JPH0218210U - - Google Patents
Info
- Publication number
- JPH0218210U JPH0218210U JP1988097119U JP9711988U JPH0218210U JP H0218210 U JPH0218210 U JP H0218210U JP 1988097119 U JP1988097119 U JP 1988097119U JP 9711988 U JP9711988 U JP 9711988U JP H0218210 U JPH0218210 U JP H0218210U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- emitting element
- light source
- source lamp
- coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988097119U JPH0218210U (US20110009641A1-20110113-C00256.png) | 1988-07-22 | 1988-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988097119U JPH0218210U (US20110009641A1-20110113-C00256.png) | 1988-07-22 | 1988-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0218210U true JPH0218210U (US20110009641A1-20110113-C00256.png) | 1990-02-06 |
Family
ID=31322349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988097119U Pending JPH0218210U (US20110009641A1-20110113-C00256.png) | 1988-07-22 | 1988-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0218210U (US20110009641A1-20110113-C00256.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013130700A (ja) * | 2011-12-21 | 2013-07-04 | Canon Inc | 電子機器 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5640097U (US20110009641A1-20110113-C00256.png) * | 1979-09-07 | 1981-04-14 | ||
| JPS5831607B2 (ja) * | 1977-03-25 | 1983-07-07 | 株式会社クボタ | 間欠操作機構 |
-
1988
- 1988-07-22 JP JP1988097119U patent/JPH0218210U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831607B2 (ja) * | 1977-03-25 | 1983-07-07 | 株式会社クボタ | 間欠操作機構 |
| JPS5640097U (US20110009641A1-20110113-C00256.png) * | 1979-09-07 | 1981-04-14 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013130700A (ja) * | 2011-12-21 | 2013-07-04 | Canon Inc | 電子機器 |
| US9591779B2 (en) | 2011-12-21 | 2017-03-07 | Canon Kabushiki Kaisha | Electronic apparatus capable of accommodating therein member including cable |
