JPH02172642A - Holding device for body to be worked - Google Patents

Holding device for body to be worked

Info

Publication number
JPH02172642A
JPH02172642A JP33288688A JP33288688A JPH02172642A JP H02172642 A JPH02172642 A JP H02172642A JP 33288688 A JP33288688 A JP 33288688A JP 33288688 A JP33288688 A JP 33288688A JP H02172642 A JPH02172642 A JP H02172642A
Authority
JP
Japan
Prior art keywords
holder
work receiving
pin
holding device
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33288688A
Other languages
Japanese (ja)
Inventor
Katsuki Shingu
Kazuhiko Fujino
Shuji Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP33288688A priority Critical patent/JPH02172642A/en
Publication of JPH02172642A publication Critical patent/JPH02172642A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To eliminate the positional error of the center of curvature of a polishing bowl and the body to be worked and to finish in a highly accurate spherical face by rocking and turning a holding means by supporting a work receiving part at one point by the pin of a holder and a pin receiver, in the spherical face polishing of an optical lens, etc.
CONSTITUTION: A pin 2 and pin receiver 3 fitted to a holder 1 are supported by bringing them into contact at one point and also a work receiving face 4 is made slightly rockable with the supporting point as the center. Moreover an outer peripheral control ring 6 is provided so that the work receiving face 4 is not separated from the holder 1, a fine rocking part and free turning part are separated in a holding device and the improvement of the polishing accuracy and the long life of the holding device itself are realized. Also, a hole performing intake air and exhaust air to the work receiving face 4 from the through hole of the holder 1 is communicated and the detaching of a work and automatic continuous working are enabled.
COPYRIGHT: (C)1990,JPO&Japio
JP33288688A 1988-12-27 1988-12-27 Holding device for body to be worked Pending JPH02172642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33288688A JPH02172642A (en) 1988-12-27 1988-12-27 Holding device for body to be worked

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33288688A JPH02172642A (en) 1988-12-27 1988-12-27 Holding device for body to be worked

Publications (1)

Publication Number Publication Date
JPH02172642A true JPH02172642A (en) 1990-07-04

Family

ID=18259898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33288688A Pending JPH02172642A (en) 1988-12-27 1988-12-27 Holding device for body to be worked

Country Status (1)

Country Link
JP (1) JPH02172642A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
JP2009248195A (en) * 2008-04-01 2009-10-29 Olympus Corp Workpiece holding device
CN102416574A (en) * 2011-12-14 2012-04-18 常州鑫鹏工具制造有限公司 Automatic compacting device for lathe machining

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
JP2009248195A (en) * 2008-04-01 2009-10-29 Olympus Corp Workpiece holding device
CN102416574A (en) * 2011-12-14 2012-04-18 常州鑫鹏工具制造有限公司 Automatic compacting device for lathe machining

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