JPH0220681A - Focusing method for laser beam - Google Patents

Focusing method for laser beam

Info

Publication number
JPH0220681A
JPH0220681A JP16849288A JP16849288A JPH0220681A JP H0220681 A JPH0220681 A JP H0220681A JP 16849288 A JP16849288 A JP 16849288A JP 16849288 A JP16849288 A JP 16849288A JP H0220681 A JPH0220681 A JP H0220681A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
laser beam
beam
adjusted
pass
optical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16849288A
Inventor
Takeshi Yamamoto
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot

Abstract

PURPOSE:To focus a laser beam to a regular energy density distribution by allowing the laser beam which is adjusted through a beam diameter adjusting lens group to pass through a cylindrical lens provided so as to be turnable centering around an optical axis. CONSTITUTION:A laser beam 3 which is outputted from a laser oscillator 1 is allowed to pass through a beam diameter adjusting lens group 2 for moving along its optical axis 4 and its diameter is adjusted. Subsequently, the laser beam 3 whose diameter is adjusted is allowed to pass through a cylindrical lens 6 provided so as to be turnable centering around said optical axis 4. As a result, the laser beam 3 is focused to an elliptic shape 7 of a prescribed size. As for this focusing beam of an elliptic shape, its energy density does not go to an irregular multi-mode distribution, and such working as cutting, etc. by a laser beam can be executed exactly. Also, by turning said cylindrical lens 6, working in a desired direction can be executed easily.
JP16849288A 1988-07-05 1988-07-05 Focusing method for laser beam Pending JPH0220681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16849288A JPH0220681A (en) 1988-07-05 1988-07-05 Focusing method for laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16849288A JPH0220681A (en) 1988-07-05 1988-07-05 Focusing method for laser beam

Publications (1)

Publication Number Publication Date
JPH0220681A true true JPH0220681A (en) 1990-01-24

Family

ID=15869091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16849288A Pending JPH0220681A (en) 1988-07-05 1988-07-05 Focusing method for laser beam

Country Status (1)

Country Link
JP (1) JPH0220681A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0594210A1 (en) * 1992-10-23 1994-04-27 Mitsui Petrochemical Industries, Ltd. Method and apparatus for welding material by laser beam
US5410123A (en) * 1992-10-22 1995-04-25 Rancourt; Yvon Process and apparatus for welding annular bellows
US5478983A (en) * 1992-10-22 1995-12-26 Rancourt; Yvon Process and apparatus for welding or heat treating by laser
US5897799A (en) * 1992-06-26 1999-04-27 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus
US6159777A (en) * 1993-02-04 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Method of forming a TFT semiconductor device
US6229115B1 (en) * 1997-05-30 2001-05-08 Hauni Maschinenbau Ag Method of and apparatus in a filter tipping machine for manipulating in a web
WO2003004213A1 (en) 2001-07-03 2003-01-16 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and installation for laser welding with an ar/he gas mixture, the ar/he content being controlled according to the laser power
EP1371446A1 (en) 2002-06-14 2003-12-17 L'Air Liquide Société Anonyme à Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procédé Georges Claud Use helium/nitrogen gas mixtures in laser welding of abutted flanks
WO2007010810A1 (en) * 2005-07-15 2007-01-25 Matsushita Electric Industrial Co., Ltd. Laser processing apparatus and method for adjusting same
JP2007260701A (en) * 2006-03-27 2007-10-11 Kobe Steel Ltd Method for joining different kinds of materials
JP2008023562A (en) * 2006-07-21 2008-02-07 Kobe Steel Ltd Method for joining different kinds of materials
US7682949B2 (en) 2001-09-10 2010-03-23 Semiconductor Energy Laboratory Co., Ltd. Laser treatment device, laser treatment method, and semiconductor device fabrication method
JP2010158710A (en) * 2009-01-09 2010-07-22 Disco Abrasive Syst Ltd Laser beam machining apparatus
WO2012050045A1 (en) * 2010-10-15 2012-04-19 三菱重工業株式会社 Laser cutting device and laser cutting method

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002101A (en) * 1992-06-26 1999-12-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device by using a homogenized rectangular laser beam
US6440785B1 (en) 1992-06-26 2002-08-27 Semiconductor Energy Laboratory Co., Ltd Method of manufacturing a semiconductor device utilizing a laser annealing process
US5897799A (en) * 1992-06-26 1999-04-27 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus
US5968383A (en) * 1992-06-26 1999-10-19 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus having beam expander
US5410123A (en) * 1992-10-22 1995-04-25 Rancourt; Yvon Process and apparatus for welding annular bellows
US5478983A (en) * 1992-10-22 1995-12-26 Rancourt; Yvon Process and apparatus for welding or heat treating by laser
EP0594210A1 (en) * 1992-10-23 1994-04-27 Mitsui Petrochemical Industries, Ltd. Method and apparatus for welding material by laser beam
US5624585A (en) * 1992-10-23 1997-04-29 Mitsui Petrochemical Industries, Ltd. Method and apparatus for welding material by laser beam
US6159777A (en) * 1993-02-04 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Method of forming a TFT semiconductor device
US6229115B1 (en) * 1997-05-30 2001-05-08 Hauni Maschinenbau Ag Method of and apparatus in a filter tipping machine for manipulating in a web
WO2003004213A1 (en) 2001-07-03 2003-01-16 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and installation for laser welding with an ar/he gas mixture, the ar/he content being controlled according to the laser power
US7682949B2 (en) 2001-09-10 2010-03-23 Semiconductor Energy Laboratory Co., Ltd. Laser treatment device, laser treatment method, and semiconductor device fabrication method
EP1371446A1 (en) 2002-06-14 2003-12-17 L'Air Liquide Société Anonyme à Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procédé Georges Claud Use helium/nitrogen gas mixtures in laser welding of abutted flanks
WO2007010810A1 (en) * 2005-07-15 2007-01-25 Matsushita Electric Industrial Co., Ltd. Laser processing apparatus and method for adjusting same
JP2007260701A (en) * 2006-03-27 2007-10-11 Kobe Steel Ltd Method for joining different kinds of materials
JP2008023562A (en) * 2006-07-21 2008-02-07 Kobe Steel Ltd Method for joining different kinds of materials
JP2010158710A (en) * 2009-01-09 2010-07-22 Disco Abrasive Syst Ltd Laser beam machining apparatus
WO2012050045A1 (en) * 2010-10-15 2012-04-19 三菱重工業株式会社 Laser cutting device and laser cutting method
JP2012086230A (en) * 2010-10-15 2012-05-10 Mitsubishi Heavy Ind Ltd Laser cutting device and laser cutting method
CN103180085A (en) * 2010-10-15 2013-06-26 三菱重工业株式会社 Laser cutting device and laser cutting method

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