damage sum is determined as the cumulative damage, for example, by φf=Σ(ni/Nfi) according to the linear damage law, and the fatigue damage database recording circuit 46 records the time t.
Record with.

The damage analyzer 30 also evaluates damage regarding stress corrosion cracking. That is, stress history database storage circuit 44
The stress waveform is read out from , the stress corrosion cracking curve under various conditions stored in the stress corrosion cracking database memory port 1i1147 is read out, the corrosion damage φSCC for each stress waveform is analyzed, and the linear damage is calculated as the cumulative damage. According to the rule, the damage sum is determined by φSCC=Σ(ti/Tri) and is recorded in the corrosion damage database recording circuit 48 along with time t. At this time, unlike fatigue, calculations for each hour are required, so for example, corrosion damage is calculated for each hour.

The results of the above fatigue damage and corrosion damage calculations are displayed on a part of the CRT screen of the computer 27 at any time, and the results of the simple fatigue damage analysis from the above-mentioned operating conditions and the fatigue damage and corrosion damage calculated by this calculation are displayed on a part of the CRT screen of the computer 27. If any of the analysis results show that damage is significant, a warning will be displayed on the screen. At the same time, data such as pressure and temperature recorded in the steady operation history database recording circuit 41 and the transient operation history database recording circuit 42 are transferred to the large-sized host computer 50 via four interfuni chairs. Detailed stress analysis is performed using the finite element method using memorized mesh data of the equipment as shown in Figure 2. In this case, the steady-state operating history is almost completely different from that calculated using the design thermal cycle in terms of accuracy. Therefore, it is sufficient to analyze only the transient operation history.

The stress values analyzed by the host computer 50 are transferred to the computer 27, and the stress waveforms are corrected for the detailed analyzed operating time range and are stored anew in the stress history database recording circuit 44.

Furthermore, the computer 27 uses the modified stress data to calculate fatigue damage using S-N curves under various conditions stored in the fatigue strength database storage circuit 45 in the same manner as described above. Corrosion damage is calculated using stress corrosion cracking curves under various conditions stored in the fatigue damage database recording circuit 46 and corrosion damage database recording circuit 4, respectively.
8, record again with time t. These calculation results are immediately displayed on the CRT screen of the computer 27.

The configuration and functions of the driving monitoring device of this embodiment have been described above.Next, an example of the operation of the driving monitoring device will be described using a flowchart in order to further clarify the functions of this driving monitoring device.

First, an overview of the overall operation of the operation monitoring device will be explained with reference to FIG. In step S1, data is collected from sensors 2 to 7 such as pressure sensors and temperature sensors. In step S2, data waveform analysis and data compression processing are performed, and in step S3, the compressed data is transferred to the host computer 27. The operations from step S1 to step S3 are performed by the microcomputer 20.

Next, in step S4, the operating state is analyzed based on changes in pressure and temperature. In step S5, a chronological history of the analyzed operating state is created as a database and stored in the storage circuit. In step S6, an operation history database is created in which changes in pressure and temperature are stored in raw form. In step S7, stress analysis is performed based on changes in pressure and temperature, and in step S8, the analyzed stress history is created as a database and stored in a storage circuit. In step S9, fatigue damage is analyzed based on the analyzed operating state history and stress history, and in step S10, respective fatigue damage databases are created. Step S1
In step S1, corrosion damage is analyzed based on the analyzed stress history, and in step S12, a corrosion damage database is created. In step S13, cumulative damage is evaluated for each of fatigue damage and corrosion damage, and if the cumulative damage is small, the process returns to step S1 and data is collected again. If the cumulative damage is large, a warning that the damage is large is output in step S14, and the recorded temperature,
Data such as pressure is transferred to the host computer 50.

The work from step S4 to step S15 is
This is done on the computer 27.

Next, detailed stress analysis is performed in step S16, and the detailed stress data is transferred to the computer 27 in step 517. The operations in steps 316 and 17 are performed by the host computer 50.

Next, in step 318, the stress history database is corrected using the transferred detailed stress data, and the damage database is corrected by performing fine fatigue damage analysis.
In step S19, it is determined whether or not to continue the measurement, and if the measurement is to be continued, the process returns to step S1 and data is collected again. The operations of steps 318.19 are performed on the computer 27.

As described above, in the operation monitoring device of this embodiment, the roles of the functions executed by the three computers, the microcomputer 20, the host computer 27, and the host computer 50, are divided. FIG. 4 shows a flowchart summarizing the functions to be executed from the perspective of division of roles.

Next, step S performed by the microcomputer 20
An example of the data collection/compression processing work in steps 1 to S3 will be explained with reference to the flowcharts shown in FIGS. 5 and 6.

In step S21 shown in FIG. 5, data from sensors 2 to 7 such as pressure sensors and temperature sensors are collected. In step S22, these analog data are amplified and A/D converted by the amplifiers 8 to 13 and the A/D conversions 14 to 14. In step S23, the digital data is passed through a linearizing ROM to be described later to convert it into numerical values of pressure and temperature.Next, in step 324, the waveform of the data, that is, the state of change, is analyzed by the waveform analyzer 21, and in step S25. In a state close to a steady state with little change, there is no need to leave detailed data, so in step S26, unnecessary data is compressed, and the data is recorded in the buffer memory 22 or 23. Buffer memory 22 or 2
When the data in step 3 becomes full, the compressed data is transferred to the computer 27 in step S27.
In step S28, it is determined whether or not the instruction from the computer 27 is to continue measurement, and if it is to continue, the process returns to step S21 to collect data.

An example of the data compression processing, recording and transfer operations performed in steps S25 to S27 will be explained with reference to the flowchart shown in FIG. In step S31, the sampling interval Ts, data compression processing reference value Tc, and data storage interval Td are set.In step S32, measurement is started.In step S33, a buffer for temporarily recording the compressed data is set. In order to select either one of the memories 22 and 23, J=1 is set as a flag, and in step S34, data is recorded in the buffer memory 22. In step S35, the first data after the start of measurement is recorded. In order to leave it as is, set I=1.

In step 336, it is determined whether or not the measurement is to be continued. If the measurement is to be continued, the process proceeds to step S37, where data is collected in a form (t, T) combined with time. In step 338, I
If I=1, it is determined that the collected data is the first data after the start of measurement, and in step S39, (t(I), T(I))=(t , T) (where ■=1). At the same time, (tk,
Tk) - (t, T), I=I+1 is set. Next, the process returns to step S36.37 and the next data is collected, and in step 338, ! = 1, in step S40, the data storage interval is determined. That is, if there is little change in continuously collected data, it is determined that the equipment whose operation is being monitored is in a steady operating state. Although it is not necessarily necessary to leave the data, it is determined whether or not more than T1 has elapsed since the previous measurement time in order to leave the data just in case. The difference from the tk tentatively recorded in step 838 is 7.
If 6 or more, that is, t-tk≧Td, step 341
As data, (t N), T(I)) = (t, 'I
') and at the same time (tk, Tk'') = (t,
T), I=I+1 is set again in step S42,
The data change rate is determined, and if the difference between the measured data T and the data Tk temporarily recorded in step 341 is smaller than the data compression processing reference value Tc, no data is left and the process returns to step S36.37. , continue data collection. However, in step 342, the measured data T
If the difference between the data Tk and the temporarily stored data Tk becomes larger than the data compression processing standard giTc, step S
In step 43, it is determined whether the previous data has been recorded. If the previous data was recorded with 1-tk = TS, in step S44, (t (I), T (I)) = (t, T) is saved as data,
At the same time (tk, Tk) = (t, T), I = I + 1
If t-tk=Ts is not set and the previous data has not been recorded, step S4
5, in order to retain the previous data that was temporarily saved, (t (1), T (1)) - (tk, Tk)
and at the same time temporarily save data (tk, Tk)=
(t, T), and set ■=1+1.

Repeat the above steps to save the data, or
Since the buffer memory 22 has a capacity limit as described above, in this example, in step S46, the number I of accumulated data is compared with the capacity MIf of the buffer memory 22, and if I does not exceed If, , step S36.
Return to step 37 and continue measurement. If ■ exceeds If, in step S47, it is determined whether the buffer memory recording data is 22 or 23 based on whether J=1. It is determined that J is full, and J=2 is set in step S48. Then, in step S49, the buffer memory is switched and data is recorded in the buffer memory 23. While data is being recorded in the buffer memory 23, in step S50, the data in the buffer memory 22 is transferred to the host computer 27. do.

Next, if I exceeds If in step S46, it is confirmed that J=2 in step S47, and step S
At 51, the data in the buffer memory 23 is transferred to the host computer 27. Then, in step S33, J is reset to 1, and the compressed data is recorded in the buffer memory 22.By following these steps, the data such as measured pressure and temperature can be deleted. It is possible to perform continuous compression processing and send only the data necessary for damage analysis to the host computer.

Next, an example of operating state monitoring, stress analysis, and damage analysis performed by the computer 27 will be explained with reference to a flowchart shown in FIG.

In FIG. 7, in step S61, data transferred from the data collection/compression processing microcomputer 2o is received. In step S62, the operating state analyzer 28 is driven and receives the input data and values of pressure and temperature, or rate of change, etc. corresponding to various operating states such as startup, steady operation, scram, and stop. The driving state data is compared with the driving state data stored in the driving state database storage circuit 33, the driving state is analyzed, and the time-series changes are recorded in the storage circuit 34 as a driving state 8 history database in step 864. Then, step S65
Then, the damage degree analyzer 32 is driven, and the damage degree is analyzed using the damage clothes in the damage analysis database 35 that have been calculated and stored in advance for each operating state, and the cumulative damage is evaluated in step S66. If the degree of damage is large, a warning is issued in step 581; if the degree of damage is small, the process returns to step S62 to continue analyzing the operating state.

The above is damage evaluation based on confirmation of operating conditions, but next, damage evaluation will be performed using more detailed stress analysis. That is, in step S67, the operating data analyzer 31 is driven to analyze the change state of data such as pressure and temperature, and the time period during which data is recorded only at each data storage interval Td shown in FIG. 6 continues. If the conditions are constant, it is determined that the equipment being monitored is in a steady state of operation for the duration of time, and the data is recorded at small time intervals. , during that duration, it is determined that the monitored equipment is in a transient operation state, and in steps S68 and 69, the memory port g4 is stored as a steady operation history database and a transient operation history database.
1,42.

In step S70, the waveform analyzer 29 is driven to analyze stress based on the stress analysis database stored in the stress analysis database storage circuit 43, based on the relationship between stress and pressure changes, temperature changes, etc., and in step S72. This is recorded in the memory circuit 44 as a stress history database.

In step S73, the damage analyzer 30 is driven to analyze fatigue damage according to Miner's rule, for example, based on the fatigue strength database under various environments stored in the fatigue strength database storage circuit 45, and in step S87
5, it is recorded in the memory circuit 46 as a fatigue damage database. Similarly, in step S76, corrosion damage is analyzed based on the database stored in the stress corrosion cracking database storage circuit 47, and in step 378, corrosion damage is recorded in the circuit 48 as a database of corrosion damage. The cumulative damage of damage and corrosion damage is evaluated, and if the damage is small, it is determined in step S80 whether or not to continue the measurement, and if it is to be continued, it is determined in step S6.
Returning to step 1, operation monitoring is continued, and if the damage is large, a warning is output in step S81, and in step S382
The data for detailed analysis is transferred to the host computer 50.

A detailed flowchart of the operation state monitoring and damage analysis performed in steps S61 to S66 is shown in FIG. 8. In step 5101, data transferred from the data collection/compression processing microcomputer 20 is received. In step 5102, the operating state analyzer 28 is driven, in step 5103 the rate of change of the input data is calculated, and in step 5105 it is determined whether the rate of change is large or small.

If it is determined that the rate of change is small, step 8106
The current operating state is determined to be steady output operation such as 100% rated output operation or constant output operation,
In step 5107, start, steady operation, scram, stop,
The steady operation data is read from the operation state database storage circuit 33 which stores data such as pressure and temperature values or rate of change corresponding to various operating states, and in step 5ios, the accepted data is read. and its read data, and in step 5109 the output and time are recorded.

If it is determined in step 5105 that the rate of change is large, the process proceeds to step 5110, where it is further determined whether the rate of change is constant. If it is determined that the rate of change is constant, the process proceeds to step 5111, where the current operating state is It is determined that the unsteady operation is in progress, such as an overload test, trial run, start-up, normal stop, or change in operation state, and in step 5111 unsteady operation data is read from the operation state database storage circuit 33, and in step 5113, the data change pattern is determined. are compared, the pattern is classified in step 5114, and the pattern and time are recorded in step 5115.

If it is determined in step 5110 that the rate of change is not constant, the process proceeds to step 8116, where it is determined that the current operating state is in transition during an earthquake, scram I, scram ■, etc.11, and in step 5117, the operating state is Read the transient operation data from the database storage circuit 33, and step 8
At step 118, patterns of data changes are compared, and at step 51
The pattern is classified at step 19 and the pattern and time are recorded at step 5120.

Then in step 5121, step 5109.3115
．． Perform time-series processing of the data recorded at 3120,
In step 5122, it is recorded in the storage circuit 34 as an operating state history database. Then, in step 5123, the damage analyzer 32 is driven to analyze the damage using the damage analysis database 35 that has been calculated and stored in advance for each operating state, and in step 5125, the cumulative damage is evaluated. Then, if the degree of damage is large, step S8 in FIG.
1 gives an alarm; if the degree of damage is small, step 510
Return to step 2 and continue the operating state analysis for i+1.

Finally, an example of detailed stress analysis performed by the large-sized host computer 50 and an example of subsequent damage analysis performed by the computer 27 will be described with reference to the flowchart shown in FIG.

In step S91, data such as pressure and temperature for detailed analysis is received from the computer 27. Step S92
Now, let's look at the FEM of the equipment or part of the equipment to be analyzed.
Load the analysis trace mesh data, input time changes such as pressure and temperature together with boundary conditions, and proceed to step S93.
Perform FEM stress analysis. Then, step S94
The stress data analyzed is transferred to the computer 27. The computer 27 receives the stress data from the host computer, and uses this data to perform the steps in step S95.
The stress history database stored in the memory circuit 44 is corrected, and in step S96, fatigue damage is calculated based on the fatigue strength database using the corrected stress history database in the same manner as step S73 in FIG.
At 97, the fatigue damage database stored in storage circuit 46 is modified. Then, in step 398, the cumulative degree of damage is evaluated, and if the degree of damage is large, step 399
An alarm is output at step 5100, and if it is small, it is determined whether or not to continue the measurement at step 5100.
Returning to step S61 in the figure, operation monitoring is continued.

Examples of the results of simulating the function of the waveform analyzer 21 attached to the microcomputer 20 described above that analyzes the waveform of a digital signal and performs data compression processing are shown in FIGS. 10 to 12, where the vertical axis represents the temperature T. ('C), the horizontal axis is an arbitrary time t
(hr), white circles and black circles are simulated data of the measured raw data.

First, in Fig. 10, for such data, T
When c=5°C and Td=5hr are set, the black circles connected by the solid line are the compressed data. In steady state, data is compressed significantly, and even in transient response state, small temperature fluctuations are ignored and data is compressed.

However, if the temperature at time ti is Ti, then time t
Letting the temperature at i+1 be Ti+1, the temperature difference Δ'! '= lTi+1-TI<Tc, time t
Temperature T at i+1 Discard i+1 and set time t++2C
In this case, if the temperature Ti+2 at time ti+2 is saved as data as the temperature 'r''++1 at time t i+1, the data immediately before entering the transient operation when the steady operating state shifts to the transient operating state is As a result, the apparent upper temperature change rate becomes smaller.In Figure 10, this is the case for the 3rd, 5th, 7th, and 12th data from the left.Therefore, the rate of change is large. It is necessary to leave the data immediately before the data becomes 0. For example, (to, To), (tl, TI), (
12, T2), (t3.T3), (t4゜T2), (to, To), (tLTl), (t3
．． FIG. 11 shows the result of such data processing that leaves T3) and (t4.T4), and the black circles in the figure are compressed data.

In addition, even in transient operating conditions, if the transient response is relatively slow, such as starting and stopping, the rate of change will be almost constant. If you leave the data that jumps out of 're and perform compression processing on the parts that fall within a certain culture rate, you can achieve a considerable amount of data compression, and Figure 12 shows the results of this processing. In Figure 0, in the temperature decreasing state at the right end, the rate of decrease immediately after the start of decrease is a little slow, and the rate of decrease becomes faster after reaching room temperature, but when such processing is performed, the temperature decreases in two stages. It can be seen that the data is considerably compressed.

As explained above, according to the operation monitoring device of this embodiment, the microcomputer 20 collects data such as temperature and pressure from the sensor and compresses it, thereby achieving a significant compression of stored data. At the same time, by recording this compressed temperature, pressure, etc. data as operation history data in the host computer 27, it becomes possible to manage the operation history of plant equipment, and the operation history data can also be used to prevent damage to plant equipment. Evaluation can be carried out.

In addition, the host computer 27 performs stress analysis on plant equipment using the recorded operation history data, analyzes damage to the plant equipment from the analyzed stress changes, and records and evaluates cumulative damage. Damage to plant equipment can be assessed directly online from recorded operating history data. Further, since the stress analysis here is performed based on a stress analysis database stored in advance, it is simple but can be performed at a relatively high speed.

Furthermore, the host computer 27 analyzes the operating status of plant equipment based on changes in the recorded operating history data, and records the operating status as operating status history data, so that not only the operating history but also the operating status history is saved. This enables more detailed operation history management, and by analyzing damage to plant equipment using this recorded operating state history data and recording and evaluating the cumulative damage, it is possible to analyze the damage from the above stress analysis results. Separately from damage evaluation, secondary damage evaluation can be performed in accordance with the conventional concept, and by using this as a guideline for operation monitoring, the functionality as an operation monitoring device can be further improved.

Furthermore, a host computer 5 performs detailed stress analysis using operation history data transferred from the host computer 27.
By setting 0, if the damage evaluation on the host computer 27 determines that the damage has become large, or when an earthquake load greater than expected is applied, the host computer 27 can perform a simple stress analysis. In addition, highly accurate stress analysis can be performed, and damage can be evaluated and evaluated with high accuracy by performing detailed damage evaluation based on the results.

Further, according to the operation monitoring device of this embodiment, the microcomputer 20 and the host computer 27 perform data collection and compression processing, and the host computer 27 performs data recording and other processing. By allocating the functions to be executed by the two, it is possible to provide a dedicated data processing device with a small microcomputer for each sensor for data collection and compression processing, and the number of processing devices is 2 to 3. Since it is only about the size of a single board, the entire system can be made small. For example, a large number of microcomputers and their processing devices can be housed in one console rack, and this can be installed in the control room or measurement room of an atomic couplant. It can be installed in one corner. Furthermore, since the entire system becomes smaller, the system can be constructed at a lower cost.

Furthermore, by sharing the roles of the functions to be executed between the host computer 27 and the host computer 50, such as performing simple stress analysis on the host computer 27 and detailed stress analysis on the host computer 50,
Normal damage evaluation is performed on a PC-level high-level computer 27, which is a large-scale host computer 5 that requires enormous maintenance and management costs.
In addition to significantly shortening the time for using 0, when necessary, the host computer 50 can perform high-precision stress analysis, accurately evaluate damage, and economically enhance the function as an operation monitoring device.

Another embodiment of the present invention will be described with reference to FIGS. 13 to 19.

The operation monitoring device shown in Figure 1 has all the functions from data collection to detailed stress analysis and damage evaluation, but if the function is only to monitor the operation status, it can be done with a simpler configuration. 13 to 19 show such an embodiment.

In addition, in FIGS. 13 to 16, in order to simplify the illustration, only the system using one of the sensors 2 to 7 shown in FIG. 1 is shown, and the system of the pond sensor is omitted. .

Figure 13 shows the simplest configuration, including a sensor that detects pressure, temperature, strain, etc., such as a pressure sensor 2, an amplifier 8 that amplifies the sensor signal, and an A/D that converts the amplified analog signal into a digital signal. It is composed of a converter 14, a microcomputer 20 having a waveform analyzer 21 for compressing measured data, an interfuniary chair 26, and a computer 27 having an operation history database storage circuit 50 attached thereto. The microcomputer 20 collects data, and also transfers the data compressed by the waveform analyzer 21 to the host computer 27 via the interface chair 26, and the computer 27 stores this data in the storage circuit 51 as a driving history database. Record.

In this embodiment, as in the embodiment shown in FIG. 1, by compressing data such as temperature and pressure from the sensor,
Saved data can be significantly compressed.

Furthermore, in this embodiment, the compressed data is only recorded as operation history data, but even in this case, it is possible to manage the operation history of plant equipment using this recorded operation history data. In addition, the operation history data can be retrieved at an appropriate time to assess damage to plant equipment.

The embodiment shown in FIG. 14 is a microcomputer 20 of the embodiment shown in FIG. 13 with a buffer memory 22 added thereto. The microcomputer 20 collects data and records the data compressed by the waveform analyzer 21 in a buffer memory 22 in chronological order.When the buffer memory 22 is full, the data is recorded via the interface chair 26. The measured data is transferred to the upper converter 27 and compressed again, and then stored in the buffer memory 22.

The embodiment shown in FIG. 15 is obtained by adding a second buffer memory 23 to the microcomputer 20 of the embodiment shown in FIG. The microcomputer 20 collects data and records the data compressed by the waveform analyzer 21 in a buffer memory 22 in chronological order. When the buffer memory 22 is full, the next data is stored in the buffer. During this time, the data in the buffer memory 22 is transferred to the upper converter 27 via the interface 26.Next, when the buffer memory 23 becomes full, the next data is transferred to the buffer memory 22 again. During this time, the data in the buffer memory 23 is transferred to the upper converter 27 via the interfuniary chair 26.

By repeating this, even if the transient response continues for a long time, it is possible to continuously compress the measurement data and then transfer it to the host computer 27.

The embodiment of FIG. 16 is obtained by adding two storage memories 24 and 25 to the microcomputer 20 of the embodiment of FIG. 15. The microcomputer 20 collects data and records the data compressed by the waveform analysis 8121 continuously and in chronological order using two buffer memories 22 and 23 alternately. While the data is being transferred to the higher-level computer 27, it is possible to record the data in another buffer memory, thereby making it possible to measure without missing any data. However, while the computer 27 is processing data or performing calculations, data in the buffer memory cannot be transferred, so the two storage memories 24.2
5 to temporarily transfer the recording, converter 27
The data in the storage memory 24 and 25 is transferred when the storage memory 24 and 25 become free.

The embodiment shown in FIG. 17 includes sensors 2 to 7 that detect pressure, temperature, strain, etc., amplifiers 8 to 13 that amplify sensor signals,
A multiplexer 51 for switching signals from a large number of sensors, an A/D converter 52 for converting an amplified analog signal into a digital signal, a microcomputer 20 that includes a waveform analyzer 8121 and a buffer memory 22, and a microcomputer 20 for switching the multiplexer 51. computer 20
GP-IB interfuniice 5 for control by
3, an interface chair 26, and a computer 27 having an attached driving history database storage circuit 50. Although this is called a transient response, it is a system configuration that corresponds to a case where the reaction speed is low.The multiplexer 51 controlled by the microcomputer 20 via the GP-IB interface 53 switches the sensor to be measured and takes in the data. Waveform analysis II! 121
The data is compressed and recorded in the buffer memory 22. As a data collection method, there is a method in which measurements are taken from each sensor at certain time intervals, and the time and data from each sensor are combined and recorded as one data. In this case, if the amount of change in data from any one sensor is large, other data will also be recorded. Therefore, in FIG. 17, there are 6 sensors, and if 2 bytes are assigned to each, one piece of data is composed of 14 bytes in total. Another method is to record in 4 bytes for each individual sensor, but which of the former method of recording all at once and the smaller amount of data in the total operating time differs depending on the operating conditions.

The embodiment shown in FIG. 18 is a system that includes sensors 2 to 5 that detect things such as pressure and temperature that have relatively long data collection intervals, and sensors 6 and 7 that detect things that have extremely short data collection intervals such as strain and acceleration. This is the configuration of an operation monitoring device that is configured separately. That is, on the sensor side that detects data with relatively long data collection intervals, a microcomputer is equipped with sensors 2 to 5, amplifiers 8 to 11, multiplexer 5 m, A/D converter 52, waveform analyzer 21, and buffer memory 22. The sensor side, which is composed of a computer 20 and a GP-IB interface 53 and detects data with extremely short data collection intervals, has a sensor 6°7 and amplifiers 12 and 13.
, an A/D converter 18° 19, a waveform analyzer 21 and two buffer memories 22 provided exclusively for each system.
．． 23, and all the microcomputers 20 are connected to a computer 27 via an interface chair 26.

In this case, it is desirable to compress and record each sensor in 4-byte format in a time-series manner, and then use the computer 27 to reconstruct the data all at once.

In the embodiment shown in FIG. 19, data from sensors 2 to 5 that detect pressure, temperature, etc. that have a relatively long data collection interval is sent to a host computer 27 instead of a microcomputer.
The data is collected by directly controlling the multiplexer 51 via the GP-IB interface 53. Therefore, in this case, data converted from an analog signal to a digital signal by the A/D converter 52 is directly transferred to the computer 27 via the GP-IB interface 53. The configuration of the sensor that detects extremely short data sampling intervals is the same as the embodiment shown in FIG.

Finally, a more specific circuit configuration of the data acquisition and compression processing portion, which mainly includes a sensor and a microcomputer, in the operation monitoring device of this embodiment will be explained with reference to FIG. Note that FIG. 20 also shows only one system.

The data collection and compression processing part of the operation monitoring device uses pressure,
A sensor 2 that detects temperature, etc., an amplifier 8 that amplifies the sensor signal, an A/D converter 14 that converts the amplified analog signal into a digital signal, and a linear converter that converts the signal from the sensor into a proportional relationship with measurement data. ROM for rise
62, Buffer memory 22.23 for temporarily recording collected data, Program ROM 65 containing a program for collecting data and processing data.
, delay switches 66 to 68 that can set the circuit data sampling interval time TS, the reference value TC for data compression, the time interval Td for always recording data without compressing it, etc.
A microcomputer 20 with attached switches 69 and 70 for instructing start and stop of data collection, and a GP
- It is composed of an IB interface 71 and a computer 27.

In the linearization ROM 62, data input from the A/D converter 14 is transferred to the buffer memory at high speed by writing linearization data for correcting the signal from the sensor into a proportional relationship with the measurement data as ROM data to the ROM address. It is possible to record at 22.23.

In addition, the data sampling interval time Ts, the data compression reference value T
C. Setting the time interval Td to ensure that data is recorded without compressing it and instructions for starting and stopping data collection are provided in GP-
Computer 2 via IB interface 1
7, it is also possible to perform this on the microcomputer 20.4 Also, a time measurement counter is provided inside the microcomputer 20, and with 16 bits, for example, if the data collection interval time Ts is 1 second, the maximum 65
．． The time is measured up to 535 seconds, but if it exceeds 535 seconds, the measurement is restarted from 0 seconds, so if the measurement is for a long time, adjustment is required on the computer 27.

〔Effect of the invention〕

As described above, according to the operation monitoring device of the present invention, the signals of various sensors installed in the equipment are measured online, and the data is compressed and recorded, thereby making it possible to significantly compress the stored data. It has the effect of being able to manage the history of operating conditions and also being able to evaluate fatigue damage and corrosion damage.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the overall configuration of an operation monitoring device according to an embodiment of the present invention, and FIG. 2 is an example of a mesh diagram used for detailed analysis of damage at an evaluation target location.
FIG. 3 is a flowchart showing an outline of the overall operation of the operation monitoring device shown in FIG. 1, FIG. 4 is a flowchart showing the flowchart shown in FIG. is a flowchart showing the details of the processing work performed by the microcomputer, FIG. 6 is a flowchart showing the details of data collection and compression processing among the works performed by the microcomputer, and FIG. 7 is a flowchart showing the details of the processing work performed by the microcomputer. FIG. 8 is a flowchart showing details of the processing work performed by the host computer, of which the host computer FIG.
FIG. 13 is a diagram showing the degree of compression when F1 determined data is compressed; FIGS. The figure is a diagram showing the equipment configuration of a system that performs data collection and compression processing of the operation monitoring device. Explanation of symbols 1...Piping nozzle (plant equipment) 2-7...Sensors 8-13...Amplifiers 14-19...A/D converter 20...Microcomputer 21...Waveform analyzer 22.23...Buffer memory 26...Interface 27...Upper computer 28...Operating state analyzer 29...Waveform analyzer 30...Damage degree analyzer 31...Operating data analyzer 32...Damage degree analyzer 33...Operating state database storage circuit 34...Operating state history database storage circuit 35...Fatigue damage analysis database storage circuit 41...Steady operation history database storage circuit 42...・Transient operation history database storage circuit 43...Stress analysis database storage circuit 44・
...Stress history database storage circuit 45...Fatigue strength database storage circuit 46...Fatigue damage database storage circuit 47...Stress corrosion cracking database storage circuit 48...Four corrosion damage database storage circuits...Interface 50...Host Computer Applicant Hitachi, Ltd. Representative Patent Attorney Kasuga Yuzuru Figure 4 Figure 5 Figure 9 Temperature T ('C) Temperature T ('C) Tower

Claims (16)

[Claims] (1) Detect state quantities such as pressure, temperature, strain, etc. in an operation monitoring device for plant equipment to evaluate damage such as fatigue and corrosion caused by pressure, temperature, strain, etc. loaded on plant equipment. a sensor, a microcomputer that collects the data of the state quantity from the sensor and compresses it, and the compressed state quantity that is connected to the microcomputer via an interface and transferred from the microcomputer. A driving monitoring device comprising: a host computer that records the data as driving history data. (2) In the plant equipment operation monitoring device according to claim 1, the host computer further performs stress analysis of the plant equipment using the recorded operation history data based on a stress analysis database stored in advance. An operation monitoring device characterized by analyzing damage to plant equipment from the analyzed stress changes, and recording and evaluating cumulative damage. (3) The plant equipment operation monitoring device according to claim 1, further comprising: a host computer that is connected to the host computer via an interface and that performs detailed stress analysis using the operation history data transferred from the host computer. The host computer analyzes the damage to the plant equipment again based on stress changes that have been subjected to detailed stress analysis, and records and evaluates the cumulative damage by replacing it with the cumulative damage recorded in the host computer. Driving monitoring device. (4) In the plant equipment operation monitoring device according to claim 1, the host computer further analyzes the operating state of the plant equipment from changes in the recorded operation history data,
A driving monitoring device that records the driving state as driving state history data. (5) In the plant equipment operation monitoring device according to claim 4, the host computer further analyzes damage to the plant equipment using the recorded operating state history data, and records and evaluates cumulative damage. A driving monitoring device characterized by: (6) Detect state quantities such as pressure, temperature, strain, etc. in an operation monitoring device for plant equipment to evaluate damage such as fatigue and corrosion caused by pressure, temperature, strain, etc. loaded on plant equipment. a first means; a second means for collecting the state quantity data from the first means and compressing the data; and operating the compressed state quantity data from the second means. a third means for recording as historical data; a fourth means for analyzing the operating state of the plant equipment from changes in the compressed state quantity data from the second means; A driving monitoring device comprising: fifth means for recording the analyzed driving state as driving state history data. (7) The plant equipment operation monitoring device according to claim 6, further comprising analyzing damage to the plant equipment using the operating state history data recorded by the fifth means, and recording and evaluating cumulative damage. Stress analysis of the plant equipment is performed using the operation history data recorded by the third means based on the sixth means and the stress analysis database stored in advance, and the plant equipment is analyzed based on the analyzed stress change. 7. A driving monitoring device characterized by comprising: seventh means for analyzing damage to and recording and evaluating cumulative damage. (8) The plant equipment operation monitoring device according to claim 7, further comprising an eighth means for performing detailed stress analysis using the operation history data recorded by the third means, the eighth means Operation monitoring characterized in that damage to plant equipment is analyzed again based on stress changes subjected to detailed stress analysis, and the cumulative damage is recorded and evaluated by replacing the cumulative damage with the cumulative damage recorded in the seventh means. Device. (9) In the plant equipment operation monitoring device according to claim 6, the second means is constituted by a microcomputer, and the third to fifth means are a host computer connected to the microcomputer via an interface. An operation monitoring device characterized by comprising: (10) The plant equipment operation monitoring device according to claim 7, wherein the second means is constituted by a microcomputer, and the third to seventh means are a host computer connected to the microcomputer via an interface. An operation monitoring device characterized by comprising: (11) The plant equipment operation monitoring device according to claim 8, wherein the second means is constituted by a microcomputer, and the third to seventh means are connected to a host computer connected to the microcomputer via an interface. An operation monitoring device comprising: the eighth means comprising a host computer connected to the host computer via an interface. (12) Detect state quantities such as pressure, temperature, strain, etc. in an operation monitoring device for plant equipment to evaluate damage such as fatigue and corrosion caused by pressure, temperature, strain, etc. loaded on plant equipment. A sensor, an amplifier that amplifies the signal of the sensor, an A/D converter that converts the analog signal amplified by the amplifier into a digital signal, and a waveform analysis that analyzes the waveform of the digital signal and performs data compression processing. a microcomputer having a device attached thereto; a driving history database storage circuit connected to the microcomputer via an interface and recording state quantity data transferred from the microcomputer as driving history data; an operating state analyzer that analyzes the operating state of plant equipment based on changes in the operating state, an operating state history database storage circuit that records the analyzed operating state as operating state history data, and operating history data recorded in the operating history database storage circuit. A stress waveform analyzer that converts stress into plant equipment stress and analyzes the stress waveform, a stress history database storage circuit that records the analyzed stress waveform as stress history data, and a stress history database storage circuit that records changes in the stress waveform of this stored stress history data. An operation characterized by comprising: a first damage degree analyzer that analyzes damage to plant equipment and determines the cumulative damage; and a host computer that is attached with a damage database storage circuit that records the cumulative damage as damage data. Monitoring equipment. (13) The plant equipment operation monitoring device according to claim 12, further comprising the step of: being connected to the host computer via an interface, and performing detailed stress analysis using operation history data from the operation history database storage circuit of the host computer. The host computer analyzes the damage to plant equipment again based on changes in stress waveforms that have been subjected to detailed stress analysis, and stores the accumulated damage as damage data recorded in the damage database storage circuit of the host computer. A driving monitoring device characterized by replacing and recording. (14) In the plant equipment operation monitoring device according to claim 12, the host computer analyzes damage to the plant equipment using the operating state history data recorded in the operating state history database storage circuit, and analyzes the cumulative damage caused by the damage to the plant equipment. Second to evaluate
An operation monitoring device characterized by having a damage degree analyzer. (15) In the plant equipment operation monitoring device according to claim 12, the host computer analyzes changes in state quantity data transferred from the microcomputer to determine whether the plant equipment is in a steady operating state. The apparatus further includes an operation data analyzer that determines whether the state quantity is in a transient operation state and classifies the data of the state quantity into steady operation data and transient operation data, and the operation history database storage circuit is configured to classify data of the state quantity into steady operation data and transient operation data. It consists of a steady operation history database storage circuit that records state quantity data classified as steady operation history data, and a transient operation history database storage circuit that records state quantity data classified as transient operation data as transient operation history data, The operation monitoring device is characterized in that the stress waveform analyzer converts the transient operation history data recorded in the transient operation history database storage circuit into stress of plant equipment and analyzes the stress waveform. (16) In the plant equipment operation monitoring device according to claim 12, the waveform analyzer of the microcomputer is configured to operate when the range of change in the data of the collected state quantity is smaller than a predetermined value and in a steady transient response state. An operation monitoring device characterized by discarding data and compressing the data when the rate of change is smaller than a predetermined value.