JPH0217843U - - Google Patents

Info

Publication number
JPH0217843U
JPH0217843U JP9559288U JP9559288U JPH0217843U JP H0217843 U JPH0217843 U JP H0217843U JP 9559288 U JP9559288 U JP 9559288U JP 9559288 U JP9559288 U JP 9559288U JP H0217843 U JPH0217843 U JP H0217843U
Authority
JP
Japan
Prior art keywords
chip
bump
lead frame
package
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9559288U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9559288U priority Critical patent/JPH0217843U/ja
Publication of JPH0217843U publication Critical patent/JPH0217843U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9559288U 1988-07-19 1988-07-19 Pending JPH0217843U (US20020125480A1-20020912-P00900.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9559288U JPH0217843U (US20020125480A1-20020912-P00900.png) 1988-07-19 1988-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9559288U JPH0217843U (US20020125480A1-20020912-P00900.png) 1988-07-19 1988-07-19

Publications (1)

Publication Number Publication Date
JPH0217843U true JPH0217843U (US20020125480A1-20020912-P00900.png) 1990-02-06

Family

ID=31320275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9559288U Pending JPH0217843U (US20020125480A1-20020912-P00900.png) 1988-07-19 1988-07-19

Country Status (1)

Country Link
JP (1) JPH0217843U (US20020125480A1-20020912-P00900.png)

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