JPH02201317A - Display device - Google Patents

Display device

Info

Publication number
JPH02201317A
JPH02201317A JP1020367A JP2036789A JPH02201317A JP H02201317 A JPH02201317 A JP H02201317A JP 1020367 A JP1020367 A JP 1020367A JP 2036789 A JP2036789 A JP 2036789A JP H02201317 A JPH02201317 A JP H02201317A
Authority
JP
Japan
Prior art keywords
semiconductor layer
transparent insulating
insulating substrate
substrate
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1020367A
Other languages
Japanese (ja)
Inventor
Tomoyuki Kawashima
河島 朋之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1020367A priority Critical patent/JPH02201317A/en
Publication of JPH02201317A publication Critical patent/JPH02201317A/en
Pending legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)

Abstract

PURPOSE:To obtain the device which is free from deterioration in image quality at a low cost by providing a 2nd transparent insulating substrate with a light shielding mask in the part confronting the upper part of a semiconductor layer on a 1st transparent insulating substrate. CONSTITUTION:The semiconductor layer 4 of a switching element exists on a scanning electrode 3 consisting of the opaque conductive material on the substrate and the extension part of an image element electrode 2 consisting of a transparent conductive material comes into contact with the counter substrate side of the semiconductor layer 4. The 2nd transparent insulating substrate 5 is provided with the light shielding mask 6 as well in the part confronting the upper part of the semiconductor layer 4 on the 1st transparent insulating substrate 1. The incident light from the lower part to the semiconductor layer 4 is prevented by the scanning electrode 3 consisting of the opaque conductive material on the 1st transparent insulating substrate 1 and the incident light from the upper part to the semiconductor layer 4 is prevented by the light shielding mask 6 provided on the 2nd transparent insulating substrate 5 confronted thereto. The active matrix element consists of only the scanning electrode 3, the semiconductor 4 and the image element electrode 2. The sharp images having the high contrast are obtd. in this way and the production cost is reduced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は駆動用のスイッチング素子および一方の画素電
極を備えた透明絶縁基板と対向画素電極を備えた透明絶
縁基板との間に液晶などの表示用半導体層がはさまれた
表示装置に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a structure in which liquid crystal, etc. The present invention relates to a display device in which display semiconductor layers are sandwiched.

〔従来の技術〕[Conventional technology]

液晶デイスプレィなどの薄型表示装置は、電卓や時計な
どの小型電子機器用の表示装置として大量に使用され、
現在では、表示画面の大型化と高画質化を目標としてい
る。大画面で高画質な表示を行う方法として画面の各画
素にスイッチング素子を設けたアクティブマトリクス方
式が有効である。アクティブマトリクス方式に用いるス
イッチング素子としては、薄膜トランジスタ (T P
 T)などの三端子素子やMIM (金属−絶縁膜一命
属)素子、バリスタ3ダイオードなどの二端子の非線形
素子などが提案され、特に二端子の非線形素子は構造が
簡単であるという特長から、三端子素子を用いるアクテ
ィブマトリクス方式よりも製造コストが優れている。ア
クティブマトリクス素子に用いる半導体膜としては、ガ
ラスなどの基板上に大面積かつ均一に形成できるアモル
ファスシリコンが優れている。
Thin display devices such as liquid crystal displays are used in large quantities as display devices for small electronic devices such as calculators and watches.
Currently, the goal is to increase the size of the display screen and improve the image quality. An effective method for displaying high-quality images on a large screen is an active matrix method in which each pixel on the screen is provided with a switching element. Thin film transistors (T P
Three-terminal devices such as T), MIM (metal-insulating film interconnect) devices, and two-terminal nonlinear devices such as varistor three diodes have been proposed, and two-terminal nonlinear devices in particular have a simple structure. , the manufacturing cost is superior to the active matrix method using three-terminal devices. Amorphous silicon, which can be uniformly formed over a large area on a substrate such as glass, is an excellent semiconductor film for use in active matrix elements.

第2図は、スイッチング素子として薄膜ダイオードを備
えたアクティブマトリクス方式の従来の液晶表示装置を
示す、液晶表示装置は2枚のガラス基板lと5により液
晶8をはさみ込んだ構造ををし、一方のガラス基板7に
透明導電膜からなる画素電極21と走査電極31.アモ
ルファスシリコンなどからなる半導体層4および配線電
極51から構成されるアクティブマトリクス素子を設け
、他方のガラス基板5に透明導電膜からなる対向電極7
と各画素の間隙を覆うような遮光マスク6とが設けられ
ている。遮光マスク6は各画素の間隙からの光の漏れに
よる液晶表示のコントラストの低下を防ぐ機能を有する
。第2図に示す従来の液晶表示装置では、ガラス基板1
からの入射光10が半導体層4に直接入射する。アクテ
ィブマトリクス素子に用いられるアモルファスシリコン
などの半導体材料は、はぼ例外なく光導電性をもつため
、第2図に示すように入射光10が半導体層4に侵入す
ると、光導電に基づく漏洩電流が発生し、アクティブマ
トリクス素子のスイッチング特性が劣化して、表示装置
の両賞が低下してしまうという問題があった。この半導
体層4への入射光を防止するためには、半導体層4の下
部に遮光膜を設けてやればよく、この遮光膜11を設け
た従来例を第3図に示す。
FIG. 2 shows a conventional active matrix type liquid crystal display device equipped with thin film diodes as switching elements.The liquid crystal display device has a structure in which a liquid crystal 8 is sandwiched between two glass substrates 1 and 5; A pixel electrode 21 and a scanning electrode 31 made of a transparent conductive film are formed on a glass substrate 7 . An active matrix element composed of a semiconductor layer 4 made of amorphous silicon or the like and a wiring electrode 51 is provided, and a counter electrode 7 made of a transparent conductive film is provided on the other glass substrate 5.
and a light-shielding mask 6 that covers the gap between each pixel. The light-shielding mask 6 has a function of preventing the contrast of the liquid crystal display from deteriorating due to light leakage from the gaps between each pixel. In the conventional liquid crystal display device shown in FIG.
Incident light 10 from the semiconductor layer 4 directly enters the semiconductor layer 4 . Semiconductor materials such as amorphous silicon used in active matrix elements almost always have photoconductivity, so when incident light 10 enters the semiconductor layer 4 as shown in FIG. 2, leakage current due to photoconductivity occurs. There is a problem in that the switching characteristics of the active matrix element are deteriorated, and the performance of the display device is reduced. In order to prevent light from entering the semiconductor layer 4, a light-shielding film may be provided below the semiconductor layer 4. A conventional example in which this light-shielding film 11 is provided is shown in FIG.

第4図(al〜Tflは、第3図に示す液晶表示装置の
下部遮光膜11を備えたアクティブマトリクス素子を設
けた基板の製造工程を示す、先ずガラス基板1の上に透
明導電膜20と金属膜30を積層しく図a)、画素電極
21.走査電極31をそれぞれ金属膜13.12で被覆
された状態でパターニングする (図b)0次いで、プ
ラズマCVD法で堆積したアモルファスシリコンなどを
バターニングして一部が画素電極21に被着する半導体
層4を形成する (図c)aさらに金属膜を被着し、バ
ターニングして半導体層4と走査電極31を接続する配
線電極51を設ける (図d)、このあと配線電極51
をマスクとしての半導体層4の再パターニングを行い(
図e)、配線電極51および半導体層4をマスクとして
金属1113の露出部分をエツチングして除き、下部遮
光膜11を残す(図f)。
FIG. 4 (al to Tfl shows the manufacturing process of a substrate provided with an active matrix element equipped with a lower light-shielding film 11 of the liquid crystal display device shown in FIG. 3. First, a transparent conductive film 20 is formed on a glass substrate 1. The metal film 30 is stacked in Figure a), the pixel electrode 21. The scanning electrodes 31 are patterned while being covered with metal films 13 and 12 (Figure b).Next, amorphous silicon or the like deposited by plasma CVD is patterned to form a semiconductor that partially adheres to the pixel electrodes 21. Layer 4 is formed (Figure c) a. Further, a metal film is deposited and patterned to provide wiring electrodes 51 that connect semiconductor layer 4 and scanning electrodes 31 (Figure d), and then wiring electrodes 51 are formed.
The semiconductor layer 4 is re-patterned using as a mask (
Figure e), using the wiring electrode 51 and semiconductor layer 4 as a mask, the exposed portion of the metal 1113 is removed by etching, leaving the lower light shielding film 11 (Figure f).

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

第4図に示した工程かられかるように、第3図に示した
下部遮光膜11を有するアクティブマトリクス素子の製
造は、第2図に示したアクティブマトリクス素子の製造
に比し、金属膜の成膜およびパターニングの工程がふえ
るため製造工程が複雑となり、歩留まりが低下し、その
結果製造コストが上昇してしまうという問題があった。
As can be seen from the steps shown in FIG. 4, the manufacturing of the active matrix element having the lower light shielding film 11 shown in FIG. 3 is different from the manufacturing of the active matrix element shown in FIG. There is a problem in that the manufacturing process becomes complicated due to the increase in the number of film forming and patterning steps, resulting in a decrease in yield and, as a result, an increase in manufacturing costs.

本発明の課題は、そのような問題を解決し、半導体層へ
の光の侵入により漏洩電流が発生し、アクティブマトリ
クス素子のスイッチング特性が劣化することによる両賞
の低下のない表示装置を低い製造コストで提供すること
にある。
The object of the present invention is to solve such problems and to manufacture a display device at a low cost without deteriorating the switching characteristics of the active matrix element due to leakage current caused by light entering the semiconductor layer and deterioration of the switching characteristics of the active matrix element. It is provided at a cost.

〔課題を解決するための手段〕[Means to solve the problem]

上記の課題の解決のために、第一の透明絶縁基板上にス
イッチング素子と一方の画素電極を備え、そのスイッチ
ング素子は半導体層の両面が画素電極および走査電極に
接続されてなり、第二の透明絶縁基板上には他方の画素
電極および遮光マスクを備え、双方の画素電極の間に表
示用半導体層が存在する表示装置において、スイッチン
グ素子の半導体層は基板上の不透明導電材料からなる走
査電極上に位置し、その半導体層の反基板側に透明導電
材料からなる画素電極の延長部が接触し、第二の透明w
A緑基板には第一の透明絶縁基板上の前記半導体層の上
部に対向する部分にも遮光マスクが設けられたものとす
る。
In order to solve the above problems, a switching element and one pixel electrode are provided on a first transparent insulating substrate, and both sides of the semiconductor layer of the switching element are connected to the pixel electrode and the scanning electrode. In a display device in which the other pixel electrode and a light shielding mask are provided on a transparent insulating substrate, and a display semiconductor layer is present between both pixel electrodes, the semiconductor layer of the switching element is a scanning electrode made of an opaque conductive material on the substrate. A second transparent w
It is assumed that a light-shielding mask is also provided on the green substrate A in a portion facing the upper portion of the semiconductor layer on the first transparent insulating substrate.

〔作用〕[Effect]

上記の構造で、半導体層への下部からの入射光は、第一
の透明絶縁基板上の不透明導電材料からなる走査電極に
より防止し、半導体層への上部からの入射光は、対向す
る第二の透明絶縁基板に設けた遮光マスクにより防止す
るものである。さらに、本発明によるアクティブマトリ
クス素子は、走査電極、半導体および画素電極のみより
なる簡単な構造のため製造工程は簡単である。
In the above structure, light incident on the semiconductor layer from the bottom is prevented by the scanning electrode made of an opaque conductive material on the first transparent insulating substrate, and light incident on the semiconductor layer from the top is prevented by the scanning electrode made of an opaque conductive material on the first transparent insulating substrate. This is prevented by a light shielding mask provided on the transparent insulating substrate. Further, since the active matrix element according to the present invention has a simple structure consisting of only scan electrodes, semiconductors, and pixel electrodes, the manufacturing process is simple.

〔実施例〕〔Example〕

第1図は本発明の一実施例の表示装置を示し、第2図、
第3図と共通の部分には同一の符号が付されている、こ
の表示装置では画素型f!j2は透明導電膜からなるが
走査電極3は金属材料からなり不透明である0画素電極
2は半導体層4の上面に延びる。その結果、スイッチン
グ素子は走査電極3と画素電極2の延長部との間に生ず
る。スイッチング素子の半導体層4へのガラス基板1を
通じての光の入射は走査電1Ii3によってさえぎられ
る。
FIG. 1 shows a display device according to an embodiment of the present invention, and FIG.
Components common to those in FIG. 3 are given the same reference numerals. In this display device, the pixel type f! j2 is made of a transparent conductive film, the scanning electrode 3 is made of a metal material, and the 0 pixel electrode 2, which is opaque, extends to the upper surface of the semiconductor layer 4. As a result, a switching element occurs between the scanning electrode 3 and the extension of the pixel electrode 2. The incidence of light through the glass substrate 1 on the semiconductor layer 4 of the switching element is blocked by the scanning current 1Ii3.

一方透明画素t8iを通じての上部ガラス基板5からの
光の入射は、第2図、第3図と異なり半導体層4の上方
まで延ばされた遮光マスク6によってさえぎられる。
On the other hand, the incidence of light from the upper glass substrate 5 through the transparent pixel t8i is blocked by the light shielding mask 6 which extends above the semiconductor layer 4, unlike in FIGS. 2 and 3.

第5図(5)は、第1図のガラス基板1を画素電極2側
から見た平面図である。第1図に断面で示した半導体層
4からなる素子41と接続型8i32の上に設けられる
素子42は画素電極2と走査電極3の間に下部接続電極
32と上部接続電極22を介して並列逆接続される。下
部接続電極32は走査電極3をバターニング形成すると
きに同時に形成され、スイッチング素子42の遮光膜も
兼ねており、上部接続電極22は画素電極2と同じ透明
導電膜からなる。
FIG. 5(5) is a plan view of the glass substrate 1 of FIG. 1 viewed from the pixel electrode 2 side. An element 41 made of the semiconductor layer 4 shown in cross section in FIG. 1 and an element 42 provided on the connection type 8i32 are connected in parallel between the pixel electrode 2 and the scanning electrode 3 via the lower connection electrode 32 and the upper connection electrode 22. Connected in reverse. The lower connection electrode 32 is formed at the same time as the scanning electrode 3 is formed by patterning, and also serves as a light shielding film for the switching element 42. The upper connection electrode 22 is made of the same transparent conductive film as the pixel electrode 2.

第5図中)はガラス基板5の上方よりみた透視図で、遮
光マスク6の平面パターンは、ハンチングを付して示し
たように画素電極相互間の間隙、画素電極と走査電極と
の間隙を覆うことは第2図、第3図の場合と同様である
が、半導体層4の上に延びる画素電極2および下部接続
電極22も覆うように設けられている。遮光マスク6に
用いる材料としては、ゼラチンやカゼインなどの天然高
分子や、例えば日本合成ゴム■商品名JDS−509な
どの合成高分子を、例えば日本化薬■製商品名Blac
k 81のような黒色染料で染色したもの、もしくはl
r、 kl。
5) is a perspective view seen from above the glass substrate 5, and the planar pattern of the light-shielding mask 6 shows the gaps between the pixel electrodes and the gaps between the pixel electrodes and the scanning electrodes, as shown with hunting. The covering is similar to that in FIGS. 2 and 3, but the pixel electrode 2 and the lower connection electrode 22 extending above the semiconductor layer 4 are also covered. Materials used for the light-shielding mask 6 include natural polymers such as gelatin and casein, synthetic polymers such as Nippon Synthetic Rubber (trade name: JDS-509), and Nippon Kayaku (trade name: Black), for example.
dyed with black dye such as k81 or l
r,kl.

Mo、 Ta、 Mo5izなどの金属、金属化合物あ
るいは金属酸化物が用いられる。
Metals, metal compounds, or metal oxides such as Mo, Ta, and Mo5iz are used.

第6図fa)〜fd+は第1図に示したようなアクティ
ブマトリクス素子を有する基板の製造工程を示す。
6 fa) to fd+ show the manufacturing process of a substrate having an active matrix element as shown in FIG.

透明絶縁基板1上に走査電極3として、膜厚1000人
のCrをスパッタリング法で被着したのちバターニング
する (図aL次に半導体層3として、膜厚4000人
にアモルファスシリコンをプラズマCVD法により堆積
したのちバターニングする (図b)。
On the transparent insulating substrate 1, as the scanning electrode 3, a 1,000-layer thick layer of Cr is deposited by sputtering, and then buttered. After being deposited, it is buttered (Figure b).

そして膜厚2000人のITO膜をスパッタリング法で
被着したのちバターニングして画素電極2およびその延
長部を形成する。さらに、画素電極2をマスクにして半
導体層4を再びバターニングすることにより、画素電極
2からはみ出した部分の半導体層4を除去する (図d
)、このように、本発明に基づくアクティブマトリクス
素子の製造工程は、3回の成膜工程と3枚のフォトマス
クを用いるのみで、簡単な製造工程で作製できる。走査
電極3の材料としては、Cr、 u、 Mo+ Ta、
 MO3Igなどの金属材料あるいは金属化合物を用い
ることができ、透明絶縁基板としては、ガラス基板のほ
かに高分子基板を利用でき、画素電極の材料としては、
■TO以外にSnO□金属薄膜を用いることができる。
Then, an ITO film having a thickness of 2,000 yen is deposited by sputtering and then patterned to form the pixel electrode 2 and its extension. Furthermore, by patterning the semiconductor layer 4 again using the pixel electrode 2 as a mask, the portion of the semiconductor layer 4 protruding from the pixel electrode 2 is removed (Figure d
), as described above, the active matrix element according to the present invention can be manufactured in a simple manufacturing process using only three film forming steps and three photomasks. The materials of the scanning electrode 3 include Cr, u, Mo+Ta,
Metal materials or metal compounds such as MO3Ig can be used. As the transparent insulating substrate, a polymer substrate can be used in addition to a glass substrate. As the material for the pixel electrode,
■In addition to TO, a SnO□ metal thin film can be used.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、表示用半導体層をはさむ2枚の透明絶
縁基板の一方に設けられたアクティブマトリクス素子の
半導体層への入射光は、半導体層の下部に形成した不透
明の走査電極と、他方の基板に設けられた遮光マスクに
より遮蔽されるため、半導体層にアモルファスシリコン
のような光導電性を有する材料を使用しても、入射光に
よる素子のスイッチング特性の劣化は少なく、画質が低
下することなく、コントラストの高い鮮明な画像の表示
装置が得られる。また半導体層の反基板側の電極に画素
電極の延長部を利用するため、アクティブマトリクス素
子は3回の成膜工程と3回のフォトプロセス工程を用い
るのみで簡単に製造でき、欠陥が少なく、歩留まりの向
上と製造コストの低下をはかることができる。なお、対
向する基板は、従来と遮光マスクのパターンを変えるだ
けであるから、それによる製造コストの上昇はない。
According to the present invention, light incident on the semiconductor layer of an active matrix element provided on one of two transparent insulating substrates sandwiching a display semiconductor layer is transmitted through an opaque scanning electrode formed at the bottom of the semiconductor layer and an opaque scanning electrode formed on the bottom of the semiconductor layer. Because the light is shielded by a light-shielding mask provided on the substrate, even if a photoconductive material such as amorphous silicon is used for the semiconductor layer, the switching characteristics of the device are less likely to deteriorate due to the incident light, resulting in a decrease in image quality. It is possible to obtain a display device that displays clear images with high contrast. In addition, since the extension of the pixel electrode is used as the electrode on the opposite side of the semiconductor layer to the substrate, the active matrix element can be easily manufactured using only three film formation steps and three photoprocessing steps, and has fewer defects. It is possible to improve yield and reduce manufacturing costs. It should be noted that since the opposing substrate is only changed from the conventional light-shielding mask pattern, there is no increase in manufacturing costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の表示装置の断面図、第2図
、第3図は表示装置の二つの従来例それぞれの断面図、
第4図(al〜(flは第3図に示した表示装置のアク
ティブマトリクス基板の製造工程を順次示す断面図、第
5図(al、(blは本発明の一実施例の表示装置を平
面図で示し、(4)は下部基板の上面図、 (blはv
t2全体の上部からの透視平面図、第6図は第1図に示
した表示装置のアクティブマトリクス基板の製造工程を
順次示す断面図である。 115ニガラス基板、2:画素電極、3:走査電極、4
:半導体層、6:遮光マスク、7:対向両筒3図 第1図 第4図 〜1 第6図
FIG. 1 is a sectional view of a display device according to an embodiment of the present invention, FIGS. 2 and 3 are sectional views of two conventional examples of the display device,
4 (al to (fl) are cross-sectional views sequentially showing the manufacturing process of the active matrix substrate of the display device shown in FIG. (4) is a top view of the lower substrate, (bl is v
FIG. 6 is a perspective plan view of the entire t2 from above, and is a sectional view sequentially showing the manufacturing process of the active matrix substrate of the display device shown in FIG. 1. 115 glass substrate, 2: pixel electrode, 3: scanning electrode, 4
: Semiconductor layer, 6: Light-shielding mask, 7: Opposing cylinders 3 Figure 1 Figure 4-1 Figure 6

Claims (1)

【特許請求の範囲】[Claims] (1)第一の透明絶縁基板上にスイッチング素子と一方
の画素電極を備え、そのスイッチング素子は半導体層の
両面が画素電極および走査電極に接続されてなり、第二
の透明絶縁基板上には他方の画素電極および遮光マスク
を備え、双方の画素電極の間に表示用半導体層が存在す
るものにおいて、スイッチング素子の半導体層は基板上
の不透明導電材料からなる走査電極上に位置し、その半
導体層の反基板側に透明導電材料からなる画素電極の延
長部が接触し、第二の透明絶縁基板には第一の透明絶縁
基板上の前記半導体層の上部に対向する部分にも遮光マ
スクが設けられたことを特徴とする表示装置。
(1) A switching element and one pixel electrode are provided on a first transparent insulating substrate, and both sides of a semiconductor layer of the switching element are connected to a pixel electrode and a scanning electrode. In a device including the other pixel electrode and a light-shielding mask, and a display semiconductor layer is present between both pixel electrodes, the semiconductor layer of the switching element is located on the scanning electrode made of an opaque conductive material on the substrate, and the semiconductor layer is located on the scanning electrode made of an opaque conductive material on the substrate. An extension of a pixel electrode made of a transparent conductive material is in contact with the side of the layer opposite to the substrate, and a light-shielding mask is also provided on the second transparent insulating substrate at a portion facing the top of the semiconductor layer on the first transparent insulating substrate. A display device characterized by being provided.
JP1020367A 1989-01-30 1989-01-30 Display device Pending JPH02201317A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1020367A JPH02201317A (en) 1989-01-30 1989-01-30 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1020367A JPH02201317A (en) 1989-01-30 1989-01-30 Display device

Publications (1)

Publication Number Publication Date
JPH02201317A true JPH02201317A (en) 1990-08-09

Family

ID=12025109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1020367A Pending JPH02201317A (en) 1989-01-30 1989-01-30 Display device

Country Status (1)

Country Link
JP (1) JPH02201317A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05224240A (en) * 1991-11-29 1993-09-03 Nec Corp Liquid crystal display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05224240A (en) * 1991-11-29 1993-09-03 Nec Corp Liquid crystal display panel

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