JPH02212508A - Epoxy (meth)acrylate, and resin composition and solder resist resin composition each containing same - Google Patents

Epoxy (meth)acrylate, and resin composition and solder resist resin composition each containing same

Info

Publication number
JPH02212508A
JPH02212508A JP3095589A JP3095589A JPH02212508A JP H02212508 A JPH02212508 A JP H02212508A JP 3095589 A JP3095589 A JP 3095589A JP 3095589 A JP3095589 A JP 3095589A JP H02212508 A JPH02212508 A JP H02212508A
Authority
JP
Japan
Prior art keywords
resin composition
meth
solder resist
acrylate
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3095589A
Other languages
Japanese (ja)
Inventor
Minoru Yokoshima
Kazumitsu Nawata
Tetsuo Okubo
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP3095589A priority Critical patent/JPH02212508A/en
Publication of JPH02212508A publication Critical patent/JPH02212508A/en
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To obtain the title compound excellent in heat resistance, adhesiveness, chemical resistance and storage stability and useful for obtaining a resin composition suitable as a solder resist by reacting a specified tetraglycidyl ether with (meth)acrylic acid.
CONSTITUTION: A tetraglycidyl ether of the formula is reacted with (meth)acrylic acid.
COPYRIGHT: (C)1990,JPO&Japio
JP3095589A 1989-02-13 1989-02-13 Epoxy (meth)acrylate, and resin composition and solder resist resin composition each containing same Granted JPH02212508A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3095589A JPH02212508A (en) 1989-02-13 1989-02-13 Epoxy (meth)acrylate, and resin composition and solder resist resin composition each containing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3095589A JPH02212508A (en) 1989-02-13 1989-02-13 Epoxy (meth)acrylate, and resin composition and solder resist resin composition each containing same

Publications (1)

Publication Number Publication Date
JPH02212508A true JPH02212508A (en) 1990-08-23

Family

ID=12318105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3095589A Granted JPH02212508A (en) 1989-02-13 1989-02-13 Epoxy (meth)acrylate, and resin composition and solder resist resin composition each containing same

Country Status (1)

Country Link
JP (1) JPH02212508A (en)

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