JPH02216890A - パターン形成方法 - Google Patents
パターン形成方法Info
- Publication number
- JPH02216890A JPH02216890A JP32301989A JP32301989A JPH02216890A JP H02216890 A JPH02216890 A JP H02216890A JP 32301989 A JP32301989 A JP 32301989A JP 32301989 A JP32301989 A JP 32301989A JP H02216890 A JPH02216890 A JP H02216890A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- etching
- substrate
- etched
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 7
- 238000005530 etching Methods 0.000 claims abstract description 36
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 27
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32301989A JPH02216890A (ja) | 1984-04-28 | 1989-12-13 | パターン形成方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8757484A JPS60231386A (ja) | 1984-04-28 | 1984-04-28 | パタ−ン形成方法 |
JP32301989A JPH02216890A (ja) | 1984-04-28 | 1989-12-13 | パターン形成方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8757484A Division JPS60231386A (ja) | 1984-04-28 | 1984-04-28 | パタ−ン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02216890A true JPH02216890A (ja) | 1990-08-29 |
JPH0432557B2 JPH0432557B2 (enrdf_load_stackoverflow) | 1992-05-29 |
Family
ID=26428828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32301989A Granted JPH02216890A (ja) | 1984-04-28 | 1989-12-13 | パターン形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02216890A (enrdf_load_stackoverflow) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60231386A (ja) * | 1984-04-28 | 1985-11-16 | ロ−ム株式会社 | パタ−ン形成方法 |
-
1989
- 1989-12-13 JP JP32301989A patent/JPH02216890A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60231386A (ja) * | 1984-04-28 | 1985-11-16 | ロ−ム株式会社 | パタ−ン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0432557B2 (enrdf_load_stackoverflow) | 1992-05-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2000014797A3 (en) | Isolation region forming methods | |
GB1537306A (en) | Processing epitaxial layers | |
JPH02216890A (ja) | パターン形成方法 | |
JPH0231872B2 (enrdf_load_stackoverflow) | ||
JPS5898942A (ja) | 超微細パタ−ンの形成法 | |
JPS59141222A (ja) | 半導体装置の製造方法 | |
JPS5820157B2 (ja) | 回路板の形成方法 | |
JPS61287241A (ja) | 半導体素子の製造方法 | |
JPH04307958A (ja) | 半導体集積回路装置の製造方法 | |
JPH0258222A (ja) | パターン形成方法 | |
JPH03156928A (ja) | 半導体装置及びその製造方法 | |
KR920006202B1 (ko) | Hall소자의 전극패드 제조방법 | |
JPH023926A (ja) | 配線の形成方法 | |
JP2740292B2 (ja) | 半導体素子の製造方法 | |
JP2624963B2 (ja) | 薄膜形成方法 | |
JPS59106122A (ja) | 半導体装置の製造方法 | |
JPH0733568B2 (ja) | 薄膜形成法 | |
JPH02231722A (ja) | 配線パターン形成方法 | |
JPS6286714A (ja) | 半導体装置の電極の形成方法 | |
JPS6149437A (ja) | 半導体装置 | |
JPH01298740A (ja) | 半導体装置 | |
JPH04318932A (ja) | 金属パターン形成方法 | |
JPS61214430A (ja) | 半導体装置の製法 | |
JPS63133647A (ja) | 半導体装置の製造方法 | |
JPS63164338A (ja) | 半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |