JPH02207542A - Bonding equipment - Google Patents

Bonding equipment

Info

Publication number
JPH02207542A
JPH02207542A JP1028172A JP2817289A JPH02207542A JP H02207542 A JPH02207542 A JP H02207542A JP 1028172 A JP1028172 A JP 1028172A JP 2817289 A JP2817289 A JP 2817289A JP H02207542 A JPH02207542 A JP H02207542A
Authority
JP
Japan
Prior art keywords
wire
bonding
wire bonding
guide hole
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1028172A
Other languages
Japanese (ja)
Inventor
Masato Hirano
正人 平野
Yoshifumi Kitayama
北山　喜文
Yutaka Makino
豊 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1028172A priority Critical patent/JPH02207542A/en
Publication of JPH02207542A publication Critical patent/JPH02207542A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
    • H01L2224/78282—Resistance welding electrodes, i.e. for ohmic heating in the upper part of the bonding apparatus, e.g. in the capillary or wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To make a bonding part small by constituting the title device of a first member and a second member, and connecting a conductor part of the first member and the second member with a welding power supply, while first member is composed of an insulator in which a guide hole guiding a wire and having the conductor part is formed, where second member being conductive faces the first member. CONSTITUTION:A wire 5 is supplied through a guide hole 2 of a member 1 by a wire clamper 6; at the time of bonding, a current is applied to a member 4, the wire 5, and a conductor part 3 of the member 1; the wire 5 is heated and melted; the wire is bonded to a substrate 8. Since the first member has insulating properties, a wire bonding part is not formed by the first member at the time of bonding. The wire bonding part is formed only by a wire bonding surface of the second member, so that the wire bonding part can be made small.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、ＩＣ部品などの製造課程において、ＩＣ側電
極と外部電極をワイヤで１本づつ接続するワイヤボンデ
ィングにおけるボンディング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a bonding device for wire bonding, which connects an IC side electrode and an external electrode one by one with a wire during the manufacturing process of IC parts and the like.

従来の技術 従来からワイヤボンディング工程に用いられるワイヤホ
ンダには種々の方式があるが、多種類の金属の組み合わ
せに適用できるものとして、絶縁体を介して対向し、溶
接電源に接続された２本のウェッジツールによりワイヤ
を熱圧着し接合していた。Conventional technology There are various methods of wire bonding used in the wire bonding process, but one that can be applied to combinations of many types of metals is a method in which two wires are connected to a welding power source facing each other with an insulator in between. The wires were bonded by thermocompression using a wedge tool.

以下図面を参照しながら、上記ウェッジツールについて
説明する。第３図において、１１はワイヤ接合面１１ａ
に向かってワイヤ１４を案内するガイド穴１７を有する
第１部材、１２は第１部材１１に対向しワイヤ接合面１
１ａと同一平面上のワイヤ接合面１２ａを有する第２部
材である。The wedge tool will be described below with reference to the drawings. In FIG. 3, 11 is a wire bonding surface 11a.
A first member 12 having a guide hole 17 for guiding the wire 14 toward the wire bonding surface 1 faces the first member 11.
This is a second member having a wire bonding surface 12a on the same plane as 1a.

１３は第１部材１１、第２部材１２間にはさまれた絶縁
体である。また、第１部材１１、第２部材１２は超硬等
、導電性のある材質から構成されている。なお、第１部
材１１、第２部材１２の下面先端に形成されたワイヤ接
合面１１ａ、１２ａは、ワイヤ１４を被接合面に押圧す
るとともにワイヤ１４に対する通電面となる。このワイ
ヤ接合面１１ａ、１２ａは、断面形状が山形あるいは逆
Ｕ字形に形成されている。また、第１部材１１の下部に
はガイド部１６が形成され、このガイド部１６にワイヤ
１４をワイヤ接合面１１ａに向かって安定して供給する
ガイド穴１７が形成されている。更に、第１部材１１と
第２部材１２には溶接電源１８が接続されている。13 is an insulator sandwiched between the first member 11 and the second member 12. Further, the first member 11 and the second member 12 are made of a conductive material such as carbide. Note that the wire bonding surfaces 11a and 12a formed at the tips of the lower surfaces of the first member 11 and the second member 12 press the wire 14 against the surface to be bonded and serve as current-carrying surfaces for the wire 14. The wire bonding surfaces 11a, 12a are formed in a chevron-shaped or inverted U-shape in cross section. Further, a guide portion 16 is formed in the lower part of the first member 11, and a guide hole 17 is formed in the guide portion 16 for stably supplying the wire 14 toward the wire bonding surface 11a. Furthermore, a welding power source 18 is connected to the first member 11 and the second member 12.

発明が解決しようとする課題 しかしながら、上記従来技術では、ワイヤ接合部１９が
ワイヤ接合面１１ａ、１２ａによって２つ形成されるた
め、ワイヤの接合部１９の長さが長（なり、微小な回路
形成ができない課題を有していた。Problems to be Solved by the Invention However, in the above-mentioned conventional technology, since two wire bonding portions 19 are formed by the wire bonding surfaces 11a and 12a, the length of the wire bonding portions 19 is long (and it is difficult to form a minute circuit). I had a problem that I couldn't do.

課題を解決するための手段 本発明は上記課題を解決するため、ワイヤを案内し、一
部に導体部を有するガイド穴が形成された絶縁体からな
る第１部材と、この第１部材に対向し、かつ導電性をも
つ第２部材とからなり、第１部材の導電体および第２Ｈ
材を溶接電源に接続された構成とした。Means for Solving the Problems In order to solve the above problems, the present invention includes a first member made of an insulator in which a guide hole for guiding a wire and having a conductor portion in a part thereof is formed, and a first member facing the first member. and a second member having conductivity, the conductor of the first member and the second H
The material was connected to a welding power source.

作　　　用 本発明は上記構成において、第１部材のみにワイヤ接合
面を有するので、ワイヤはガイド穴に案内され、第１部
材の接合面に安定して供給され、この接合面によってワ
イヤを被接合面に押圧した状態で溶接電源により通電す
ることでワイヤを局部瞬間加熱し、ワイヤを被接合面に
接合することができ、第１部材、第２部材の両方に接合
面を形成する場合に比べ、接合部が小さ（形成されるの
で、微小回路へのワイヤボンディングが可能となる。In the above structure, the present invention has a wire joining surface only on the first member, so the wire is guided to the guide hole and stably supplied to the joining surface of the first member, and this joining surface allows the wire to be joined to the wire to be joined. By applying electricity from a welding power source while pressed against a surface, the wire can be locally instantaneously heated and bonded to the surface to be welded, compared to the case where bonding surfaces are formed on both the first and second members. , since the bonding area is small (formed), wire bonding to microcircuits is possible.

実施例 以下本発明の実施例について、図面を参照しながら説明
する。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

第１図は本発明の一実施例におけるボンディング装置の
主要部断面図である。第１図において１は内部に導体部
１ａを有し、導体部周辺を絶縁体で構成された第１部材
である。また、第１部材は対向する第２部材４のワイヤ
接合面４ａに向かってワイヤ５を案内するガイド穴２が
備っている。FIG. 1 is a sectional view of the main parts of a bonding device in an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a first member that has a conductor portion 1a inside and the periphery of the conductor portion is made of an insulator. Further, the first member is provided with a guide hole 2 for guiding the wire 5 toward the wire bonding surface 4a of the opposing second member 4.

３は接合時にワイヤ５と接触する導体部であり、第２図
に示すように電源よりツール側面の導体部１ａと一体に
接続されている。４は前述のワイヤ接合面４ａを先端に
有し、第１部材１と対向し導電性を有する第２部材であ
る。６はワイヤを供給しかつ接合後ワイヤ５をクランプ
しワイヤの供給機能を有するワイヤクランパ、７は第１
部材１の導体部１ａ、第２部材の両方が接続された溶接
電源である。Reference numeral 3 denotes a conductor portion that comes into contact with the wire 5 during welding, and is integrally connected to the conductor portion 1a on the side surface of the tool from a power source, as shown in FIG. Reference numeral 4 denotes a second member having the above-mentioned wire bonding surface 4a at its tip, facing the first member 1, and having electrical conductivity. 6 is a wire clamper which has a function of supplying the wire and clamping the wire 5 after joining; 7 is the first wire clamper;
This is a welding power source to which both the conductor portion 1a of the member 1 and the second member are connected.

上記構成において、ワイヤ５を第１部材１のガイド穴２
を通じてワイヤクランパ６によって供給し、ボンディン
グ時に第２部材４、ワイヤ５及び１の導体部３に通電す
ることにより、ワイヤ５が可熱溶融して、ワイヤ接合が
基板８に対して行われる。In the above configuration, the wire 5 is inserted into the guide hole 2 of the first member 1.
By supplying the wire through the wire clamper 6 and applying electricity to the second member 4 and the conductor portions 3 of the wires 5 and 1 during bonding, the wire 5 is thermally melted and wire bonding is performed to the substrate 8.

発明の効果 本発明によれば、ボンディング時に第１部材が絶縁性を
有しているため、第１部材によるワイヤ接合部は形成さ
れず、第２部材のワイヤ接合面でのみワイヤ接合部が形
成されるのでワイヤ接合部を小さくできる。Effects of the Invention According to the present invention, since the first member has insulating properties during bonding, a wire bonding portion is not formed by the first member, but a wire bonding portion is formed only on the wire bonding surface of the second member. This allows the wire joint to be made smaller.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の要部の構成を示す断面図、
第２図は同実施例の第１部材の断面図、第３図は従来例
の概略説明図である。 １・・・・・・第１部材、３・・・・・・導体部、４・
・・・・・第２部材、５・・・・・・ワイヤ、６・・・
・・・クランパ、７・・・・・・溶接電源。FIG. 1 is a cross-sectional view showing the configuration of essential parts of an embodiment of the present invention;
FIG. 2 is a sectional view of the first member of the same embodiment, and FIG. 3 is a schematic explanatory diagram of the conventional example. DESCRIPTION OF SYMBOLS 1...First member, 3...Conductor part, 4...
...Second member, 5...Wire, 6...
... Clamper, 7... Welding power source.

Claims (1)

【特許請求の範囲】[Claims] ワイヤを案内し一部に導体部を有するガイド穴が形成さ
れた絶縁体からなる第１部材と、この第１部材と対向し
、先端にワイヤ接合面を有し導電性をもつ第２部材とか
らなり、第１部材の導体部及び第２部材が溶接電源に接
続されるボンディング装置。a first member made of an insulator in which a guide hole is formed for guiding a wire and having a conductor portion in a part; a second member that is electrically conductive and has a wire bonding surface at its tip and faces the first member; A bonding device comprising: a conductor portion of a first member and a second member connected to a welding power source.
JP1028172A 1989-02-07 1989-02-07 Bonding equipment Pending JPH02207542A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1028172A JPH02207542A (en) 1989-02-07 1989-02-07 Bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1028172A JPH02207542A (en) 1989-02-07 1989-02-07 Bonding equipment

Publications (1)

Publication Number Publication Date
JPH02207542A true JPH02207542A (en) 1990-08-17

Family

ID=12241317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1028172A Pending JPH02207542A (en) 1989-02-07 1989-02-07 Bonding equipment

Country Status (1)

Country Link
JP (1) JPH02207542A (en)

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