JPH0220656A - Laser beam soldering machine provided with ring solder supplying mechanism part - Google Patents
Laser beam soldering machine provided with ring solder supplying mechanism partInfo
- Publication number
- JPH0220656A JPH0220656A JP16834188A JP16834188A JPH0220656A JP H0220656 A JPH0220656 A JP H0220656A JP 16834188 A JP16834188 A JP 16834188A JP 16834188 A JP16834188 A JP 16834188A JP H0220656 A JPH0220656 A JP H0220656A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ring solder
- laser
- soldering
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 39
- 238000005476 soldering Methods 0.000 title claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims abstract description 5
- 239000000835 fiber Substances 0.000 claims abstract description 4
- 230000010355 oscillation Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 13
- 239000006071 cream Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000009420 retrofitting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はスルーホール加工したプリント配線板上に電子
部品をレーザ加工にて半田付けするとき、半田の種類と
してリング半田の整列と位置決め、供給が可能であるレ
ーザ半田付加工装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is a method for aligning, positioning, and supplying ring solder as a type of solder when soldering electronic components onto a through-hole printed wiring board by laser processing. The present invention relates to a laser soldering processing device that is capable of processing.
従来、この種のレーザ半日付装置は半田の種類、供給方
法としてクリーム半田によルティスペンサ一方式又はメ
タルスクリーン印刷方式、糸半田による糸半田供給方式
、製品に前工程で予備半田を行なう方式となっていた。Conventionally, this type of laser semi-dating device has various types of solder and feeding methods: cream solder using a lutissener or metal screen printing method, thread solder feeding method using thread solder, and methods that pre-solder the product in the previous process. It had become.
又、リング半田による供給方法は前工程で人手により供
給しなければならない為自動化するのに問題があった。Further, the supply method using ring solder has a problem in automation because it has to be supplied manually in the previous process.
上述した従来のレーザ半日付方法は、クリーム半田によ
る半田ポールの発生により加工後は必ず洗浄工程が必要
であり、後付は部品の半田付は加工には不向きであった
。又、糸半田による加工方法は、糸半田の供給バラツキ
によるプリント配線板の焦げが発生する欠点がある。尚
、リング半田の供給は前工程で人手による供給方法の為
自動化を推進するには問題があった。The conventional laser half-date method described above always requires a cleaning step after processing due to the generation of solder poles due to cream solder, and is not suitable for processing after soldering parts. Further, the processing method using thread solder has the disadvantage that the printed wiring board may be scorched due to variations in the supply of thread solder. Note that the ring solder is supplied manually in the previous process, which poses a problem in promoting automation.
このような従来技術を解決するため、本発明ではレーザ
半田付加工装置上にリング半田の整列と位置決めを行な
うパーツフィーダ装置と、リング半田をプリント配線板
上に供給可能とする直交座標型ロボットと、吸着、搭載
用ノズルを備えたロボットハンド部とからなる構造とし
た。In order to solve such conventional techniques, the present invention provides a parts feeder device that aligns and positions ring solder on a laser soldering processing device, and a Cartesian coordinate robot that can feed ring solder onto a printed wiring board. The structure consists of a robot hand section equipped with a suction and mounting nozzle.
本発明はリング半田の整列と位置決め用パーツフィーダ
、リング半田を供給するロボットハンド部を保有してい
るので、後付は部品に於ける半田ボール対策と自動化に
対処出来る。Since the present invention has a parts feeder for aligning and positioning the ring solder and a robot hand section for supplying the ring solder, retrofitting can deal with solder ball countermeasures and automation in parts.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例の見取図である。架台１上には
電子部品１０が概に挿入されているプリント配線板７が
セットされる。セット後直交座標型ロボット４が、リン
グ半田が整列されているパーツフィーダ５まで移動しリ
ング半田搭載用ノズル９にてリング半田１５（第５図）
を吸着しプリント配線板７０指定位置まで移動供給する
。Ｎｄ：ＹＡＧレーザ発振器２から出たレーザ光１４を
ファイバー３で伝送し出射光学部６よりレーザ光を供給
し半田付は加工を行なう。FIG. 1 is a sketch of an embodiment of the present invention. A printed wiring board 7 in which electronic components 10 are generally inserted is set on the pedestal 1. After setting, the orthogonal coordinate robot 4 moves to the parts feeder 5 where the ring solder is aligned, and uses the ring solder loading nozzle 9 to place the ring solder 15 (Fig. 5).
is adsorbed and moved to a specified position on the printed wiring board 70 and supplied. The laser beam 14 emitted from the Nd:YAG laser oscillator 2 is transmitted through the fiber 3, and the laser beam is supplied from the output optical section 6 to perform soldering.
第３図はデイスペンサ方式によるクリーム半田の供給方
法とレーザ加工の見取図である。デイスペンサーユニッ
ト１１より圧力にてクリーム半田１２を供給後レーザ加
工を行なう。又、第４図は糸半田１３を供給しなからレ
ーザ加工を行なっている実施例である。この実施例では
半田供給時間の短縮化が可能であり、自動化には最適で
ある。FIG. 3 is a schematic diagram of a cream solder supply method using a dispenser method and laser processing. After cream solder 12 is supplied under pressure from a dispenser unit 11, laser processing is performed. Further, FIG. 4 shows an embodiment in which laser processing is performed without supplying the solder thread 13. This embodiment allows the solder supply time to be shortened and is ideal for automation.
以上説明した様に本発明は、レーザ半田付装置にリング
半田の整列と位置決めを行なうパーツフィーダとプリン
ト配線板上にリング半田を供給するロボットハンド部を
装置することにより、後付は部品に於ける半田ポールの
減少による品質の向上と自動化が可能となり効果が期待
出来る。As explained above, the present invention provides a laser soldering device with a parts feeder for aligning and positioning the ring solder and a robot hand unit for supplying the ring solder onto the printed wiring board. By reducing the number of solder poles involved, it is possible to improve quality and automate the process, which is expected to have positive effects.
第１図は本発明の実施例の平面図、第２図は第１図のＡ
部（ロボットハンド部）の拡大図、第３図、第４図は本
発明の他の実施例を示す正面図、第５図は本発明の実施
例の使用状態を示す正面図である。
■・・・・・・架台、２・・・・・・Ｎｄ：ＹＡＧレー
ザ発振器、３・・・・・ファイバー ４・・・・・・直
交座標型ロボット、５・・・・・・リング半田供給用パ
ーツフィーダ、６・・・・・・出射光学部、７・・・・
・・プリント配線板、８・・・・・・ロボットハンドホ
ルダー ９・・・・・・リング半田搭載用ノズル、１０
・・・・・・電子部品、１１・・・・・・デイスペンサ
ーユニニット、１２・・・・・・クリーム半田、１３・
・・・・・糸半田、１４・・・・・・レーザ光、１５・
・・・・・リング半田。
代理人 弁理士 内 原 音
振 １ 圀
第 ３
＃ ５Figure 1 is a plan view of an embodiment of the present invention, and Figure 2 is A of Figure 1.
FIGS. 3 and 4 are front views showing other embodiments of the present invention, and FIG. 5 is a front view showing the use state of the embodiment of the present invention. ■... Frame, 2... Nd:YAG laser oscillator, 3... Fiber 4... Cartesian coordinate robot, 5... Ring solder Supply parts feeder, 6... Output optical section, 7...
...Printed wiring board, 8...Robot hand holder 9...Nozzle for mounting ring solder, 10
...Electronic parts, 11.....Dispenser unit, 12..Cream solder, 13.
...Thread solder, 14...Laser light, 15.
...Ring solder. Agent Patent Attorney Otoshin Uchihara 1 Kokudai 3 #5
Claims (1)
バーと、ビームを集光する出射光学部と、出射光学部を
加工点に査定する直交座標型ロボットとからなるレーザ
半田付装置において、リング半田の整列と位置決め用パ
ーツフィーダと、プリント配線板上にリング半田を供給
するロボットハンド部とを有していることを特徴とする
レーザ半田付加工装置。The laser soldering equipment consists of a continuous wave YAG laser, a fiber that transmits the laser beam, an output optical section that focuses the beam, and a Cartesian coordinate robot that assesses the output optical section as a processing point. A laser soldering processing device characterized by having a parts feeder for alignment and positioning, and a robot hand section for supplying ring solder onto a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16834188A JPH0220656A (en) | 1988-07-05 | 1988-07-05 | Laser beam soldering machine provided with ring solder supplying mechanism part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16834188A JPH0220656A (en) | 1988-07-05 | 1988-07-05 | Laser beam soldering machine provided with ring solder supplying mechanism part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220656A true JPH0220656A (en) | 1990-01-24 |
Family
ID=15866264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16834188A Pending JPH0220656A (en) | 1988-07-05 | 1988-07-05 | Laser beam soldering machine provided with ring solder supplying mechanism part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220656A (en) |
-
1988
- 1988-07-05 JP JP16834188A patent/JPH0220656A/en active Pending
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