JPH02216890A - パターン形成方法 - Google Patents

パターン形成方法

Info

Publication number
JPH02216890A
JPH02216890A JP32301989A JP32301989A JPH02216890A JP H02216890 A JPH02216890 A JP H02216890A JP 32301989 A JP32301989 A JP 32301989A JP 32301989 A JP32301989 A JP 32301989A JP H02216890 A JPH02216890 A JP H02216890A
Authority
JP
Japan
Prior art keywords
pattern
etching
substrate
etched
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32301989A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0432557B2 (enrdf_load_stackoverflow
Inventor
Takanari Nagahata
隆也 長畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8757484A external-priority patent/JPS60231386A/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP32301989A priority Critical patent/JPH02216890A/ja
Publication of JPH02216890A publication Critical patent/JPH02216890A/ja
Publication of JPH0432557B2 publication Critical patent/JPH0432557B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
JP32301989A 1984-04-28 1989-12-13 パターン形成方法 Granted JPH02216890A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32301989A JPH02216890A (ja) 1984-04-28 1989-12-13 パターン形成方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8757484A JPS60231386A (ja) 1984-04-28 1984-04-28 パタ−ン形成方法
JP32301989A JPH02216890A (ja) 1984-04-28 1989-12-13 パターン形成方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP8757484A Division JPS60231386A (ja) 1984-04-28 1984-04-28 パタ−ン形成方法

Publications (2)

Publication Number Publication Date
JPH02216890A true JPH02216890A (ja) 1990-08-29
JPH0432557B2 JPH0432557B2 (enrdf_load_stackoverflow) 1992-05-29

Family

ID=26428828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32301989A Granted JPH02216890A (ja) 1984-04-28 1989-12-13 パターン形成方法

Country Status (1)

Country Link
JP (1) JPH02216890A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60231386A (ja) * 1984-04-28 1985-11-16 ロ−ム株式会社 パタ−ン形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60231386A (ja) * 1984-04-28 1985-11-16 ロ−ム株式会社 パタ−ン形成方法

Also Published As

Publication number Publication date
JPH0432557B2 (enrdf_load_stackoverflow) 1992-05-29

Similar Documents

Publication Publication Date Title
WO2000014797A3 (en) Isolation region forming methods
GB1537306A (en) Processing epitaxial layers
JPH02216890A (ja) パターン形成方法
JPH0231872B2 (enrdf_load_stackoverflow)
JPS5898942A (ja) 超微細パタ−ンの形成法
JPS59141222A (ja) 半導体装置の製造方法
JPS5820157B2 (ja) 回路板の形成方法
JPS61287241A (ja) 半導体素子の製造方法
JPH04307958A (ja) 半導体集積回路装置の製造方法
JPH0258222A (ja) パターン形成方法
JPH03156928A (ja) 半導体装置及びその製造方法
KR920006202B1 (ko) Hall소자의 전극패드 제조방법
JPH023926A (ja) 配線の形成方法
JP2740292B2 (ja) 半導体素子の製造方法
JP2624963B2 (ja) 薄膜形成方法
JPS59106122A (ja) 半導体装置の製造方法
JPH0733568B2 (ja) 薄膜形成法
JPH02231722A (ja) 配線パターン形成方法
JPS6286714A (ja) 半導体装置の電極の形成方法
JPS6149437A (ja) 半導体装置
JPH01298740A (ja) 半導体装置
JPH04318932A (ja) 金属パターン形成方法
JPS61214430A (ja) 半導体装置の製法
JPS63133647A (ja) 半導体装置の製造方法
JPS63164338A (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term