JPH0217855U - - Google Patents

Info

Publication number
JPH0217855U
JPH0217855U JP9606888U JP9606888U JPH0217855U JP H0217855 U JPH0217855 U JP H0217855U JP 9606888 U JP9606888 U JP 9606888U JP 9606888 U JP9606888 U JP 9606888U JP H0217855 U JPH0217855 U JP H0217855U
Authority
JP
Japan
Prior art keywords
lead
semiconductor package
resin
sealed
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9606888U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9606888U priority Critical patent/JPH0217855U/ja
Publication of JPH0217855U publication Critical patent/JPH0217855U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP9606888U 1988-07-19 1988-07-19 Pending JPH0217855U (US06368395-20020409-C00050.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9606888U JPH0217855U (US06368395-20020409-C00050.png) 1988-07-19 1988-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9606888U JPH0217855U (US06368395-20020409-C00050.png) 1988-07-19 1988-07-19

Publications (1)

Publication Number Publication Date
JPH0217855U true JPH0217855U (US06368395-20020409-C00050.png) 1990-02-06

Family

ID=31320868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9606888U Pending JPH0217855U (US06368395-20020409-C00050.png) 1988-07-19 1988-07-19

Country Status (1)

Country Link
JP (1) JPH0217855U (US06368395-20020409-C00050.png)

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