JPH02169194A - Method for cutting hole - Google Patents

Method for cutting hole

Info

Publication number
JPH02169194A
JPH02169194A JP63327046A JP32704688A JPH02169194A JP H02169194 A JPH02169194 A JP H02169194A JP 63327046 A JP63327046 A JP 63327046A JP 32704688 A JP32704688 A JP 32704688A JP H02169194 A JPH02169194 A JP H02169194A
Authority
JP
Japan
Prior art keywords
semicircle
along
cut
central point
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63327046A
Inventor
Hirotoshi Watanabe
Kazumasa Yoshima
Original Assignee
Shin Meiwa Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Meiwa Ind Co Ltd filed Critical Shin Meiwa Ind Co Ltd
Priority to JP63327046A priority Critical patent/JPH02169194A/en
Publication of JPH02169194A publication Critical patent/JPH02169194A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE:To obtain a hole of high quality by moving an end effector along a curve having a prescribed shape connected smoothly to the closed figure and then, performing drilling on a work. CONSTITUTION:The respective teaching data on the central point P and the radius R are read out from a memory. The position of a point Q separated by distance R in the prescribed direction from the central point P is obtained by operation and the position and shape of a semicircle S with the two points P and Q as both end points are specified. When the semicircle S is specified, a laser beam torch is positioned toward the central point P and then, moved from the central point P to the shifting point Q along the semicircle S. The work is cut, namely, the hole H is cut off along a circle C by moving the torch by 360 deg. along the semicircle S while irradiating the work with laser beam. By this method, the cut surface of the cut-off hole H is smoothed without changing suddenly the mobile direction of the torch and generating vibration.
JP63327046A 1988-12-23 1988-12-23 Method for cutting hole Pending JPH02169194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63327046A JPH02169194A (en) 1988-12-23 1988-12-23 Method for cutting hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63327046A JPH02169194A (en) 1988-12-23 1988-12-23 Method for cutting hole

Publications (1)

Publication Number Publication Date
JPH02169194A true JPH02169194A (en) 1990-06-29

Family

ID=18194706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63327046A Pending JPH02169194A (en) 1988-12-23 1988-12-23 Method for cutting hole

Country Status (1)

Country Link
JP (1) JPH02169194A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5856649A (en) * 1994-02-25 1999-01-05 Fanuc Ltd. Laser beam machine
WO2003073810A1 (en) * 2002-02-21 2003-09-04 Siemens Aktiengesellschaft Method for boring holes in a substrate, especially an electrical circuit substrate, by means of a laser beam
JP2010017746A (en) * 2008-07-11 2010-01-28 Mitsui Seiki Kogyo Co Ltd Cover for dust prevention in 5-axis laser processing system
JP2010017745A (en) * 2008-07-11 2010-01-28 Mitsui Seiki Kogyo Co Ltd 5-axis laser processing system
US7897893B2 (en) 2002-05-11 2011-03-01 Hitachi Via Mechanics, Ltd. Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam
EP2484478A2 (en) * 2011-02-07 2012-08-08 LPKF Laser & Electronics AG Method for creating an opening through a substrate
JP2015202523A (en) * 2014-04-10 2015-11-16 株式会社安川電機 Teaching system, robot system and teaching method
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
JP2016153142A (en) * 2004-08-04 2016-08-25 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
WO2019003513A1 (en) * 2017-06-29 2019-01-03 パナソニックIpマネジメント株式会社 Laser machining system and method for controlling laser machining system

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5856649A (en) * 1994-02-25 1999-01-05 Fanuc Ltd. Laser beam machine
WO2003073810A1 (en) * 2002-02-21 2003-09-04 Siemens Aktiengesellschaft Method for boring holes in a substrate, especially an electrical circuit substrate, by means of a laser beam
US7897893B2 (en) 2002-05-11 2011-03-01 Hitachi Via Mechanics, Ltd. Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam
KR101067078B1 (en) * 2002-11-05 2011-09-22 히다치 비아 메카닉스 가부시키가이샤 Method for boring holes in a substrate, especially in an electrical circuit substrate, by means of a laser beam
JP2016153142A (en) * 2004-08-04 2016-08-25 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP2010017746A (en) * 2008-07-11 2010-01-28 Mitsui Seiki Kogyo Co Ltd Cover for dust prevention in 5-axis laser processing system
JP2010017745A (en) * 2008-07-11 2010-01-28 Mitsui Seiki Kogyo Co Ltd 5-axis laser processing system
EP2484478A2 (en) * 2011-02-07 2012-08-08 LPKF Laser & Electronics AG Method for creating an opening through a substrate
EP2484478A3 (en) * 2011-02-07 2014-08-20 LPKF Laser & Electronics AG Method for creating an opening through a substrate
JP2015202523A (en) * 2014-04-10 2015-11-16 株式会社安川電機 Teaching system, robot system and teaching method
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
WO2019003513A1 (en) * 2017-06-29 2019-01-03 パナソニックIpマネジメント株式会社 Laser machining system and method for controlling laser machining system

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