JPH0217872U - - Google Patents

Info

Publication number

JPH0217872U

JPH0217872U JP9685788U JP9685788U JPH0217872U JP H0217872 U JPH0217872 U JP H0217872U JP 9685788 U JP9685788 U JP 9685788U JP 9685788 U JP9685788 U JP 9685788U JP H0217872 U JPH0217872 U JP H0217872U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

flexible printed

copper foil

sides

Prior art date

1988-07-20

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
• 239000011889 copper foil Substances 0.000 claims 2
• 230000002950 deficient Effects 0.000 claims 2
• 230000007547 defect Effects 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1